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Patents Grantslast 30 patents

  • Information Patent Grant

    3D IC method and device

    • Patent number 11,515,202
    • Issue date Nov 29, 2022
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3D IC method and device

    • Patent number 11,289,372
    • Issue date Mar 29, 2022
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3D IC method and device

    • Patent number 11,011,418
    • Issue date May 18, 2021
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3D IC method and device

    • Patent number 10,147,641
    • Issue date Dec 4, 2018
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3D IC method and device

    • Patent number 9,716,033
    • Issue date Jul 25, 2017
    • ZIPTRONIX, INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device, electronic device, and semiconductor device m...

    • Patent number 9,412,715
    • Issue date Aug 9, 2016
    • Fujitsu Limited
    • Kozo Shimizu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3D IC method and device

    • Patent number 9,171,756
    • Issue date Oct 27, 2015
    • Ziptronix, Inc.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3D IC method and device

    • Patent number 9,130,021
    • Issue date Sep 8, 2015
    • Ziptronix, Inc.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device, electronic device, and semiconductor device m...

    • Patent number 8,901,751
    • Issue date Dec 2, 2014
    • Fujitsu Limited
    • Kozo Shimizu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3D IC method and device

    • Patent number 8,709,938
    • Issue date Apr 29, 2014
    • Ziptronix, Inc.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3D IC method and device

    • Patent number 8,389,378
    • Issue date Mar 5, 2013
    • Ziptronix, Inc.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3D IC method and device

    • Patent number 7,485,968
    • Issue date Feb 3, 2009
    • Ziptronix, Inc.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents