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H01L2224/773
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/773
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Patents Grants
last 30 patents
Information
Patent Grant
Photoelectric conversion device and manufacturing method and appara...
Patent number
10,950,391
Issue date
Mar 16, 2021
Kabushiki Kaisha Toshiba
Shigehiko Mori
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Curtain airbag device mounting structure and curtain airbag deploym...
Patent number
10,723,306
Issue date
Jul 28, 2020
Toyota Jidosha Kabushiki Kaisha
Takamichi Komura
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Ultrasonic probe
Patent number
10,143,441
Issue date
Dec 4, 2018
SOCIONEXT INC.
Masato Yoshioka
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Grant
Ultrasonic bonding systems and methods of using the same
Patent number
8,746,537
Issue date
Jun 10, 2014
Orthodyne Electronics Corporation
Christoph B. Luechinger
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
FLEX BONDED INTEGRATED CIRCUITS
Publication number
20230299035
Publication date
Sep 21, 2023
META PLATFORMS, INC.
Sandeep Rekhi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME
Publication number
20140048584
Publication date
Feb 20, 2014
Orthodyne Electronics Corporation
Christoph B. Luechinger
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METAL BONDING APPARATUS
Publication number
20130284794
Publication date
Oct 31, 2013
Sanyo Electric Co., Ltd.
Takashi SUZUKI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR