by mechanical means

Industry

CPC
H01L2224/81947

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81947by mechanical means

Industries

Patents Grantslast 30 patents

Information Patent Grant
Module and method of manufacturing module
- Patent number 11,276,631
- Issue date Mar 15, 2022
- Murata Manufacturing Co., Ltd.
- Yoshitaka Matsukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated circuit (3DIC) structure
- Patent number 11,239,201
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded 3D integrated circuit (3DIC) structure
- Patent number 10,319,701
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump stretching method for forming a solder bump joint in a...
- Patent number 9,978,709
- Issue date May 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming low stress joints using thermal compress bonding
- Patent number 8,616,433
- Issue date Dec 31, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compress bonding
- Patent number 8,556,158
- Issue date Oct 15, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with plank stack of semiconductor dies
- Patent number 8,390,109
- Issue date Mar 5, 2013
- Oracle America, Inc.
- Darko R. Popovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal compress bonding
- Patent number 8,381,965
- Issue date Feb 26, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming low stress joints using thermal compress bonding
- Patent number 8,360,303
- Issue date Jan 29, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230268316
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Yueh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT (3DIC) STRUCTURE
- Publication number 20230230962
- Publication date Jul 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT (3DIC) STRUCTURE
- Publication number 20220157785
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE AND METHOD OF MANUFACTURING MODULE
- Publication number 20200118913
- Publication date Apr 16, 2020
- MURATA MANUFACTURING CO., LTD.
- Yoshitaka MATSUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT (3DIC) STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20190295989
- Publication date Sep 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE DEVICE AND CAVITY FORMATION BY SOLDER REMOVAL FO...
- Publication number 20160351522
- Publication date Dec 1, 2016
- FREESCALE SEMICONDUCTOR, INC.
- MICHAEL B. VINCENT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT (3DIC) STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20160197055
- Publication date Jul 7, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Compress Bonding
- Publication number 20130126591
- Publication date May 23, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Low Stress Joints Using Thermal Compress Bonding
- Publication number 20130128486
- Publication date May 23, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE WITH PLANK STACK OF SEMICONDUCTOR DIES
- Publication number 20120211878
- Publication date Aug 23, 2012
- Oracle International Corporation
- Darko R. Popovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Low Stress Joints Using Thermal Compress Bonding
- Publication number 20120021183
- Publication date Jan 26, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Compress Bonding
- Publication number 20120018494
- Publication date Jan 26, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- H01 - BASIC ELECTRIC ELEMENTS

by mechanical means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Module and method of manufacturing module

3D integrated circuit (3DIC) structure

Bonded 3D integrated circuit (3DIC) structure

Solder bump stretching method for forming a solder bump joint in a...

Forming low stress joints using thermal compress bonding

Thermal compress bonding

Chip package with plank stack of semiconductor dies

Thermal compress bonding

Forming low stress joints using thermal compress bonding

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE

MODULE AND METHOD OF MANUFACTURING MODULE

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE AND METHOD OF MAKING SAME

PACKAGE-ON-PACKAGE DEVICE AND CAVITY FORMATION BY SOLDER REMOVAL FO...

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE AND METHOD OF MAKING SAME

Thermal Compress Bonding

Forming Low Stress Joints Using Thermal Compress Bonding

CHIP PACKAGE WITH PLANK STACK OF SEMICONDUCTOR DIES

Forming Low Stress Joints Using Thermal Compress Bonding

Thermal Compress Bonding