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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
High-speed, high-resolution electrophysiology in-vivo using conform...
- Patent number 10,918,298
- Issue date Feb 16, 2021
- The Board of Trustees of the University of Illinois
- John A. Rogers
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Power electronics assembly having an adhesion layer, and method for...
- Patent number 10,665,562
- Issue date May 26, 2020
- Semikron Elektronik GmbH & Co. KG
- Ulrich Sagebaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for the material-bonded connection of connection partners...
- Patent number 10,603,741
- Issue date Mar 31, 2020
- Semikron Elektronik GmbH & Co., KG
- Ingo Bogen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for bending a substrate
- Patent number 10,600,658
- Issue date Mar 24, 2020
- Infineon Technologies AG
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing a semiconductor substrate
- Patent number 10,475,668
- Issue date Nov 12, 2019
- Infineon Technologies AG
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic probe
- Patent number 10,143,441
- Issue date Dec 4, 2018
- SOCIONEXT INC.
- Masato Yoshioka
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
3608809
- Patent number 3,608,809
- Issue date Sep 28, 1971
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THERMOCOMPRESSION BONDING DEVICE
- Publication number 20200411466
- Publication date Dec 31, 2020
- Sakai Display Products Corporation
- YOHICHIROH SAKAKI
- G02 - OPTICS
Information Patent Application
Apparatus and Method for Bending a Substrate
- Publication number 20200027752
- Publication date Jan 23, 2020
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Speed, High-Resolution Electrophysiology In-Vivo Using Conform...
- Publication number 20120157804
- Publication date Jun 21, 2012
- John A. ROGERS
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

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Patents Grantslast 30 patents

High-speed, high-resolution electrophysiology in-vivo using conform...

Power electronics assembly having an adhesion layer, and method for...

Apparatus for the material-bonded connection of connection partners...

Apparatus and method for bending a substrate

Apparatus and method for processing a semiconductor substrate

Ultrasonic probe

3608809

Patents Applicationslast 30 patents

THERMOCOMPRESSION BONDING DEVICE

Apparatus and Method for Bending a Substrate

High-Speed, High-Resolution Electrophysiology In-Vivo Using Conform...