3608809

Information

• Patent Grant
• 3608809

• References
• Source

• Patent Number

  3,608,809

• Date Filed

  Not available

• Date Issued

  Tuesday, September 28, 1971
  53 years ago

• CPC

  • H01L21/67144 - Apparatus for mounting on conductive members
  • B23K20/02 - by means of a press; Diffusion bonding
  • B23K20/025 - Bonding tips therefor
  • B23K20/106 - Features related to sonotrodes
  • H01L21/67138 - Apparatus for wiring semiconductor or solid state device
  • H01L2224/75986 - Auxiliary members on the pressing surface
  • H01L2224/79 - Apparatus for Tape Automated Bonding [TAB]
  • H01L2224/79318 - Shape of the auxiliary member
  • H01L2224/7932 - Material of the auxiliary member
  • H01L2224/79987 - Shape of the auxiliary member
  • H01L2224/79988 - Material of the auxiliary member
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01014 - Silicon [Si]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01029 - Copper [Cu]
  • H01L2924/0103 - Zinc [Zn]
  • H01L2924/01032 - Germanium [Ge]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01049 - Indium [In]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/09701 - Low temperature co-fired ceramic [LTCC]

• US Classifications

  • 228 - Metal fusion bonding
  • 101 - Printing
  • 156 - Adhesive bonding and miscellaneous chemical manufacture
  • 219 - Electric heating
  • 269 - Work holders
  • 425 - Plastic article or earthenware shaping or treating: apparatus