by means of another layer connector

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H01L2224/83902

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83902by means of another layer connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,545
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,547
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,546
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,302
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,306
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,476,216
- Issue date Oct 18, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Smart card module arrangement, smart card, method for producing a s...
- Patent number 10,395,157
- Issue date Aug 27, 2019
- Infineon Technologies AG
- Frank Pueschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Micro-pillar assisted semiconductor bonding
- Patent number 10,319,693
- Issue date Jun 11, 2019
- Skorpios Technologies, Inc.
- Damien Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for connecting joining parts
- Patent number 9,502,376
- Issue date Nov 22, 2016
- Osram Opto Semiconductors GmbH
- Andreas Plöβl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of joining semiconductor substrate
- Patent number 9,312,227
- Issue date Apr 12, 2016
- Hyundai Motor Company
- Ilseon Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a method for manufacturing a chip package
- Patent number 8,815,647
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting structure
- Patent number 8,497,432
- Issue date Jul 30, 2013
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical interconnection by a composite medium
- Patent number 5,045,249
- Issue date Sep 3, 1991
- AT&T Bell Laboratories
- Sungho Jin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139856
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139857
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Connecting Joining Parts
- Publication number 20160027759
- Publication date Jan 28, 2016
- Osram Opto Semiconductors GmbH
- Andreas Plößl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF JOINING SEMICONDUCTOR SUBSTRATE
- Publication number 20150187704
- Publication date Jul 2, 2015
- Hyundai Motor Company
- Ilseon Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Smart card module arrangement, smart card, method for producing a s...
- Publication number 20150069132
- Publication date Mar 12, 2015
- INFINEON TECHNOLOGIES AG
- Frank PUESCHNER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140061669
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20100071946
- Publication date Mar 25, 2010
- SEIKO EPSON CORPORATION
- Nobuaki HASHIMOTO
- G02 - OPTICS

by means of another layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Selective transfer of micro devices

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Smart card module arrangement, smart card, method for producing a s...

Micro-pillar assisted semiconductor bonding

Process for connecting joining parts

Method of joining semiconductor substrate

Chip package and a method for manufacturing a chip package

Electronic component mounting structure

Electrical interconnection by a composite medium

Patents Applicationslast 30 patents

SELECTIVE TRANSFER OF MICRO DEVICES

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

Process for Connecting Joining Parts

METHOD OF JOINING SEMICONDUCTOR SUBSTRATE

Smart card module arrangement, smart card, method for producing a s...

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

ELECTRONIC COMPONENT MOUNTING STRUCTURE