by forming tapered via holes

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H01L21/76804

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/76804by forming tapered via holes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for laser drilling blind vias
- Patent number 12,358,073
- Issue date Jul 15, 2025
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plasma-doped trenches for memory
- Patent number 12,354,912
- Issue date Jul 8, 2025
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor memory device
- Patent number 12,349,340
- Issue date Jul 1, 2025
- United Microelectronics Corp.
- Yi-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter block for recessed contacts and methods forming same
- Patent number 12,349,395
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect line for semiconductor device
- Patent number 12,341,057
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning underlying structure
- Patent number 12,341,007
- Issue date Jun 24, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Yun-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for barrier-less plug
- Patent number 12,341,013
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 12,327,758
- Issue date Jun 10, 2025
- SK Hynix Inc.
- Nam Yeal Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device and method of making thereof using...
- Patent number 12,315,763
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Younghoon Goo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, memory devices, and electronic systems
- Patent number 12,315,803
- Issue date May 27, 2025
- Lodestar Licensing Group LLC
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for semiconductor device and method
- Patent number 12,315,809
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure with backside dielectric layer having...
- Patent number 12,308,287
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with fluorine-catching layer
- Patent number 12,308,319
- Issue date May 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistant contact method and structure
- Patent number 12,300,729
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with source/drain contact
- Patent number 12,288,822
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,288,715
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 12,272,622
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removing polymer through treatment
- Patent number 12,272,595
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a barrier layer in an interconnect structure of s...
- Patent number 12,266,567
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Jhih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene liners and caps for semiconductor structures
- Patent number 12,255,144
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-mask alternating line deposition
- Patent number 12,243,819
- Issue date Mar 4, 2025
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recess structure for padless stack via
- Patent number 12,230,552
- Issue date Feb 18, 2025
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 12,205,906
- Issue date Jan 21, 2025
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance interconnect structure for semiconductor device
- Patent number 12,199,036
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jason Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,191,203
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer film device and method
- Patent number 12,166,128
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for fabricating the same
- Patent number 12,148,831
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip for standard logic performance improvement having a...
- Patent number 12,142,569
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,136,566
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superstrate and method of making it
- Patent number 12,136,564
- Issue date Nov 5, 2024
- Canon Kabushiki Kaisha
- Fen Wan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR SELECTIVE METAL CAP FORMATION
- Publication number 20250233074
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250226355
- Publication date Jul 10, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20250218950
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Jongsoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC WINDOWS FOR GROUPS OF VIAS THROUGH SEMICONDUCTOR SUBSTRATES
- Publication number 20250218933
- Publication date Jul 3, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250218865
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hua CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE DAMASCENE VIA PROFILES FOR ADVANCED INTEGRATED CIRCUIT STRUC...
- Publication number 20250210509
- Publication date Jun 26, 2025
- Intel Corporation
- Nicholas J. KYBERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250210465
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE LINERS AND CAPS FOR SEMICONDUCTOR STRUCTURES
- Publication number 20250192052
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250167105
- Publication date May 22, 2025
- Chun-Heng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METH...
- Publication number 20250157963
- Publication date May 15, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Adarsh RAJASHEKHAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH BONDING INTERFACE AND METHODS OF FORMI...
- Publication number 20250149482
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Shan Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA SHAPING BETWEEN METAL LAYERS FOR CONTROLLED RESISTANCE
- Publication number 20250140604
- Publication date May 1, 2025
- Applied Materials, Inc.
- Sefa Dag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH LINER LAYER HAVING TAPERED SIDE...
- Publication number 20250132194
- Publication date Apr 24, 2025
- NANYA TECHNOLOGY CORPORATION
- JAR-MING HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132200
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Lung CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH LINER LAYER HAVING TAPERED SIDE...
- Publication number 20250132193
- Publication date Apr 24, 2025
- NANYA TECHNOLOGY CORPORATION
- JAR-MING HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250125251
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Ling Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20250105147
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jason HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250096044
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF
- Publication number 20250081598
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Heng Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAG...
- Publication number 20250062216
- Publication date Feb 20, 2025
- SILICON BOX PTE. LTD.
- Sehat SUTARDJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS INCLUDING AN ELECTROPLATED LAYER AND METHODS FOR FABRICATING T...
- Publication number 20250038010
- Publication date Jan 30, 2025
- Corning Incorporated
- Bomi Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250029870
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Feng LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND THE METHOD OF MANUFACTURING THE SAME
- Publication number 20250029940
- Publication date Jan 23, 2025
- Advanced Semiconductor Engineering, Inc.
- Ya Fang CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME
- Publication number 20250015185
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20250014988
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- SHU-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERRACED CONDUCTOR STRUCTURE FOR SEMICONDUCTOR DEVICES
- Publication number 20250014994
- Publication date Jan 9, 2025
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL
- Publication number 20250006664
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE
- Publication number 20250006590
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER FILM DEVICE AND METHOD
- Publication number 20240395939
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH PROFILE CONTROL OF GATE CONTACT OPENING
- Publication number 20240395607
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS

by forming tapered via holes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and apparatus for laser drilling blind vias

Plasma-doped trenches for memory

Method of forming semiconductor memory device

Inter block for recessed contacts and methods forming same

Interconnect line for semiconductor device

Method of patterning underlying structure

Method and structure for barrier-less plug

Method for fabricating semiconductor device

Three-dimensional memory device and method of making thereof using...

Microelectronic devices, memory devices, and electronic systems

Via for semiconductor device and method

Integrated circuit structure with backside dielectric layer having...

Semiconductor device structure with fluorine-catching layer

Low resistant contact method and structure

Semiconductor device with source/drain contact

Semiconductor device and manufacturing method thereof

Package and manufacturing method thereof

Removing polymer through treatment

Method of forming a barrier layer in an interconnect structure of s...

Graphene liners and caps for semiconductor structures

Single-mask alternating line deposition

Recess structure for padless stack via

Electronic package and fabrication method thereof

Low resistance interconnect structure for semiconductor device

Semiconductor package

Multi-layer film device and method

Semiconductor device and a method for fabricating the same

Integrated chip for standard logic performance improvement having a...

Semiconductor device and method of manufacture

Superstrate and method of making it

Patents Applicationslast 30 patents

METHODS FOR SELECTIVE METAL CAP FORMATION

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

DIELECTRIC WINDOWS FOR GROUPS OF VIAS THROUGH SEMICONDUCTOR SUBSTRATES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SINGLE DAMASCENE VIA PROFILES FOR ADVANCED INTEGRATED CIRCUIT STRUC...

PACKAGE AND MANUFACTURING METHOD THEREOF

GRAPHENE LINERS AND CAPS FOR SEMICONDUCTOR STRUCTURES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METH...

SEMICONDUCTOR STRUCTURE WITH BONDING INTERFACE AND METHODS OF FORMI...

VIA SHAPING BETWEEN METAL LAYERS FOR CONTROLLED RESISTANCE

SEMICONDUCTOR DEVICE STRUCTURE WITH LINER LAYER HAVING TAPERED SIDE...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE STRUCTURE WITH LINER LAYER HAVING TAPERED SIDE...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

LOW RESISTANCE INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAG...

VIAS INCLUDING AN ELECTROPLATED LAYER AND METHODS FOR FABRICATING T...

INTERCONNECTION STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND THE METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

TERRACED CONDUCTOR STRUCTURE FOR SEMICONDUCTOR DEVICES

THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL

DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE

MULTI-LAYER FILM DEVICE AND METHOD

ETCH PROFILE CONTROL OF GATE CONTACT OPENING