by flowing gases

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/467by flowing gases

Industries

Patents Grantslast 30 patents

Information Patent Grant
Processors and integrated circuits including a microelectromechanic...
- Patent number 12,154,843
- Issue date Nov 26, 2024
- Honeywell International Inc.
- Sridhar Vanka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Alignment mechanism
- Patent number 12,140,625
- Issue date Nov 12, 2024
- Delta Design, Inc.
- Jerry Ihor Tustaniwskyj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Convectors
- Patent number 12,129,868
- Issue date Oct 29, 2024
- Pedro Arnulfo Sarmiento
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Systems and methods for bidirectional message architecture for inve...
- Patent number 12,122,251
- Issue date Oct 22, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Hood for MEMS-based cooling systems
- Patent number 12,127,369
- Issue date Oct 22, 2024
- Frore Systems Inc.
- Prabhu Sathyamurthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink with increased air flow
- Patent number 12,114,467
- Issue date Oct 8, 2024
- Huawei Technologies Co., Ltd.
- Magnus Kallmark
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal control system
- Patent number 12,110,881
- Issue date Oct 8, 2024
- APR Technologies AB
- Robert Thorslund
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling structure and electrical apparatus
- Patent number 12,107,033
- Issue date Oct 1, 2024
- Kabushiki Kaisha Toyota Jidoshokki
- Toshiaki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,103,406
- Issue date Oct 1, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Solid state drive apparatus and data storage apparatus including th...
- Patent number 12,094,803
- Issue date Sep 17, 2024
- Samsung Electronics Co., Ltd.
- Sungchul Hur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimization of the thermal performance of the 3D ICs utilizing the...
- Patent number 12,087,663
- Issue date Sep 10, 2024
- Kambix Innovations, LLC
- Kambiz Vafai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fractal heat transfer device
- Patent number 12,078,432
- Issue date Sep 3, 2024
- FRACTAL HEATSINK TECHNOLOGIES LLC
- Alexander Poltorak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
System for cooling components in an electronic module
- Patent number 12,068,225
- Issue date Aug 20, 2024
- Whirlpool Corporation
- Nelson Rene Garcia-Polanco
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipation member including fin groups
- Patent number 12,061,057
- Issue date Aug 13, 2024
- Nidec Corporation
- Kazuhiro Nishikawa
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method for forming a semiconductor component with a cooling structure
- Patent number 12,027,446
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management of circuit boards
- Patent number 12,028,962
- Issue date Jul 2, 2024
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated radiator having temperature gradient
- Patent number 12,002,728
- Issue date Jun 4, 2024
- QKM TECHNOLOGY (DONG GUAN) CO., LTD
- Jiang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling structural body, cooling system, heat generator and constru...
- Patent number 11,994,351
- Issue date May 28, 2024
- Beji Sasaki
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Driver for motors
- Patent number 11,984,773
- Issue date May 14, 2024
- Mitsuba Corporation
- Tomoya Ikariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack chip air gap heat insulator
- Patent number 11,942,504
- Issue date Mar 26, 2024
- OmniVision Technologies, Inc.
- Sing-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement for cooling power semiconductor devices of a converter
- Patent number 11,937,412
- Issue date Mar 19, 2024
- Bombardier Transportation GmbH
- Ben Diedrichs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acclimated regulating system for electronics packages
- Patent number 11,901,259
- Issue date Feb 13, 2024
- BAIDU USA LLC
- Tianyi Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink fastener
- Patent number 11,901,265
- Issue date Feb 13, 2024
- Southco, Inc.
- Richard E. Schlack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Choked flow cooling
- Patent number 11,901,264
- Issue date Feb 13, 2024
- SK hynix NAND Product Solutions Corp.
- Mark Forsnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid heat sink for electronics cooling
- Patent number 11,886,258
- Issue date Jan 30, 2024
- BAIDU USA LLC
- Tianyi Gao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multilayer wiring substrate
- Patent number 11,871,513
- Issue date Jan 9, 2024
- Murata Manufacturing Co., Ltd.
- Masao Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Management of heat on a semiconductor device and methods for produc...
- Patent number 11,869,826
- Issue date Jan 9, 2024
- Micron Technology, Inc.
- James S. Rehmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink with protrusions on multiple sides thereof and apparatus...
- Patent number 11,864,348
- Issue date Jan 2, 2024
- Gerald Ho Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Fluid mover enclosure
- Patent number 11,859,915
- Issue date Jan 2, 2024
- Advanced Thermal Solutions, Inc.
- Kaveh Azar
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Adjustable heat exchanger
- Patent number 11,862,534
- Issue date Jan 2, 2024
- Zonghu Zhu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMITTERS FOR INTEGRATED POWER CARD COOLING
- Publication number 20240395657
- Publication date Nov 28, 2024
- DENSO International America, Inc.
- Sean Schoneboom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20240387322
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORIES AND FABRICATION METHODS THEREOF, MEMORY SYSTEMS, AND ELECT...
- Publication number 20240379497
- Publication date Nov 14, 2024
- Yangtze Memory Technologies Co., Ltd.
- Hao Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS ARRANGEMENT AND SEMICONDUCTOR SWITCHING DEVICE HAVING T...
- Publication number 20240334641
- Publication date Oct 3, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Matthias Eisner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING COOLING STRUCTURE
- Publication number 20240312872
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING DEVICE
- Publication number 20240268058
- Publication date Aug 8, 2024
- NISSAN MOTOR CO., LTD.
- Kenta EMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...
- Publication number 20240222226
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL IN...
- Publication number 20240213116
- Publication date Jun 27, 2024
- Intel Corporation
- Kyle Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS, AND MANUFACTURING METHOD THEREFOR
- Publication number 20240203817
- Publication date Jun 20, 2024
- ROHM CO., LTD.
- Natsuya YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK CHIP AIR GAP HEAT INSULATOR
- Publication number 20240178260
- Publication date May 30, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Sing-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED JET IMPINGEMENT LEAK PREVENTION FOR INTEGRATED CIRCUIT
- Publication number 20240175917
- Publication date May 30, 2024
- Intel Corporation
- Ruben NUNEZ BLANCO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXHAUST BLENDING FOR PIEZOELECTRIC COOLING SYSTEMS
- Publication number 20240172389
- Publication date May 23, 2024
- Frore Systems Inc.
- Prabhu Sathyamurthy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHOKED FLOW COOLING
- Publication number 20240170368
- Publication date May 23, 2024
- SK hynix NAND Product Solutions Corp.
- Mark Forsnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20240162115
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Youngdeuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES
- Publication number 20240162158
- Publication date May 16, 2024
- Intel Corporation
- Brandon C. Marin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MANAGEMENT OF HEAT ON A SEMICONDUCTOR DEVICE AND METHODS FOR PRODUC...
- Publication number 20240145341
- Publication date May 2, 2024
- Micron Technology, Inc.
- James S. Rehmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microfluidic Channels for Cooling Hybrid Bonded Interfaces
- Publication number 20240128156
- Publication date Apr 18, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES
- Publication number 20240120328
- Publication date Apr 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLING A THERMALLY CONDUCTIVE PLATE TO A SEMICONDUCTOR DEVICE FOR...
- Publication number 20240103073
- Publication date Mar 28, 2024
- Intel Corporation
- Patrick PARDY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL CO...
- Publication number 20240105553
- Publication date Mar 28, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Kevin M. Gertiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL CO...
- Publication number 20240105552
- Publication date Mar 28, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Kevin M. Gertiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA STORAGE STRUCTURE OR DATA INFRASTRUCTURE INCLDUING A PLURALITY...
- Publication number 20240071867
- Publication date Feb 29, 2024
- SK HYNIX INC.
- Ho Sung KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRAT...
- Publication number 20240074028
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Youngho YOON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ALIGNMENT MECHANISM
- Publication number 20240061036
- Publication date Feb 22, 2024
- Delta Design, Inc.
- Jerry Ihor TUSTANIWSKYJ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pin Fin Placement Assembly for Forming Temperature Control Element...
- Publication number 20240038620
- Publication date Feb 1, 2024
- Google LLC
- Yingshi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
- Publication number 20240038633
- Publication date Feb 1, 2024
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement for Cooling and Motor Module
- Publication number 20240021492
- Publication date Jan 18, 2024
- Siemens Aktiengesellschaft
- Lutz NAMYSLO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZATION OF THE THERMAL PERFORMANCE OF THE 3D ICS UTILIZING THE...
- Publication number 20240006269
- Publication date Jan 4, 2024
- Kambix Innovations, LLC
- Kambiz Vafai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTING SYSTEM WITH COOLING FOR CONTROLLING TEMPERATURE OF ELECTR...
- Publication number 20230397325
- Publication date Dec 7, 2023
- Microsoft Technology Licensing, LLC
- Unnikrishnan VADAKKANMARU VEEDU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NATURAL CONVECTION INDUCTION HEAT SLUG DESIGN AND SEMICONDUCTOR PAC...
- Publication number 20230386962
- Publication date Nov 30, 2023
- TELECHIPS INC.
- Cheoljin Soo PARK
- H01 - BASIC ELECTRIC ELEMENTS

by flowing gases

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Processors and integrated circuits including a microelectromechanic...

Alignment mechanism

Convectors

Systems and methods for bidirectional message architecture for inve...

Hood for MEMS-based cooling systems

Heatsink with increased air flow

Thermal control system

Cooling structure and electrical apparatus

Systems and methods for integrated gate driver for inverter for ele...

Solid state drive apparatus and data storage apparatus including th...

Optimization of the thermal performance of the 3D ICs utilizing the...

Fractal heat transfer device

System for cooling components in an electronic module

Heat dissipation member including fin groups

Method for forming a semiconductor component with a cooling structure

Thermal management of circuit boards

Integrated radiator having temperature gradient

Cooling structural body, cooling system, heat generator and constru...

Driver for motors

Stack chip air gap heat insulator

Arrangement for cooling power semiconductor devices of a converter

Acclimated regulating system for electronics packages

Heat sink fastener

Choked flow cooling

Hybrid heat sink for electronics cooling

Multilayer wiring substrate

Management of heat on a semiconductor device and methods for produc...

Heat sink with protrusions on multiple sides thereof and apparatus...

Fluid mover enclosure

Adjustable heat exchanger

Patents Applicationslast 30 patents

EMITTERS FOR INTEGRATED POWER CARD COOLING

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

MEMORIES AND FABRICATION METHODS THEREOF, MEMORY SYSTEMS, AND ELECT...

ELECTRONICS ARRANGEMENT AND SEMICONDUCTOR SWITCHING DEVICE HAVING T...

APPARATUS INCLUDING COOLING STRUCTURE

COOLING DEVICE

EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL IN...

SEMICONDUCTOR APPARATUS, AND MANUFACTURING METHOD THEREFOR

STACK CHIP AIR GAP HEAT INSULATOR

ENHANCED JET IMPINGEMENT LEAK PREVENTION FOR INTEGRATED CIRCUIT

EXHAUST BLENDING FOR PIEZOELECTRIC COOLING SYSTEMS

CHOKED FLOW COOLING

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES

MANAGEMENT OF HEAT ON A SEMICONDUCTOR DEVICE AND METHODS FOR PRODUC...

Microfluidic Channels for Cooling Hybrid Bonded Interfaces

POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES

COUPLING A THERMALLY CONDUCTIVE PLATE TO A SEMICONDUCTOR DEVICE FOR...

SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL CO...

SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL CO...

DATA STORAGE STRUCTURE OR DATA INFRASTRUCTURE INCLDUING A PLURALITY...

ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRAT...

ALIGNMENT MECHANISM

Pin Fin Placement Assembly for Forming Temperature Control Element...

EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...

Arrangement for Cooling and Motor Module

OPTIMIZATION OF THE THERMAL PERFORMANCE OF THE 3D ICS UTILIZING THE...

COMPUTING SYSTEM WITH COOLING FOR CONTROLLING TEMPERATURE OF ELECTR...

NATURAL CONVECTION INDUCTION HEAT SLUG DESIGN AND SEMICONDUCTOR PAC...