by chemical or physical modification of a pre-existing or pre-deposited material

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/035by chemical or physical modification of a pre-existing or pre-deposited material

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Patents Grantslast 30 patents

Information Patent Grant
Process flow for fabrication of cap metal over top metal with sinte...
- Patent number 12,159,846
- Issue date Dec 3, 2024
- Texas Instruments Incorporated
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 12,132,016
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanent connection of two metal surfaces
- Patent number 12,107,057
- Issue date Oct 1, 2024
- EV Group E. Thallner GmbH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming microwave tunable composited thin-film dielectr...
- Patent number 12,048,948
- Issue date Jul 30, 2024
- Applied Materials, Inc.
- Yueh Sheng Ow
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Oxidation and corrosion prevention in semiconductor devices and sem...
- Patent number 12,051,661
- Issue date Jul 30, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Srinivasa Reddy Yeduru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 12,040,293
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for registration of circuit dies and electrical interconnects
- Patent number 12,020,951
- Issue date Jun 25, 2024
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 11,990,430
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming brass-coated metals in flip-chip redistribution l...
- Patent number 11,984,418
- Issue date May 14, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for controlling trapped ions and method of manufacturing the...
- Patent number 11,984,416
- Issue date May 14, 2024
- Infineon Technologies Austria AG
- Clemens Roessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bump structure and manufacturing method thereof and driving s...
- Patent number 11,715,715
- Issue date Aug 1, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive manufacturing of a frontside or backside interconnect of a...
- Patent number 11,688,713
- Issue date Jun 27, 2023
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 11,502,050
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,495,557
- Issue date Nov 8, 2022
- Advanced Semiconductor Engineering, Inc.
- Jhao-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures of semiconductor devices
- Patent number 11,444,045
- Issue date Sep 13, 2022
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ramasamy Chockalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector formation methods and packaged semiconductor devices
- Patent number 11,424,199
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad layer system, gas sensor and method for manufacturing a...
- Patent number 11,407,635
- Issue date Aug 9, 2022
- Robert Bosch GmbH
- Andreas Scheurle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Solar cell and method of manufacturing the same
- Patent number 11,404,597
- Issue date Aug 2, 2022
- MATERIAL CONCEPT, INC.
- Junichi Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IR assisted fan-out wafer level packaging using silicon handler
- Patent number 11,348,833
- Issue date May 31, 2022
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanent connection of two metal surfaces
- Patent number 11,282,801
- Issue date Mar 22, 2022
- EV Group E. Thallner GmbH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding corners of light emitting diode chip to substrate using laser
- Patent number 11,255,529
- Issue date Feb 22, 2022
- Facebook Technologies, LLC
- Jeb Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a photoresist over a bond pad to mitigate bond pa...
- Patent number 11,222,857
- Issue date Jan 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 10,916,517
- Issue date Feb 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures with porous networks for solder connections, and...
- Patent number 10,849,240
- Issue date Nov 24, 2020
- Invensas Corporation
- Liang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming solder bumps
- Patent number 10,840,202
- Issue date Nov 17, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps
- Patent number 10,833,035
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps
- Patent number 10,797,011
- Issue date Oct 6, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a silver sintering agent having silver oxide s...
- Patent number 10,785,877
- Issue date Sep 22, 2020
- Heraeus Deutschland GmbH & Co. KG
- Michael Schäfer
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Ag underlayer-attached metallic member, Ag underlayer-attached insu...
- Patent number 10,734,297
- Issue date Aug 4, 2020
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package with resilient conductive paste post and...
- Patent number 10,685,943
- Issue date Jun 16, 2020
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
- Publication number 20240421109
- Publication date Dec 19, 2024
- EV GROUP E. THALLNER GMBH
- Viorel Dragio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDATION AND CORROSION PREVENTION IN SEMICONDUCTOR DEVICES AND SEM...
- Publication number 20240387425
- Publication date Nov 21, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Srinivasa Reddy YEDURU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE INTERCONNECT AND MANUFACTURING METHOD...
- Publication number 20240387427
- Publication date Nov 21, 2024
- NEXPERIA B.V.
- Siu Lung Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
- Publication number 20240371804
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY FOR METAL UNDERCUT REDUCTION
- Publication number 20240290735
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- RAFAEL JOSE GUEVARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS
- Publication number 20240282592
- Publication date Aug 22, 2024
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR CONTROLLING TRAPPED IONS
- Publication number 20240213193
- Publication date Jun 27, 2024
- Infineon Technologies Austria AG
- Clemens Roessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Producing A Solder Contact Surface On A Chip By Producin...
- Publication number 20240203913
- Publication date Jun 20, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC PACKAGE
- Publication number 20240096835
- Publication date Mar 21, 2024
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING AND TRANSFERRING METHOD FOR DIE PACKAGE STRUCTURES
- Publication number 20240072033
- Publication date Feb 29, 2024
- INGENTEC CORPORATION
- Hsiao Lu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
- Publication number 20230387051
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer Metallic Structure and Method
- Publication number 20230072507
- Publication date Mar 9, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih Wei BIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20230061418
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- YONGBUM KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230027674
- Publication date Jan 26, 2023
- Advanced Semiconductor Engineering, Inc.
- Jhao-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME, SEMICONDUCTOR...
- Publication number 20230005851
- Publication date Jan 5, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Kai TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDATION AND CORROSION PREVENTION IN SEMICONDUCTOR DEVICES AND SEM...
- Publication number 20220328434
- Publication date Oct 13, 2022
- Semiconductor Components Industries, LLC
- Srinivasa Reddy YEDURU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structures of Integrated Circuit Devices and Method Forming...
- Publication number 20220238466
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF AND DRIVING S...
- Publication number 20220238471
- Publication date Jul 28, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS
- Publication number 20220189790
- Publication date Jun 16, 2022
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR CONTROLLING TRAPPED IONS AND METHOD OF MANUFACTURING THE...
- Publication number 20220102301
- Publication date Mar 31, 2022
- Infineon Technologies Austria AG
- Clemens Roessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF SEMICONDUCTOR DEVICES
- Publication number 20220052000
- Publication date Feb 17, 2022
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- RAMASAMY CHOCKALINGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210296267
- Publication date Sep 23, 2021
- Advanced Semiconductor Engineering, Inc.
- Jhao-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PHOTORESIST OVER A BOND PAD TO MITIGATE BOND PA...
- Publication number 20210265291
- Publication date Aug 26, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer Metallic Structure and Method
- Publication number 20210159196
- Publication date May 27, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih Wei BIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FLOW FOR FABRICATION OF CAP METAL OVER TOP METAL WITH SINTE...
- Publication number 20210005560
- Publication date Jan 7, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD LAYER SYSTEM, GAS SENSOR AND METHOD FOR MANUFACTURING A...
- Publication number 20200140261
- Publication date May 7, 2020
- ROBERT BOSCH GmbH
- Andreas Scheurle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Redistribution Layer Metallic Structure and Method
- Publication number 20200144208
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih Wei BIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Semiconductor Component and Method of Fabrica...
- Publication number 20200111759
- Publication date Apr 9, 2020
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER
- Publication number 20200098638
- Publication date Mar 26, 2020
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer Metallic Structure and Method
- Publication number 20190304939
- Publication date Oct 3, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih Wei BIH
- H01 - BASIC ELECTRIC ELEMENTS

by chemical or physical modification of a pre-existing or pre-deposited material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Process flow for fabrication of cap metal over top metal with sinte...

Bonding structures of integrated circuit devices and method forming...

Method for permanent connection of two metal surfaces

Methods for forming microwave tunable composited thin-film dielectr...

Oxidation and corrosion prevention in semiconductor devices and sem...

Redistribution layer metallic structure and method

Methods for registration of circuit dies and electrical interconnects

Bonding structures of integrated circuit devices and method forming...

Method of forming brass-coated metals in flip-chip redistribution l...

Device for controlling trapped ions and method of manufacturing the...

Metal bump structure and manufacturing method thereof and driving s...

Additive manufacturing of a frontside or backside interconnect of a...

Redistribution layer metallic structure and method

Semiconductor device and method of manufacturing the same

Bonding structures of semiconductor devices

Connector formation methods and packaged semiconductor devices

Bonding pad layer system, gas sensor and method for manufacturing a...

Solar cell and method of manufacturing the same

IR assisted fan-out wafer level packaging using silicon handler

Method for permanent connection of two metal surfaces

Bonding corners of light emitting diode chip to substrate using laser

Method of forming a photoresist over a bond pad to mitigate bond pa...

Redistribution layer metallic structure and method

Contact structures with porous networks for solder connections, and...

Method of forming solder bumps

Method of forming solder bumps

Method of forming solder bumps

Method for producing a silver sintering agent having silver oxide s...

Ag underlayer-attached metallic member, Ag underlayer-attached insu...

Semiconductor chip package with resilient conductive paste post and...

Patents Applicationslast 30 patents

METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES

OXIDATION AND CORROSION PREVENTION IN SEMICONDUCTOR DEVICES AND SEM...

SEMICONDUCTOR DEVICE PACKAGE INTERCONNECT AND MANUFACTURING METHOD...

BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...

ALLOY FOR METAL UNDERCUT REDUCTION

METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS

DEVICE FOR CONTROLLING TRAPPED IONS

Method For Producing A Solder Contact Surface On A Chip By Producin...

MANUFACTURING METHOD OF ELECTRONIC PACKAGE

BONDING AND TRANSFERRING METHOD FOR DIE PACKAGE STRUCTURES

BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...

Redistribution Layer Metallic Structure and Method

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME, SEMICONDUCTOR...

OXIDATION AND CORROSION PREVENTION IN SEMICONDUCTOR DEVICES AND SEM...

Bonding Structures of Integrated Circuit Devices and Method Forming...

METAL BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF AND DRIVING S...

METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS

DEVICE FOR CONTROLLING TRAPPED IONS AND METHOD OF MANUFACTURING THE...

BONDING STRUCTURES OF SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF FORMING A PHOTORESIST OVER A BOND PAD TO MITIGATE BOND PA...

Redistribution Layer Metallic Structure and Method

PROCESS FLOW FOR FABRICATION OF CAP METAL OVER TOP METAL WITH SINTE...

BONDING PAD LAYER SYSTEM, GAS SENSOR AND METHOD FOR MANUFACTURING A...

Redistribution Layer Metallic Structure and Method

Semiconductor Device, Semiconductor Component and Method of Fabrica...

IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER

Redistribution Layer Metallic Structure and Method