by chemical means only

Industry

CPC
H01L2224/03614

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/03614by chemical means only

Industries

Patents Grantslast 30 patents

Information Patent Grant
Process flow for fabrication of cap metal over top metal with sinte...
- Patent number 12,159,846
- Issue date Dec 3, 2024
- Texas Instruments Incorporated
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure and method
- Patent number 12,154,876
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 12,136,602
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with redistribution plugs
- Patent number 12,112,978
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
OLED display panel and manufacturing method thereof
- Patent number 12,108,636
- Issue date Oct 1, 2024
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Jia Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 12,100,679
- Issue date Sep 24, 2024
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming semiconductor struct...
- Patent number 12,100,677
- Issue date Sep 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and method of manufacturing same
- Patent number 12,074,126
- Issue date Aug 27, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor packages including the same
- Patent number 12,040,294
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer and integrated circuit including redistributio...
- Patent number 12,021,046
- Issue date Jun 25, 2024
- STMicroelectronics S.r.l.
- Paolo Colpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 12,014,999
- Issue date Jun 18, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Semiconductor structures with via openings and methods of making th...
- Patent number 11,990,431
- Issue date May 21, 2024
- Pep Innovation PTE Ltd.
- Hwee Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including a terminal pad associated with a conductive tra...
- Patent number 11,967,572
- Issue date Apr 23, 2024
- Micron Technology, Inc.
- Travis M. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly including an airgap containing bonding-level dielec...
- Patent number 11,948,902
- Issue date Apr 2, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with slanted conductive...
- Patent number 11,935,850
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon photonic interposer with two metal redistribution layers
- Patent number 11,923,327
- Issue date Mar 5, 2024
- Rockley Photonics Limited
- Michael Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and method for manufacturing the same, and display...
- Patent number 11,901,375
- Issue date Feb 13, 2024
- ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Yongbo Ju
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Array substrate, method for fabricating same, and display device
- Patent number 11,869,904
- Issue date Jan 9, 2024
- SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Xiaobo Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,830,832
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
- Patent number 11,824,026
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including buffer layer
- Patent number 11,810,879
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure, redistribution layer (RDL) structure, and...
- Patent number 11,798,904
- Issue date Oct 24, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure containing pre-polymerized protective layer...
- Patent number 11,776,922
- Issue date Oct 3, 2023
- SanDisk Technologies LLC
- Hajime Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display backboard and manufacturing method thereof and display device
- Patent number 11,764,343
- Issue date Sep 19, 2023
- BOE Technology Group Co., Ltd.
- Zhiwei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 11,749,635
- Issue date Sep 5, 2023
- SK hynix Inc.
- Nam Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor and semiconductor device
- Patent number 11,749,622
- Issue date Sep 5, 2023
- SUMITOMO DEVICE INNOVATIONS, INC.
- Chihoko Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 11,742,305
- Issue date Aug 29, 2023
- Lapis Semiconductor Co., Ltd.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 11,728,296
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Interconnect Structure and Method
- Publication number 20240395748
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL
- Publication number 20240387419
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Pawel Mrozek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM STRUCTURE FOR BOND PAD
- Publication number 20240387424
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Julie Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDE-EXPOSED EMBEDDED TRACE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379504
- Publication date Nov 14, 2024
- Zhuhai YUEXIN Semiconductor Limited Liability Company
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH CONDUCTIVE POSTS HAVING ROUGH SIDEWALLS
- Publication number 20240363570
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jose Daniel Carlos Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING LOW-K DIELECTRIC MA...
- Publication number 20240332227
- Publication date Oct 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20240297133
- Publication date Sep 5, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY INCLUDING TERMINAL PADS ASSOCIATED WITH CONDUCTIVE TRACES...
- Publication number 20240258256
- Publication date Aug 1, 2024
- Micron Technology, Inc.
- Travis M. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240243152
- Publication date Jul 18, 2024
- SK HYNIX INC.
- Jeong Mook CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BONDING PADS AND METHOD FOR FABRICAT...
- Publication number 20240243081
- Publication date Jul 18, 2024
- SK HYNIX INC.
- Byung Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTLY BONDED METAL STRUCTURES HAVING ALUMINUM FEATURES AND METHO...
- Publication number 20240222315
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Efficient Integration of a First Substrate without Solder Bumps wit...
- Publication number 20240128209
- Publication date Apr 18, 2024
- Newport Fab, LLC dba Tower Semiconductor Newport Beach
- Edward Preisler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240096848
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH THIN FILM RESISTER STRUCTURE
- Publication number 20240047510
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Tsung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20240030187
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230411233
- Publication date Dec 21, 2023
- RENESAS ELECTRONICS CORPORATION
- Tatsuya USAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY BACKBOARD AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE
- Publication number 20230378414
- Publication date Nov 23, 2023
- BOE TECHNOLOGY GROUP CO., LTD.
- Zhiwei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH A POROUS STRUCTURE
- Publication number 20230369243
- Publication date Nov 16, 2023
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...
- Publication number 20230352351
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- PEI-LUM MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...
- Publication number 20230352418
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR PHOTOR...
- Publication number 20230340686
- Publication date Oct 26, 2023
- LAM RESEARCH CORPORATION
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
EXPANSION CONTROLLED STRUCTURE FOR DIRECT BONDING AND METHOD OF FOR...
- Publication number 20230343734
- Publication date Oct 26, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPROACH TO PREVENT PLATING AT V-GROOVE ZONE IN PHOTONICS SILICON D...
- Publication number 20230314735
- Publication date Oct 5, 2023
- Intel Corporation
- Santosh SHAW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE OF POWER SEMICONDUCTOR AND MANUFACUT...
- Publication number 20230299026
- Publication date Sep 21, 2023
- Magnachip Semiconductor, Ltd.
- Myungho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
- Publication number 20230275052
- Publication date Aug 31, 2023
- Samsung Electronics Co., Ltd.
- JU-IL CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20230253350
- Publication date Aug 10, 2023
- VueReal Inc.
- GHOLAMREZA CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLOTTED BOND PAD IN STACKED WAFER STRUCTURE
- Publication number 20230245987
- Publication date Aug 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK BONDING PAD STRUCTURE FOR WIRE BOND STRESS REDUCTION
- Publication number 20230238341
- Publication date Jul 27, 2023
- STMicroelectronics Pte Ltd
- Churn Weng YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20230230945
- Publication date Jul 20, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING SAME
- Publication number 20230207501
- Publication date Jun 29, 2023
- Changxin Memory Technologies, Inc.
- Liang WANG
- H01 - BASIC ELECTRIC ELEMENTS

by chemical means only

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Process flow for fabrication of cap metal over top metal with sinte...

Semiconductor interconnect structure and method

Method of fabricating a semiconductor device

Method for fabricating semiconductor device with redistribution plugs

OLED display panel and manufacturing method thereof

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Semiconductor structure and method for forming semiconductor struct...

Methods and devices for fabricating and assembling printable semico...

Semiconductor structure and method of manufacturing same

Semiconductor devices and semiconductor packages including the same

Redistribution layer and integrated circuit including redistributio...

Integration and bonding of micro-devices into system substrate

Multiple plated via arrays of different wire heights on a same subs...

Semiconductor structures with via openings and methods of making th...

Apparatus including a terminal pad associated with a conductive tra...

Bonded assembly including an airgap containing bonding-level dielec...

Method for fabricating semiconductor device with slanted conductive...

Silicon photonic interposer with two metal redistribution layers

Array substrate and method for manufacturing the same, and display...

Array substrate, method for fabricating same, and display device

Semiconductor structure and manufacturing method thereof

Connector structure and method of forming same

Semiconductor structure including buffer layer

Semiconductor structure, redistribution layer (RDL) structure, and...

Semiconductor structure containing pre-polymerized protective layer...

Display backboard and manufacturing method thereof and display device

Semiconductor device and manufacturing method of semiconductor device

Field effect transistor and semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Interconnect structure and method of forming same

Patents Applicationslast 30 patents

Semiconductor Interconnect Structure and Method

DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL

FILM STRUCTURE FOR BOND PAD

SIDE-EXPOSED EMBEDDED TRACE SUBSTRATE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUITS WITH CONDUCTIVE POSTS HAVING ROUGH SIDEWALLS

SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING LOW-K DIELECTRIC MA...

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

ASSEMBLY INCLUDING TERMINAL PADS ASSOCIATED WITH CONDUCTIVE TRACES...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE INCLUDING BONDING PADS AND METHOD FOR FABRICAT...

DIRECTLY BONDED METAL STRUCTURES HAVING ALUMINUM FEATURES AND METHO...

Efficient Integration of a First Substrate without Solder Bumps wit...

INTEGRATED CIRCUIT PACKAGE AND METHOD

INTEGRATED CIRCUIT WITH THIN FILM RESISTER STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY BACKBOARD AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE

SEMICONDUCTOR STRUCTURE WITH A POROUS STRUCTURE

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...

SEMICONDUCTOR DIE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...

ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR PHOTOR...

EXPANSION CONTROLLED STRUCTURE FOR DIRECT BONDING AND METHOD OF FOR...

APPROACH TO PREVENT PLATING AT V-GROOVE ZONE IN PHOTONICS SILICON D...

WAFER LEVEL CHIP SCALE PACKAGE OF POWER SEMICONDUCTOR AND MANUFACUT...

SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

SLOTTED BOND PAD IN STACKED WAFER STRUCTURE

THICK BONDING PAD STRUCTURE FOR WIRE BOND STRESS REDUCTION

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING SAME