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H01L21/76804

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/76804by forming tapered via holes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 12,205,906
- Issue date Jan 21, 2025
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance interconnect structure for semiconductor device
- Patent number 12,199,036
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jason Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,191,203
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer film device and method
- Patent number 12,166,128
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for fabricating the same
- Patent number 12,148,831
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip for standard logic performance improvement having a...
- Patent number 12,142,569
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,136,566
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superstrate and method of making it
- Patent number 12,136,564
- Issue date Nov 5, 2024
- Canon Kabushiki Kaisha
- Fen Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside vias in semiconductor device
- Patent number 12,132,092
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including supervia and method of making
- Patent number 12,113,014
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kam-Tou Sio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and the method of manufacturing the same
- Patent number 12,107,056
- Issue date Oct 1, 2024
- Advanced Semiconductor Engineering, Inc.
- Ya Fang Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control of gate contact opening
- Patent number 12,107,003
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor structures
- Patent number 12,094,821
- Issue date Sep 17, 2024
- Winbond Electronics Corp.
- Chia-Hsin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of interconnect structure
- Patent number 12,080,590
- Issue date Sep 3, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Hung-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,080,770
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET fabrication methods
- Patent number 12,068,392
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an extra low-k dielectric layer and met...
- Patent number 12,062,613
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Cheng Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor memory device
- Patent number 12,058,851
- Issue date Aug 6, 2024
- United Microelectronics Corp.
- Yi-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,051,619
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 12,051,620
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front-end-of-line (FEOL) through semiconductor-on-substrate via (TSV)
- Patent number 12,046,537
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Hsiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 12,046,557
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a dual material redistribution line
- Patent number 12,027,447
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D memory device with modulated doped channel
- Patent number 12,029,042
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Peng-Chun Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device having stacks on wafer
- Patent number 12,027,378
- Issue date Jul 2, 2024
- Kioxia Corporation
- Takashi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a conductive pillar and methods of man...
- Patent number 12,027,495
- Issue date Jul 2, 2024
- Samsung Electronics Co., Ltd.
- Kun Sil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D package structure and methods of forming same
- Patent number 12,009,345
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact window structure, metal plug and forming method thereof, an...
- Patent number 12,002,748
- Issue date Jun 4, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jie Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure of semiconductor device
- Patent number 11,996,325
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for metal gate surface clean
- Patent number 11,996,283
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shich-Chang Suen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VIAS INCLUDING AN ELECTROPLATED LAYER AND METHODS FOR FABRICATING T...
- Publication number 20250038010
- Publication date Jan 30, 2025
- Corning Incorporated
- Bomi Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250029870
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Feng LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND THE METHOD OF MANUFACTURING THE SAME
- Publication number 20250029940
- Publication date Jan 23, 2025
- Advanced Semiconductor Engineering, Inc.
- Ya Fang CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME
- Publication number 20250015185
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20250014988
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- SHU-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERRACED CONDUCTOR STRUCTURE FOR SEMICONDUCTOR DEVICES
- Publication number 20250014994
- Publication date Jan 9, 2025
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL
- Publication number 20250006664
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE
- Publication number 20250006590
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER FILM DEVICE AND METHOD
- Publication number 20240395939
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH PROFILE CONTROL OF GATE CONTACT OPENING
- Publication number 20240395607
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING DIELECTRIC FILM WITH HIGH RESISTANCE TO TILTING
- Publication number 20240387384
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE PATTERNING THROUGH LAYER EXPANSION PROCESS AND RESULTING S...
- Publication number 20240387246
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING SUPERVIA AND METHOD OF MAKING
- Publication number 20240387361
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kam-Tou SIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDING REDISTRIBUTION LAYER METAL TRACES IN A POLYMERIC DIELECTRIC
- Publication number 20240379411
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Peng SOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS
- Publication number 20240379557
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Yang WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING SELF-ALIGNED CONDUCTIVE STRUCTURE AN...
- Publication number 20240379435
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DOPED REGION DIELECTRIC LAYER
- Publication number 20240371688
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AN EXTRA LOW-K DIELECTRIC LAYER AND MET...
- Publication number 20240371769
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Cheng SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH TOP VIA HAVING EXTENDED BOTTOM CONTACT
- Publication number 20240371750
- Publication date Nov 7, 2024
- International Business Machines Corporation
- Manasa MEDIKONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Vias in Semiconductor Device
- Publication number 20240371957
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET FABRICATION METHODS
- Publication number 20240371970
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun Hsiung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240371751
- Publication date Nov 7, 2024
- SK HYNIX INC.
- Sung Wook JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MAKING SEMICONDUCTOR DEVICES THAT INCLUDE METAL CAP LAYERS
- Publication number 20240363410
- Publication date Oct 31, 2024
- TOKYO ELECTRON LIMITED
- Ryota Yonezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS FOR MANUFACTURING THE SAME
- Publication number 20240363467
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui-Wen SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-END-OF-LINE (FEOL) THROUGH SEMICONDUCTOR-ON-SUBSTRATE VIA (TSV)
- Publication number 20240355711
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Hsiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240347454
- Publication date Oct 17, 2024
- NANYA TECHNOLOGY CORPORATION
- ZIH-HONG YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240347451
- Publication date Oct 17, 2024
- NANYA TECHNOLOGY CORPORATION
- ZIH-HONG YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240349493
- Publication date Oct 17, 2024
- UNITED MICROELECTRONICS CORP.
- Yi-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...
- Publication number 20240339400
- Publication date Oct 10, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...
- Publication number 20240339401
- Publication date Oct 10, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS

by forming tapered via holes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic package and fabrication method thereof

Low resistance interconnect structure for semiconductor device

Semiconductor package

Multi-layer film device and method

Semiconductor device and a method for fabricating the same

Integrated chip for standard logic performance improvement having a...

Semiconductor device and method of manufacture

Superstrate and method of making it

Backside vias in semiconductor device

Integrated circuit including supervia and method of making

Semiconductor device package and the method of manufacturing the same

Etch profile control of gate contact opening

Methods for forming semiconductor structures

Manufacturing method of interconnect structure

Semiconductor device and method

FinFET fabrication methods

Semiconductor device having an extra low-k dielectric layer and met...

Method of forming semiconductor memory device

Semiconductor device and method of manufacture

Semiconductor structure and method for manufacturing the same

Front-end-of-line (FEOL) through semiconductor-on-substrate via (TSV)

Interconnect structure and method of forming same

Semiconductor device having a dual material redistribution line

3D memory device with modulated doped channel

Method of manufacturing semiconductor device having stacks on wafer

Semiconductor devices having a conductive pillar and methods of man...

3D package structure and methods of forming same

Contact window structure, metal plug and forming method thereof, an...

Interconnect structure of semiconductor device

Method for metal gate surface clean

Patents Applicationslast 30 patents

VIAS INCLUDING AN ELECTROPLATED LAYER AND METHODS FOR FABRICATING T...

INTERCONNECTION STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND THE METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

TERRACED CONDUCTOR STRUCTURE FOR SEMICONDUCTOR DEVICES

THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL

DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE

MULTI-LAYER FILM DEVICE AND METHOD

ETCH PROFILE CONTROL OF GATE CONTACT OPENING

FORMING DIELECTRIC FILM WITH HIGH RESISTANCE TO TILTING

SCALABLE PATTERNING THROUGH LAYER EXPANSION PROCESS AND RESULTING S...

INTEGRATED CIRCUIT INCLUDING SUPERVIA AND METHOD OF MAKING

EMBEDDING REDISTRIBUTION LAYER METAL TRACES IN A POLYMERIC DIELECTRIC

CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS

SEMICONDUCTOR STRUCTURE HAVING SELF-ALIGNED CONDUCTIVE STRUCTURE AN...

SEMICONDUCTOR DEVICE WITH DOPED REGION DIELECTRIC LAYER

SEMICONDUCTOR DEVICE HAVING AN EXTRA LOW-K DIELECTRIC LAYER AND MET...

SEMICONDUCTOR STRUCTURE WITH TOP VIA HAVING EXTENDED BOTTOM CONTACT

Backside Vias in Semiconductor Device

FINFET FABRICATION METHODS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHODS FOR MAKING SEMICONDUCTOR DEVICES THAT INCLUDE METAL CAP LAYERS

SEMICONDUCTOR STRUCTURES AND METHODS FOR MANUFACTURING THE SAME

FRONT-END-OF-LINE (FEOL) THROUGH SEMICONDUCTOR-ON-SUBSTRATE VIA (TSV)

INTERCONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

INTERCONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF FORMING SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...

SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...