by means of a layer connector

Industry

CPC
H01L2224/81903

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81903by means of a layer connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
Anisotropic conductive film and connected structure
- Patent number 11,923,335
- Issue date Mar 5, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Multilayer substrate
- Patent number 11,901,325
- Issue date Feb 13, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 11,683,963
- Issue date Jun 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of micro-LED display panel
- Patent number 11,302,679
- Issue date Apr 12, 2022
- PlayNitride Inc.
- Ying-Tsang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced adhesive materials and processes for 3D applications
- Patent number 11,168,234
- Issue date Nov 9, 2021
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Anisotropic conductive film and connected structure
- Patent number 11,139,265
- Issue date Oct 5, 2021
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with embedded stacked through-silicon via die
- Patent number 11,107,766
- Issue date Aug 31, 2021
- Intel Corporation
- Javier Soto Gonzalez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package with stacked semiconduc...
- Patent number 11,101,235
- Issue date Aug 24, 2021
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment method, method for connecting electronic component, metho...
- Patent number 11,049,842
- Issue date Jun 29, 2021
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,892,243
- Issue date Jan 12, 2021
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film with conductive particles forming repea...
- Patent number 10,854,571
- Issue date Dec 1, 2020
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic conductive film and production method of the same
- Patent number 10,849,236
- Issue date Nov 24, 2020
- Dexerials Corporation
- Reiji Tsukao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,847,487
- Issue date Nov 24, 2020
- Dexerials Corporation
- Seiichiro Shinohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-stage cure bare die light emitting diode
- Patent number 10,795,452
- Issue date Oct 6, 2020
- Microsoft Technology Licensing, LLC
- Benjamin Patrick Sullivan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Micro-LED display panel and manufacturing method thereof
- Patent number 10,777,541
- Issue date Sep 15, 2020
- PlayNitride Inc.
- Ying-Tsang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced adhesive materials and processes for 3D applications
- Patent number 10,767,084
- Issue date Sep 8, 2020
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Curing a heat-curable material in an embedded curing zone
- Patent number 10,717,236
- Issue date Jul 21, 2020
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Jeroen van den Brand
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Display device
- Patent number 10,634,941
- Issue date Apr 28, 2020
- Japan Display Inc.
- Yosuke Hyodo
- G02 - OPTICS
Information Patent Grant
Composite bump, method for forming composite bump, and substrate
- Patent number 10,629,556
- Issue date Apr 21, 2020
- Fujitsu Limited
- Takashi Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible display panel and preparation method thereof, flexible dis...
- Patent number 10,622,330
- Issue date Apr 14, 2020
- BOE Technology Group Co., Ltd.
- Tao Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chips and semiconductor packages including the same
- Patent number 10,622,312
- Issue date Apr 14, 2020
- Samsung Electronics Co., Ltd.
- Myoung-soo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method of semiconductor package with stacked semiconduc...
- Patent number 10,622,323
- Issue date Apr 14, 2020
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package having a self-aligning interconnect assembly an...
- Patent number 10,607,929
- Issue date Mar 31, 2020
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic light-emitting diode display and method of manufacturing th...
- Patent number 10,529,790
- Issue date Jan 7, 2020
- Samsung Display Co., Ltd.
- Kyung Hoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and connected structure
- Patent number 10,522,502
- Issue date Dec 31, 2019
- Dexerials Corporation
- Seiichiro Shinohara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic conductive film and connected structure
- Patent number 10,510,711
- Issue date Dec 17, 2019
- Dexerials Corporation
- Seiichiro Shinohara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Anisotropic conductive film and method for manufacturing the same
- Patent number 10,494,549
- Issue date Dec 3, 2019
- Samsung Display Co., Ltd.
- Minseok Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Substrate with embedded stacked through-silicon via die
- Patent number 10,461,032
- Issue date Oct 29, 2019
- Intel Corporation
- Javier Soto Gonzalez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and production method of the same
- Patent number 10,461,054
- Issue date Oct 29, 2019
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and connected structure
- Patent number 10,446,517
- Issue date Oct 15, 2019
- Dexerials Corporation
- Seiichiro Shinohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF MICRO-LED DISPLAY PANEL
- Publication number 20200373282
- Publication date Nov 26, 2020
- PlayNitride Inc.
- Ying-Tsang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE
- Publication number 20200161268
- Publication date May 21, 2020
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND CONNECTED STRUCTURE
- Publication number 20200020664
- Publication date Jan 16, 2020
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME
- Publication number 20190148478
- Publication date May 16, 2019
- SAMSUNG DISPLAY CO., LTD.
- Chungseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS
- Publication number 20180340100
- Publication date Nov 29, 2018
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND CONNECTED STRUCTURE
- Publication number 20180294246
- Publication date Oct 11, 2018
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE WITH STACKED SEMICONDUC...
- Publication number 20180261563
- Publication date Sep 13, 2018
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...
- Publication number 20180218994
- Publication date Aug 2, 2018
- DEXERIALS CORPORATION
- Kouichi SATO
- B32 - LAYERED PRODUCTS
Information Patent Application
CHIP CARRIER AND METHOD THEREOF
- Publication number 20180040573
- Publication date Feb 8, 2018
- INFINEON TECHNOLOGIES AG
- FRANK PUESCHNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION BODY
- Publication number 20170236795
- Publication date Aug 17, 2017
- DEXERIALS CORPORATION
- Kenichi SARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A CHIP MODULE
- Publication number 20170133340
- Publication date May 11, 2017
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Localized sealing of interconnect structures in small gaps
- Publication number 20160247778
- Publication date Aug 25, 2016
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE STACK PACKAGES, ELECTRONIC SYSTEMS INCLUDING THE SAME, AND...
- Publication number 20140361427
- Publication date Dec 11, 2014
- SK HYNIX INC.
- Jong Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140361426
- Publication date Dec 11, 2014
- SK HYNIX INC.
- Ki Il MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BUMPS AND DISPLAY DEVICE MODULE INCORPORA...
- Publication number 20140361429
- Publication date Dec 11, 2014
- Renesas SP Drivers Inc.
- Hisao Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140357025
- Publication date Dec 4, 2014
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION METHOD, CONNECTION STRUCTURE, INSULATING ADHESIVE MEMBER...
- Publication number 20140346684
- Publication date Nov 27, 2014
- DEXERIALS CORPORATION
- Ryoji Kojima
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CONDUCTIVE PARTICLE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20140319554
- Publication date Oct 30, 2014
- SAMSUNG DISPLAY CO., LTD.
- Dae-Geun LEE
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CONTACT SMART CARD
- Publication number 20140306016
- Publication date Oct 16, 2014
- JOHNSON ELECTRIC S.A.
- Vincent Daniel Jean SALLE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONNECTION DEVICE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, M...
- Publication number 20140302643
- Publication date Oct 9, 2014
- Takayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM INCLUDING CONDUCTIVE ADHESIVE LAYER AND...
- Publication number 20140291869
- Publication date Oct 2, 2014
- Kyoung Soo PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE STRUCTURE
- Publication number 20140231985
- Publication date Aug 21, 2014
- CHUNGHWA PICTURE TUBES, LTD.
- Chi-Chao LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-REFLECTIVE CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESI...
- Publication number 20140225144
- Publication date Aug 14, 2014
- DEXERIALS CORPORATION
- Hidetsugu NAMIKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM
- Publication number 20140210084
- Publication date Jul 31, 2014
- Youn Jo KO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MAGNETIC CONTACTS FOR ELECTRONICS APPLICATIONS
- Publication number 20140205851
- Publication date Jul 24, 2014
- Ravindranath V. MAHAJAN
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR-ENCAPSULATING ADHESIVE, SEMICONDUCTOR-ENCAPSULATING F...
- Publication number 20140206148
- Publication date Jul 24, 2014
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR TRANSFERRING A GRAPHENE SHEET TO METAL CONTACT BUMPS OF...
- Publication number 20140166194
- Publication date Jun 19, 2014
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME
- Publication number 20140145328
- Publication date May 29, 2014
- Georgia Tech Research Corporation
- Rao Tummala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE BONDED BY ANISOTROPIC CONDUCTIVE FILM
- Publication number 20140138828
- Publication date May 22, 2014
- Do Hyun PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BONDING APPARATUS AND METHOD FOR DISPLAY DEVICE
- Publication number 20140106484
- Publication date Apr 17, 2014
- SAMSUNG DISPLAY CO., LTD.
- Deok-Jun Choi
- H01 - BASIC ELECTRIC ELEMENTS

by means of a layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Anisotropic conductive film and connected structure

Multilayer substrate

Anisotropic conductive film and display device using the same

Manufacturing method of micro-LED display panel

Enhanced adhesive materials and processes for 3D applications

Anisotropic conductive film and connected structure

Substrate with embedded stacked through-silicon via die

Fabrication method of semiconductor package with stacked semiconduc...

Alignment method, method for connecting electronic component, metho...

Anisotropic electrically conductive film and connection structure

Anisotropic conductive film with conductive particles forming repea...

Anisotropic conductive film and production method of the same

Anisotropic electrically conductive film and connection structure

Multi-stage cure bare die light emitting diode

Micro-LED display panel and manufacturing method thereof

Enhanced adhesive materials and processes for 3D applications

Curing a heat-curable material in an embedded curing zone

Display device

Composite bump, method for forming composite bump, and substrate

Flexible display panel and preparation method thereof, flexible dis...

Semiconductor chips and semiconductor packages including the same

Fabrication method of semiconductor package with stacked semiconduc...

Electronics package having a self-aligning interconnect assembly an...

Organic light-emitting diode display and method of manufacturing th...

Anisotropic conductive film and connected structure

Anisotropic conductive film and connected structure

Anisotropic conductive film and method for manufacturing the same

Substrate with embedded stacked through-silicon via die

Anisotropic conductive film and production method of the same

Anisotropic conductive film and connected structure

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF MICRO-LED DISPLAY PANEL

ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE

ANISOTROPIC CONDUCTIVE FILM AND CONNECTED STRUCTURE

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME

ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS

ANISOTROPIC CONDUCTIVE FILM AND CONNECTED STRUCTURE

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE WITH STACKED SEMICONDUC...

ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...

CHIP CARRIER AND METHOD THEREOF

CONNECTION BODY

METHOD FOR PRODUCING A CHIP MODULE

Localized sealing of interconnect structures in small gaps

FLEXIBLE STACK PACKAGES, ELECTRONIC SYSTEMS INCLUDING THE SAME, AND...

STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH BUMPS AND DISPLAY DEVICE MODULE INCORPORA...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

CONNECTION METHOD, CONNECTION STRUCTURE, INSULATING ADHESIVE MEMBER...

CONDUCTIVE PARTICLE AND DISPLAY DEVICE INCLUDING THE SAME

CONTACT SMART CARD

CONNECTION DEVICE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, M...

ANISOTROPIC CONDUCTIVE FILM INCLUDING CONDUCTIVE ADHESIVE LAYER AND...

SEMICONDUCTOR CHIP PACKAGE STRUCTURE

LIGHT-REFLECTIVE CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESI...

SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM

MAGNETIC CONTACTS FOR ELECTRONICS APPLICATIONS

SEMICONDUCTOR-ENCAPSULATING ADHESIVE, SEMICONDUCTOR-ENCAPSULATING F...

METHOD FOR TRANSFERRING A GRAPHENE SHEET TO METAL CONTACT BUMPS OF...

INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME

SEMICONDUCTOR DEVICE BONDED BY ANISOTROPIC CONDUCTIVE FILM

BONDING APPARATUS AND METHOD FOR DISPLAY DEVICE