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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/76804
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Patents Grants
last 30 patents
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Patent Grant
Inter block for recessed contacts and methods forming same
Patent number
11,967,622
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Te-Chih Hsiung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnection structure with anti-adhesion layer
Patent number
11,948,835
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Che-Cheng Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device structure and methods of forming the same
Patent number
11,948,879
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Lin-Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer light detecting device and electronic apparatus
Patent number
11,948,833
Issue date
Apr 2, 2024
Sony Group Corporation
Masaki Okamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure having alternating selective metal and diel...
Patent number
11,942,426
Issue date
Mar 26, 2024
International Business Machines Corporation
Son Nguyen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit structure with backside dielectric layer having...
Patent number
11,935,781
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Che-Lun Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contact window structure and method for forming contact window stru...
Patent number
11,929,280
Issue date
Mar 12, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Ping-Heng Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive contact having barrier layers with different depths
Patent number
11,929,328
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chia-Yang Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Top gate recessed channel CMOS thin film transistor in the back end...
Patent number
11,929,320
Issue date
Mar 12, 2024
Intel Corporation
Gilbert Dewey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal-insulator-metal structure and methods of fabrication thereof
Patent number
11,923,405
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Fan Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Partial subtractive supervia enabling hyper-scaling
Patent number
11,908,791
Issue date
Feb 20, 2024
International Business Machines Corporation
Sagarika Mukesh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic devices, memory devices, and electronic systems
Patent number
11,901,292
Issue date
Feb 13, 2024
Shuangqiang Luo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,901,230
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Chung Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package and fabrication method thereof
Patent number
11,881,459
Issue date
Jan 23, 2024
Siliconware Precision Industries Co., Ltd.
Yu-Lung Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through-substrate-via with reentrant profile
Patent number
11,862,535
Issue date
Jan 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hung-Ling Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Scalable patterning through layer expansion process and resulting s...
Patent number
11,854,868
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Kai-Hsuan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming high aspect ratio features
Patent number
11,854,869
Issue date
Dec 26, 2023
Ken Tokashiki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor storage device and manufacturing method thereof
Patent number
11,854,971
Issue date
Dec 26, 2023
Kioxia Corporation
Yosuke Mitsuno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structure with air-gaps
Patent number
11,842,962
Issue date
Dec 12, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Tai-I Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Via for semiconductor device and method
Patent number
11,810,857
Issue date
Nov 7, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chia-Pang Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with conductive structure and insulation layer...
Patent number
11,810,860
Issue date
Nov 7, 2023
Semiconductor Manufacturing International (Shanghai) Corporation
Nan Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices including resistor structures
Patent number
11,804,516
Issue date
Oct 31, 2023
Samsung Electronics Co., Ltd.
Tae-yeol Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for preparing semiconductor device including conductive cont...
Patent number
11,791,264
Issue date
Oct 17, 2023
NANYA TECHNOLOGY CORPORATION
Tse-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structures and methods for forming the same
Patent number
11,791,261
Issue date
Oct 17, 2023
Winbond Electronics Corp.
Chia-Hsin Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wrap around cross-couple contact structure with enhanced gate conta...
Patent number
11,784,125
Issue date
Oct 10, 2023
International Business Machines Corporation
Ruilong Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-layer film device and method
Patent number
11,777,035
Issue date
Oct 3, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yao-Jen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contact via structures of semiconductor devices
Patent number
11,776,844
Issue date
Oct 3, 2023
GLOBALFOUNDRIES Singapore Pte. Ltd.
Yung Fu Chong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Self-aligned via structure by selective deposition
Patent number
11,756,878
Issue date
Sep 12, 2023
Taiwan Semiconductor Manufacturing Company Limited
Shao-Kuan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit including super via and method of making
Patent number
11,735,517
Issue date
Aug 22, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Kam-Tou Sio
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical device having conductive lines with air gaps therebetwee...
Patent number
11,735,524
Issue date
Aug 22, 2023
International Business Machines Corporation
Benjamin D. Briggs
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
TOP GATE RECESSED CHANNEL CMOS THIN FILM TRANSISTOR AND METHODS OF...
Publication number
20240136277
Publication date
Apr 25, 2024
Intel Corporation
Gilbert Dewey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS
Publication number
20240136285
Publication date
Apr 25, 2024
Lodestar Licensing Group LLC
Shuangqiang Luo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240128122
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Chung Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER DISTRIBUTION NETWORK WITH BACKSIDE POWER RAIL
Publication number
20240128191
Publication date
Apr 18, 2024
International Business Machines Corporation
Tsung-Sheng Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICES INCLUDING HIGH ASPECT RATIO FEATURES
Publication number
20240120237
Publication date
Apr 11, 2024
Lodestar Licensing Group LLC
Ken Tokashiki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
Publication number
20240113012
Publication date
Apr 4, 2024
Micron Technology, Inc.
Collin Howder
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MIDDLE OF LINE DIELECTRIC LAYER ENGINEERING FOR VIA VOID PREVENTION
Publication number
20240105505
Publication date
Mar 28, 2024
Applied Materials, Inc.
Nicolas Louis BREIL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
Publication number
20240105591
Publication date
Mar 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia Chen LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLASMA-DOPED TRENCHES FOR MEMORY
Publication number
20240105510
Publication date
Mar 28, 2024
Micron Technology, Inc.
Yiping Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240096690
Publication date
Mar 21, 2024
KIOXIA Corporation
Shingo HONDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBTRACTIVES LINES AND VIAS WITH WRAP-AROUND CONTACT
Publication number
20240096786
Publication date
Mar 21, 2024
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NITRIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING NITRIDE S...
Publication number
20240096968
Publication date
Mar 21, 2024
Mitsubishi Electric Corporation
Ken IMAMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH-SUBSTRATE-VIA WITH REENTRANT PROFILE
Publication number
20240087988
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Hung-Ling Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS
Publication number
20240079332
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Co., LTD
Chia-Yang WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND AN ELECTRONIC SYSTEM INCLUDING THE SAME
Publication number
20240063113
Publication date
Feb 22, 2024
Samsung Electronics Co., Ltd.
Sanghun CHUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT INCLUDING SUPERVIA AND METHOD OF MAKING
Publication number
20240021516
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Kam-Tou SIO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NOVEL SELF-ALIGN VIA STRUCTURE BY SELECTIVE DEPOSITION
Publication number
20240021517
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Company Limited
Shao-Kuan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Devices Including Resistor Structures
Publication number
20240014250
Publication date
Jan 11, 2024
Samsung Electronics Co., Ltd.
Tae-yeol KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...
Publication number
20240014133
Publication date
Jan 11, 2024
International Business Machines Corporation
Benjamin D. Briggs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH POWER VIA
Publication number
20230420359
Publication date
Dec 28, 2023
International Business Machines Corporation
Ruilong Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR FORMING SEMICONDUCTOR STRUCTURES
Publication number
20230420365
Publication date
Dec 28, 2023
WINBOND ELECTRONICS CORP.
Chia-Hsin HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE BOTTOMLESS GRAPHENE LINED INTERCONNECTS
Publication number
20230420361
Publication date
Dec 28, 2023
Intel Corporation
Nita CHANDRASEKHAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VIA CONNECTION TO BACKSIDE POWER DELIVERY NETWORK
Publication number
20230402318
Publication date
Dec 14, 2023
International Business Machines Corporation
Ruilong Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONTACT VIA STRUCTURES OF SEMICONDUCTOR DEVICES
Publication number
20230395425
Publication date
Dec 7, 2023
GLOBALFOUNDRIES SINGAPORE PTE. LTD.
YUNG FU CHONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANGLED CONTACT WITH A NEGATIVE TAPERED PROFILE
Publication number
20230386897
Publication date
Nov 30, 2023
International Business Machines Corporation
Oleg Gluschenkov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP BONDING METHOD
Publication number
20230377938
Publication date
Nov 23, 2023
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
Wanli GUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH FLUORINE-CATCHING LAYER
Publication number
20230378070
Publication date
Nov 23, 2023
NANYA TECHNOLOGY CORPORATION
KUO-HUI SU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-LAYER FILM DEVICE AND METHOD
Publication number
20230369500
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Yao-Jen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SCALABLE PATTERNING THROUGH LAYER EXPANSION PROCESS AND RESULTING S...
Publication number
20230369098
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Kai-Hsuan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH MULTI-CARBON-CONCE...
Publication number
20230369097
Publication date
Nov 16, 2023
NANYA TECHNOLOGY CORPORATION
TSE-YAO HUANG
H01 - BASIC ELECTRIC ELEMENTS