by dispensing droplets

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CPC
H01L2224/27318

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/27318by dispensing droplets

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing electronic device
- Patent number 11,742,319
- Issue date Aug 29, 2023
- Innolux Corporation
- Yi-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,626,352
- Issue date Apr 11, 2023
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coating method, coating apparatus and method for manufacturing comp...
- Patent number 11,305,311
- Issue date Apr 19, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Mitsumi Itou
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Circuit package, an electronic circuit package, and methods for enc...
- Patent number 11,189,537
- Issue date Nov 30, 2021
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-LED chips and methods for manufacturing the same and display...
- Patent number 11,081,632
- Issue date Aug 3, 2021
- CHENGDU VISTAR OPTOELECTRONICS CO., LTD.
- Feng Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inkjet adhesive, manufacturing method for semiconductor device, and...
- Patent number 10,961,411
- Issue date Mar 30, 2021
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Metering apparatus
- Patent number 10,946,406
- Issue date Mar 16, 2021
- Marco Systemanalyse und Entwicklung GmbH
- Martin Reuter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coating method, coating apparatus and method for manufacturing comp...
- Patent number 10,906,061
- Issue date Feb 2, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Mitsumi Itou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid top terminal for discrete power devices
- Patent number 10,872,846
- Issue date Dec 22, 2020
- RENESAS ELECTRONICS AMERICA INC.
- Jean Claude Harel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for a semiconductor device having bi-material...
- Patent number 10,784,188
- Issue date Sep 22, 2020
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application mechanism, application apparatus, method for manufactur...
- Patent number 10,751,747
- Issue date Aug 25, 2020
- NTN Corporation
- Akihiro Yamanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly
- Patent number 10,665,565
- Issue date May 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a substrate arrangement, substrate arrangement...
- Patent number 10,622,331
- Issue date Apr 14, 2020
- Heraeus Deutschland GmbH & Co. KG
- Andreas Hinrich
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Conductive paste and die bonding method
- Patent number 10,615,144
- Issue date Apr 7, 2020
- Kaken Tech Co., Ltd.
- Shigeo Hori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electronic-component mounting apparatus
- Patent number 10,568,245
- Issue date Feb 18, 2020
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stack die package
- Patent number 10,546,840
- Issue date Jan 28, 2020
- Vishay SIliconix, LLC
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder paste
- Patent number 10,456,871
- Issue date Oct 29, 2019
- Heraeus Deutschland GmbH & Co. KG
- Sebastian Fritzsche
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fan-out wafer level chip package structure
- Patent number 10,381,268
- Issue date Aug 13, 2019
- Niko Semiconductor Co., Ltd.
- Chih-Cheng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for semiconductor device having bi-material d...
- Patent number 10,366,944
- Issue date Jul 30, 2019
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier and clip each having sinterable, solidified paste for conne...
- Patent number 10,347,566
- Issue date Jul 9, 2019
- Heraeus Deutschland GmbH & Co. KG
- Michael Benedikt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic sandwich structure with two parts joined together by mea...
- Patent number 10,332,858
- Issue date Jun 25, 2019
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-adhesive die
- Patent number 10,312,212
- Issue date Jun 4, 2019
- Texas Instruments Incorporated
- Rongwei Zhang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Package assembly
- Patent number 10,192,848
- Issue date Jan 29, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bonding substrates
- Patent number 10,131,126
- Issue date Nov 20, 2018
- Applied Materials, Inc.
- Kadthala Ramaya Narendrnath
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonding structure and method
- Patent number 9,997,485
- Issue date Jun 12, 2018
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-component mounting apparatus
- Patent number 9,968,020
- Issue date May 8, 2018
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 9,929,124
- Issue date Mar 27, 2018
- EV Group E. Thallner GmbH
- Jurgen Burggraf
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conductive paste and die bonding method
- Patent number 9,818,718
- Issue date Nov 14, 2017
- Kaken Tech Co., Ltd.
- Shigeo Hori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fan-out wafer level chip package structure and manufacturing method...
- Patent number 9,799,563
- Issue date Oct 24, 2017
- Niko Semiconductor Co., Ltd.
- Chih-Cheng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240321809
- Publication date Sep 26, 2024
- STMicroelectronics International N.V.
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230207432
- Publication date Jun 29, 2023
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATING METHOD, COATING APPARATUS AND METHOD FOR MANUFACTURING COMP...
- Publication number 20210107029
- Publication date Apr 15, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- MITSUMI ITOU
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
MICRO-LED CHIPS AND METHODS FOR MANUFACTURING THE SAME AND DISPLAY...
- Publication number 20200251641
- Publication date Aug 6, 2020
- Kunshan New Flat Panel Display Technology Center Co., Ltd.
- Feng ZHAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for a Semiconductor Device Having Bi-Material...
- Publication number 20190304881
- Publication date Oct 3, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATING METHOD, COATING APPARATUS AND METHOD FOR MANUFACTURING COMP...
- Publication number 20190262856
- Publication date Aug 29, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- MITSUMI ITOU
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
APPLICATION MECHANISM, APPLICATION APPARATUS, METHOD FOR MANUFACTUR...
- Publication number 20190060948
- Publication date Feb 28, 2019
- NTN CORPORATION
- Akihiro YAMANAKA
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METERING APPARATUS
- Publication number 20190054491
- Publication date Feb 21, 2019
- MARCO SYSTEMANALYSE UND ENTWICKLUNG GMBH
- Martin Reuter
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES
- Publication number 20180342463
- Publication date Nov 29, 2018
- Intel Corporation
- Taylor GAINES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SANDWICH STRUCTURE WITH TWO PARTS JOINED TOGETHER BY MEA...
- Publication number 20180331065
- Publication date Nov 15, 2018
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SUBSTRATE ARRANGEMENT, SUBSTRATE ARRANGEMENT...
- Publication number 20180286831
- Publication date Oct 4, 2018
- Heraeus Deutschland GmbH & Co. KG
- Andreas HINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES
- Publication number 20180190593
- Publication date Jul 5, 2018
- Intel Corporation
- Taylor GAINES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY
- Publication number 20180012860
- Publication date Jan 11, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Hung-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged IC With Solderable Sidewalls
- Publication number 20170365575
- Publication date Dec 21, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD
- Publication number 20170352635
- Publication date Dec 7, 2017
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC-COMPONENT MOUNTING APPARATUS AND ELECTRONIC-COMPONENT MO...
- Publication number 20170347504
- Publication date Nov 30, 2017
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER LEVEL CHIP PACKAGE STRUCTURE
- Publication number 20170338154
- Publication date Nov 23, 2017
- NIKO SEMICONDUCTOR CO., LTD.
- CHIH-CHENG HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PASTE
- Publication number 20170252873
- Publication date Sep 7, 2017
- Heraeus Deutschland GmbH & Co. KG
- Sebastian FRITZSCHE
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Packaged IC with Solderable Sidewalls
- Publication number 20170162530
- Publication date Jun 8, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING SUBSTRATES
- Publication number 20170117247
- Publication date Apr 27, 2017
- EV GROUP E. THALLNER GMBH
- Jurgen Burggraf
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING SAME
- Publication number 20150287699
- Publication date Oct 8, 2015
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING INDEPENDENT FILM LAYER FOR EMBEDDING...
- Publication number 20150221624
- Publication date Aug 6, 2015
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Ning Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD
- Publication number 20140335660
- Publication date Nov 13, 2014
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING STACK DIE PACKAGE
- Publication number 20140273344
- Publication date Sep 18, 2014
- VISHAY-SILICONIX
- Kyle TERRILL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REACTIVE HOT-MELT ADHESIVE FOR USE ON ELECTRONICS
- Publication number 20140242323
- Publication date Aug 28, 2014
- Albert M. Giorgini
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POWER TRANSISTOR ARRANGEMENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140217596
- Publication date Aug 7, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL
- Publication number 20140131898
- Publication date May 15, 2014
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BONDING SUBSTRATES
- Publication number 20140099485
- Publication date Apr 10, 2014
- Kadthala Ramaya NARENDRNATH
- B32 - LAYERED PRODUCTS
Information Patent Application
Package-In-Packages and Methods of Formation Thereof
- Publication number 20140001615
- Publication date Jan 2, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING SAME
- Publication number 20130334706
- Publication date Dec 19, 2013
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS

by dispensing droplets

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing electronic device

Semiconductor device and method for manufacturing the same

Alternative compositions for high temperature soldering applications

Coating method, coating apparatus and method for manufacturing comp...

Circuit package, an electronic circuit package, and methods for enc...

Micro-LED chips and methods for manufacturing the same and display...

Inkjet adhesive, manufacturing method for semiconductor device, and...

Metering apparatus

Coating method, coating apparatus and method for manufacturing comp...

Solid top terminal for discrete power devices

Methods and apparatus for a semiconductor device having bi-material...

Application mechanism, application apparatus, method for manufactur...

Package assembly

Method for producing a substrate arrangement, substrate arrangement...

Conductive paste and die bonding method

Electronic-component mounting apparatus

Method for fabricating stack die package

Solder paste

Fan-out wafer level chip package structure

Methods and apparatus for semiconductor device having bi-material d...

Carrier and clip each having sinterable, solidified paste for conne...

Electronic sandwich structure with two parts joined together by mea...

Self-adhesive die

Package assembly

Methods for bonding substrates

Bonding structure and method

Electronic-component mounting apparatus

Method for bonding substrates

Conductive paste and die bonding method

Fan-out wafer level chip package structure and manufacturing method...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

COATING METHOD, COATING APPARATUS AND METHOD FOR MANUFACTURING COMP...

MICRO-LED CHIPS AND METHODS FOR MANUFACTURING THE SAME AND DISPLAY...

Methods and Apparatus for a Semiconductor Device Having Bi-Material...

COATING METHOD, COATING APPARATUS AND METHOD FOR MANUFACTURING COMP...

APPLICATION MECHANISM, APPLICATION APPARATUS, METHOD FOR MANUFACTUR...

METERING APPARATUS

CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES

ELECTRONIC SANDWICH STRUCTURE WITH TWO PARTS JOINED TOGETHER BY MEA...

METHOD FOR PRODUCING A SUBSTRATE ARRANGEMENT, SUBSTRATE ARRANGEMENT...

CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES

PACKAGE ASSEMBLY

Packaged IC With Solderable Sidewalls

BONDING STRUCTURE AND METHOD

ELECTRONIC-COMPONENT MOUNTING APPARATUS AND ELECTRONIC-COMPONENT MO...

FAN-OUT WAFER LEVEL CHIP PACKAGE STRUCTURE

SOLDER PASTE

Packaged IC with Solderable Sidewalls

METHOD FOR BONDING SUBSTRATES

INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING SAME

SEMICONDUCTOR DEVICE INCLUDING INDEPENDENT FILM LAYER FOR EMBEDDING...

BONDING STRUCTURE AND METHOD

METHOD FOR FABRICATING STACK DIE PACKAGE

REACTIVE HOT-MELT ADHESIVE FOR USE ON ELECTRONICS

POWER TRANSISTOR ARRANGEMENT AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL

METHODS FOR BONDING SUBSTRATES

Package-In-Packages and Methods of Formation Thereof

INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING SAME