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H01L2224/83031
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/83031
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Patents Grants
last 30 patents
Information
Patent Grant
Processed stacked dies
Patent number
12,068,278
Issue date
Aug 20, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of reducing semiconductor substrate surface unevenness
Patent number
11,901,186
Issue date
Feb 13, 2024
Massachusetts Institute of Technology
Li Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for preparing a surface for direct-bonding
Patent number
11,804,377
Issue date
Oct 31, 2023
Adeia Semiconductor Bonding Technologies, Inc.
Jeremy Alfred Theil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dielectric-dielectric and metallization bonding via plasma activati...
Patent number
11,735,689
Issue date
Aug 22, 2023
Meta Platforms Technologies, LLC
Daniel Brodoceanu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Processed stacked dies
Patent number
11,652,083
Issue date
May 16, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Employing deformable contacts and pre-applied underfill for bonding...
Patent number
11,575,069
Issue date
Feb 7, 2023
Meta Platforms Technologies, LLC
Daniel Brodoceanu
G02 - OPTICS
Information
Patent Grant
Curing pre-applied and plasma-etched underfill via a laser
Patent number
11,563,142
Issue date
Jan 24, 2023
Meta Platforms Technologies, LLC
Daniel Brodoceanu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selectively bonding light-emitting devices via a pulsed laser
Patent number
11,557,692
Issue date
Jan 17, 2023
Meta Platforms Technologies, LLC
Daniel Brodoceanu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device and its process for curing post-applied underfill ma...
Patent number
11,404,600
Issue date
Aug 2, 2022
Meta Platforms Technologies, LLC
Jeb Wu
G02 - OPTICS
Information
Patent Grant
Dielectric-dielectric and metallization bonding via plasma activati...
Patent number
11,374,148
Issue date
Jun 28, 2022
Facebook Technologies, LLC
Daniel Brodoceanu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for bonding substrates
Patent number
11,309,278
Issue date
Apr 19, 2022
Applied Materials, Inc.
Prayudi Lianto
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding surfaces for microelectronics
Patent number
11,056,348
Issue date
Jul 6, 2021
INVENSAS BONDING TECHNOLOGIES, INC.
Jeremy Alfred Theil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Processed stacked dies
Patent number
10,879,212
Issue date
Dec 29, 2020
INVENSAS BONDING TECHNOLOGIES, INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging method and integrated packaged circuit
Patent number
10,867,959
Issue date
Dec 15, 2020
Shenzhen Xiuyuan Electronic Technology Co., Ltd
Chuan Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip wiring method and structure
Patent number
10,847,496
Issue date
Nov 24, 2020
SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
Chuan Hu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding system
Patent number
10,840,213
Issue date
Nov 17, 2020
Tokyo Electron Limited
Masataka Matsunaga
B32 - LAYERED PRODUCTS
Information
Patent Grant
Wafer to wafer bonding method and wafer to wafer bonding system
Patent number
10,811,381
Issue date
Oct 20, 2020
Samsung Electronics Co., Ltd.
Joon-Ho Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of manufacturing RF filters
Patent number
10,636,776
Issue date
Apr 28, 2020
GLOBALFOUNDRIES Inc.
Md. Sayed Kaysar Bin Rahim
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Bonding systems
Patent number
10,340,248
Issue date
Jul 2, 2019
Tokyo Electron Limited
Masataka Matsunaga
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Method for low temperature bonding and bonded structure
Patent number
10,312,217
Issue date
Jun 4, 2019
INVENSAS BONDING TECHNOLOGIES, INC.
Qin-Yi Tong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded semiconductor wafer and method for manufacturing bonded semi...
Patent number
10,283,401
Issue date
May 7, 2019
Shin-Etsu Handotai Co., Ltd.
Osamu Ishikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of bonding semiconductor substrates
Patent number
10,141,284
Issue date
Nov 27, 2018
Imec VZW
Soon-Wook Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for obtaining a bonding surface for direct bonding
Patent number
10,032,742
Issue date
Jul 24, 2018
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Lamine Benaissa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer bonding using boron and nitrogen based bonding stack
Patent number
9,640,514
Issue date
May 2, 2017
GLOBALFOUNDRIES Inc.
Wei Lin
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PROCESSED STACKED DIES
Publication number
20240404990
Publication date
Dec 5, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PREPARING A SURFACE FOR DIRECT-BONDING
Publication number
20240234159
Publication date
Jul 11, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Jeremy Alfred Theil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PREPARING A SURFACE FOR DIRECT-BONDING
Publication number
20240136196
Publication date
Apr 25, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Jeremy Alfred Theil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE OBTAINED BY THE SAME
Publication number
20240030180
Publication date
Jan 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Zheng-Yong LIANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESSED STACKED DIES
Publication number
20230282610
Publication date
Sep 7, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING SURFACES FOR MICROELECTRONICS
Publication number
20210287910
Publication date
Sep 16, 2021
INVENSAS BONDING TECHNOLOGIES, INC.
Jeremy Alfred THEIL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CURING PRE-APPLIED AND PLASMA-ETCHED UNDERFILL VIA A LASER
Publication number
20200395519
Publication date
Dec 17, 2020
Daniel Brodoceanu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVELY BONDING LIGHT-EMITTING DEVICES VIA A PULSED LASER
Publication number
20200395521
Publication date
Dec 17, 2020
Facebook Technologies, LLC
Daniel Brodoceanu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATI...
Publication number
20200395520
Publication date
Dec 17, 2020
Facebook Technologies, LLC
Daniel Brodoceanu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF REDUCING SEMICONDUCTOR SUBSTRATE SURFACE UNEVENNESS
Publication number
20200388501
Publication date
Dec 10, 2020
Massachusetts Institute of Technology
Li Zhang
B24 - GRINDING POLISHING
Information
Patent Application
METHODS FOR BONDING SUBSTRATES
Publication number
20200135690
Publication date
Apr 30, 2020
Applied Materials, Inc.
PRAYUDI LIANTO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WAFER TO WAFER BONDING METHOD AND WAFER TO WAFER BONDING SYSTEM
Publication number
20200043884
Publication date
Feb 6, 2020
Samsung Electronics Co., Ltd.
JOON-HO LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING SURFACES FOR MICROELECTRONICS
Publication number
20190311911
Publication date
Oct 10, 2019
INVENSAS BONDING TECHNOLOGIES, INC.
Jeremy Alfred THEIL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chip Wiring Method and Structure
Publication number
20190295982
Publication date
Sep 26, 2019
SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
Chuan HU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING BONDED SEMI...
Publication number
20180033681
Publication date
Feb 1, 2018
Shin-Etsu Handotai Co., Ltd.
Osamu ISHIKAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING SYSTEM
Publication number
20180019226
Publication date
Jan 18, 2018
TOKYO ELECTRON LIMITED
Masataka MATSUNAGA
B32 - LAYERED PRODUCTS
Information
Patent Application
Bonding System
Publication number
20180019225
Publication date
Jan 18, 2018
TOKYO ELECTRON LIMITED
Masataka MATSUNAGA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF BONDING SEMICONDUCTOR SUBSTRATES
Publication number
20170301646
Publication date
Oct 19, 2017
IMEC vzw
Soon-Wook Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER PLANARIZATION METHOD
Publication number
20170040285
Publication date
Feb 9, 2017
STMicroelectronics (Crolles 2) SAS
Francois Guyader
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD FOR MANUFACTURIN...
Publication number
20170012022
Publication date
Jan 12, 2017
FUJIFILM CORPORATION
Kenta YOSHIDA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
Publication number
20160322328
Publication date
Nov 3, 2016
ZIPTRONIX, INC.
Qin-Yi Tong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR OBTAINING A BONDING SURFACE FOR DIRECT BONDING
Publication number
20150364442
Publication date
Dec 17, 2015
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Lamine BENAISSA
H01 - BASIC ELECTRIC ELEMENTS