by means of another bump connector

Industry

CPC
H01L2224/81902

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81902by means of another bump connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
Mounting structure and mounting method
- Patent number 9,204,551
- Issue date Dec 1, 2015
- Lenovo Innovations Limited (Hong Kong)
- Masahiro Kubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for transferring a graphene sheet to metal contact bumps of...
- Patent number 8,974,617
- Issue date Mar 10, 2015
- IMEC
- Yu-Hsiang Hu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Electrical component having an electrical connection arrangement an...
- Patent number 8,923,005
- Issue date Dec 30, 2014
- Micro Systems Engineering GmbH
- Rainer Dohle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip semiconductor device having anisotropic electrical interc...
- Patent number 8,546,942
- Issue date Oct 1, 2013
- Powertech Technology Inc.
- Hian-Hang Mah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microspring structures adapted for target device cooling
- Patent number 8,525,353
- Issue date Sep 3, 2013
- Palo Alto Research Center Incorporated
- Eugene M. Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Airgap micro-spring interconnect with bonded underfill seal
- Patent number 8,399,296
- Issue date Mar 19, 2013
- Palo Alto Research Center Incorporated
- Christopher L. Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Airgap micro-spring interconnect with bonded underfill seal
- Patent number 8,039,938
- Issue date Oct 18, 2011
- Palo Alto Research Center Incorporated
- Christopher L. Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for improving thermal energy dissipation in a...
- Patent number 7,817,434
- Issue date Oct 19, 2010
- Agere Systems Inc.
- James M. Hattis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of making microelectronic assemblies using compressed resil...
- Patent number 6,716,671
- Issue date Apr 6, 2004
- Tessera, Inc.
- Mike Warner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Micro-Spring Chip Attachment Using Solder-Based Interconnect Struct...
- Publication number 20140374912
- Publication date Dec 25, 2014
- John C. Knights
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING A GRAPHENE SHEET TO METAL CONTACT BUMPS OF...
- Publication number 20140166194
- Publication date Jun 19, 2014
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE AND MOUNTING METHOD
- Publication number 20130220688
- Publication date Aug 29, 2013
- NEC Corporation
- Masahiro Kubo
- G02 - OPTICS
Information Patent Application
Microspring Structures Adapted for Target Device Cooling
- Publication number 20130154127
- Publication date Jun 20, 2013
- Palo Alto Research Center Incorporated
- Eugene M. Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INTERCONNECT
- Publication number 20130105993
- Publication date May 2, 2013
- GENERAL ELECTRIC COMPANY
- Raj BAHADUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP SEMICONDUCTOR DEVICE HAVING ANISOTROPIC ELECTRICAL INTERC...
- Publication number 20130026625
- Publication date Jan 31, 2013
- Hian-Hang MAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Component Having an Electrical Connection Arrangement an...
- Publication number 20120212918
- Publication date Aug 23, 2012
- MICRO SYSTEMS ENGINEERING GMBH
- Rainer Dohle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CYLINDRICAL PACKAGES, ELECTRONIC APPARATUS INCLUDING THE SAME, AND...
- Publication number 20120127660
- Publication date May 24, 2012
- Hynix Semiconductor Inc.
- Kang Won LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AIRGAP MICRO-SPRING INTERCONNECT WITH BONDED UNDERFILL SEAL
- Publication number 20120088330
- Publication date Apr 12, 2012
- PALO ALTO RESEARCH CENTER INCORPORATED
- Christopher L. Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIRGAP MICRO-SPRING INTERCONNECT WITH BONDED UNDERFILL SEAL
- Publication number 20100295164
- Publication date Nov 25, 2010
- Palo Alto Research Center Incorporated
- Christopher L. Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for improving thermal energy dissipation in a...
- Publication number 20060211461
- Publication date Sep 21, 2006
- Agere Systems Inc.
- James M. Hattis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of making microelectronic assemblies using compressed resil...
- Publication number 20010049158
- Publication date Dec 6, 2001
- Mike Warner
- H01 - BASIC ELECTRIC ELEMENTS

by means of another bump connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Mounting structure and mounting method

Method for transferring a graphene sheet to metal contact bumps of...

Electrical component having an electrical connection arrangement an...

Flip-chip semiconductor device having anisotropic electrical interc...

Microspring structures adapted for target device cooling

Airgap micro-spring interconnect with bonded underfill seal

Airgap micro-spring interconnect with bonded underfill seal

Method and apparatus for improving thermal energy dissipation in a...

Methods of making microelectronic assemblies using compressed resil...

Patents Applicationslast 30 patents

Micro-Spring Chip Attachment Using Solder-Based Interconnect Struct...

METHOD FOR TRANSFERRING A GRAPHENE SHEET TO METAL CONTACT BUMPS OF...

MOUNTING STRUCTURE AND MOUNTING METHOD

Microspring Structures Adapted for Target Device Cooling

SEMICONDUCTOR DEVICE INTERCONNECT

FLIP-CHIP SEMICONDUCTOR DEVICE HAVING ANISOTROPIC ELECTRICAL INTERC...

Electrical Component Having an Electrical Connection Arrangement an...

CYLINDRICAL PACKAGES, ELECTRONIC APPARATUS INCLUDING THE SAME, AND...

AIRGAP MICRO-SPRING INTERCONNECT WITH BONDED UNDERFILL SEAL

AIRGAP MICRO-SPRING INTERCONNECT WITH BONDED UNDERFILL SEAL

Method and apparatus for improving thermal energy dissipation in a...

Methods of making microelectronic assemblies using compressed resil...