-
3D IC method and device
-
Patent number 11,515,202
-
Issue date Nov 29, 2022
-
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
-
Paul M. Enquist
-
H01 - BASIC ELECTRIC ELEMENTS
-
3D IC method and device
-
Patent number 11,289,372
-
Issue date Mar 29, 2022
-
INVENSAS BONDING TECHNOLOGIES, INC.
-
Paul M. Enquist
-
H01 - BASIC ELECTRIC ELEMENTS
-
3D IC method and device
-
Patent number 11,011,418
-
Issue date May 18, 2021
-
INVENSAS BONDING TECHNOLOGIES, INC.
-
Paul M. Enquist
-
H01 - BASIC ELECTRIC ELEMENTS
-
3D IC method and device
-
Patent number 10,147,641
-
Issue date Dec 4, 2018
-
INVENSAS BONDING TECHNOLOGIES, INC.
-
Paul M. Enquist
-
H01 - BASIC ELECTRIC ELEMENTS
-
3D IC method and device
-
Patent number 9,716,033
-
Issue date Jul 25, 2017
-
ZIPTRONIX, INC.
-
Paul M. Enquist
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
3D IC method and device
-
Patent number 9,171,756
-
Issue date Oct 27, 2015
-
Ziptronix, Inc.
-
Paul M. Enquist
-
H01 - BASIC ELECTRIC ELEMENTS
-
3D IC method and device
-
Patent number 9,130,021
-
Issue date Sep 8, 2015
-
Ziptronix, Inc.
-
Paul M. Enquist
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
3D IC method and device
-
Patent number 8,709,938
-
Issue date Apr 29, 2014
-
Ziptronix, Inc.
-
Paul M. Enquist
-
H01 - BASIC ELECTRIC ELEMENTS
-
3D IC method and device
-
Patent number 8,389,378
-
Issue date Mar 5, 2013
-
Ziptronix, Inc.
-
Paul M. Enquist
-
H01 - BASIC ELECTRIC ELEMENTS
-
3D IC method and device
-
Patent number 7,485,968
-
Issue date Feb 3, 2009
-
Ziptronix, Inc.
-
Paul M. Enquist
-
H01 - BASIC ELECTRIC ELEMENTS