by connecting a bonding area directly to another bonding area, i.e. connectorless bonding

Industry

CPC
H01L2224/80001

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80001by connecting a bonding area directly to another bonding area, i.e. connectorless bonding

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods of fabricating the same die stack structure and semiconduct...
- Patent number 12,119,328
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing a pillar contact between...
- Patent number 12,108,597
- Issue date Oct 1, 2024
- SanDisk Technologies LLC
- Teruo Okina
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package including test pad and bonding pad structure...
- Patent number 12,094,844
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages
- Patent number 12,087,757
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package structure
- Patent number 12,087,755
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device and method for forming the same
- Patent number 12,082,407
- Issue date Sep 3, 2024
- Yangtze Memory Technologies Co., Ltd.
- Yuancheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package structure
- Patent number 12,080,702
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including neighboring die contact and seal ri...
- Patent number 12,068,262
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,021,073
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Juhyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack structure, semiconductor structure and method of fabricat...
- Patent number 12,015,013
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,942,463
- Issue date Mar 26, 2024
- Samsung Electronics Co., Ltd.
- Hyun Mog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 11,942,454
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 11,855,042
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with air gap
- Patent number 11,830,837
- Issue date Nov 28, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,769,744
- Issue date Sep 26, 2023
- Kioxia Corporation
- Yuji Setta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency front end (RFFE) hetero-integration
- Patent number 11,749,746
- Issue date Sep 5, 2023
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,749,565
- Issue date Sep 5, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,735,576
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure with interconnect structure
- Patent number 11,728,273
- Issue date Aug 15, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,728,327
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating LED module
- Patent number 11,728,371
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Jihye Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including test pad and bonding pad structure...
- Patent number 11,728,301
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via design for stacking integrated circuits
- Patent number 11,705,449
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,664,362
- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Hyun Mog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via design for stacking integrated circuits
- Patent number 11,646,308
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding interconnection structure of image sensor semiconductor pac...
- Patent number 11,605,658
- Issue date Mar 14, 2023
- Samsung Electronics Co., Ltd.
- Donghoon Gang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,594,523
- Issue date Feb 28, 2023
- Kioxia Corporation
- Masaru Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding structure and method of fabricating the same
- Patent number 11,562,974
- Issue date Jan 24, 2023
- United Microelectronics Corp.
- Po-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,557,581
- Issue date Jan 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for isolation of bit-line drivers for a three-...
- Patent number 11,538,780
- Issue date Dec 27, 2022
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20240371851
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Neighboring Die Contact Seal Ring a...
- Publication number 20240363554
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Test Pad and Bonding Pad Structure...
- Publication number 20240363565
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20240363609
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240321857
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Juhyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING PACKAGE STRUCTURE
- Publication number 20240297151
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240203939
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240203947
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE WITH INTERCONNECT STRUCTURE
- Publication number 20240170406
- Publication date May 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING THE SAME DIE STACK STRUCTURE AND SEMICONDUCT...
- Publication number 20240021584
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20230352471
- Publication date Nov 2, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Test Pad and Bonding Pad Structure...
- Publication number 20230343736
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ENHANCED BONDING FORCE
- Publication number 20230307418
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ROLE SEMICONDUCTOR DEVICE SUBSTRATES, SEMICONDUCTOR DEVICE AS...
- Publication number 20230282559
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING A PILLAR CONTACT BETWEEN...
- Publication number 20230284443
- Publication date Sep 7, 2023
- SANDISK TECHNOLOGIES LLC
- Teruo OKINA
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20230268333
- Publication date Aug 24, 2023
- Samsung Electronics Co., Ltd.
- Hyun Mog PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING T...
- Publication number 20230260978
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER SEAL RING
- Publication number 20230187294
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230187460
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- DONGHOON GANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHARED PAD/BRIDGE LAYOUT FOR A 3D IC
- Publication number 20230170328
- Publication date Jun 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20230103629
- Publication date Apr 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die, Semiconductor Device and Method for Forming a Se...
- Publication number 20230103023
- Publication date Mar 30, 2023
- Intel Corporation
- Thomas WAGNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods for Forming a Semiconductor Device
- Publication number 20230095162
- Publication date Mar 30, 2023
- Intel Corporation
- Georg SEIDEMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED GLASS CORE PATCH
- Publication number 20230085646
- Publication date Mar 23, 2023
- Jeremy D Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER-CUT LEAD-FRAME FOR INTEGRATED CIRCUIT (IC) PACKAGES
- Publication number 20230063278
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- TIANGE XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230066256
- Publication date Mar 2, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING TEST PAD AND BONDING PAD STRUCTURE...
- Publication number 20230060208
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230067727
- Publication date Mar 2, 2023
- Yangtze Memory Technologies Co., Ltd.
- Yihuan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE IC DIE PACKAGE INCLUDING IC DIE DIRECTLY BONDED TO FRONT...
- Publication number 20230034737
- Publication date Feb 2, 2023
- Intel Corporation
- Junxin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230013176
- Publication date Jan 19, 2023
- Samsung Electronics Co., Ltd.
- Juhyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS

by connecting a bonding area directly to another bonding area, i.e. connectorless bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of fabricating the same die stack structure and semiconduct...

Three-dimensional memory device containing a pillar contact between...

Semiconductor package including test pad and bonding pad structure...

Integrated circuit packages

Method of fabricating package structure

Three-dimensional memory device and method for forming the same

Method of fabricating package structure

Semiconductor package including neighboring die contact and seal ri...

Semiconductor package and method of manufacturing the same

Die stack structure, semiconductor structure and method of fabricat...

Semiconductor devices

Package and manufacturing method thereof

Method of manufacturing semiconductor structure

Semiconductor package with air gap

Semiconductor device and method for manufacturing the same

Radio frequency front end (RFFE) hetero-integration

Semiconductor device and manufacturing method thereof

Integrated circuit package and method

Bonded structure with interconnect structure

Integrated circuit package and method

Method of fabricating LED module

Semiconductor package including test pad and bonding pad structure...

Through silicon via design for stacking integrated circuits

Semiconductor devices

Through silicon via design for stacking integrated circuits

Bonding interconnection structure of image sensor semiconductor pac...

Semiconductor memory device

Hybrid bonding structure and method of fabricating the same

Package structure and method of fabricating the same

Structure and method for isolation of bit-line drivers for a three-...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGES

Semiconductor Package Including Neighboring Die Contact Seal Ring a...

Semiconductor Package Including Test Pad and Bonding Pad Structure...

METHOD OF FABRICATING PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHODS OF FABRICATING PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

PACKAGE AND MANUFACTURING METHOD THEREOF

BONDED STRUCTURE WITH INTERCONNECT STRUCTURE

METHODS OF FABRICATING THE SAME DIE STACK STRUCTURE AND SEMICONDUCT...

INTEGRATED CIRCUIT PACKAGES

Semiconductor Package Including Test Pad and Bonding Pad Structure...

SEMICONDUCTOR PACKAGE WITH ENHANCED BONDING FORCE

MULTI-ROLE SEMICONDUCTOR DEVICE SUBSTRATES, SEMICONDUCTOR DEVICE AS...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING A PILLAR CONTACT BETWEEN...

SEMICONDUCTOR DEVICES

PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING T...

SEMICONDUCTOR WAFER SEAL RING

SEMICONDUCTOR PACKAGE

SHARED PAD/BRIDGE LAYOUT FOR A 3D IC

METHOD OF FABRICATING PACKAGE STRUCTURE

Semiconductor Die, Semiconductor Device and Method for Forming a Se...

Semiconductor Devices and Methods for Forming a Semiconductor Device

EMBEDDED GLASS CORE PATCH

LASER-CUT LEAD-FRAME FOR INTEGRATED CIRCUIT (IC) PACKAGES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING TEST PAD AND BONDING PAD STRUCTURE...

CONTACT STRUCTURE AND METHOD OF FORMING THE SAME

COMPOSITE IC DIE PACKAGE INCLUDING IC DIE DIRECTLY BONDED TO FRONT...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME