by patterning a pre-deposited material

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H01L2224/116

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/116by patterning a pre-deposited material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Pre-molded leadframes in semiconductor devices
- Patent number 12,191,273
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure comprising up-narrow and down-wide openings...
- Patent number 12,191,271
- Issue date Jan 7, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes in semiconductor devices
- Patent number 12,183,703
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro bump, method for forming micro bump, chip interconnection str...
- Patent number 12,176,311
- Issue date Dec 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and preparation methods thereof
- Patent number 12,132,022
- Issue date Oct 29, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned pattern formation post spacer etchback in tight pitch...
- Patent number 12,106,963
- Issue date Oct 1, 2024
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supporting backplane, manufacturing method therefor and backplane
- Patent number 12,087,892
- Issue date Sep 10, 2024
- BOE Technology Group Co., Ltd.
- Zhiwei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive terminal for side facing packages
- Patent number 12,080,667
- Issue date Sep 3, 2024
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and semiconductor device
- Patent number 12,051,662
- Issue date Jul 30, 2024
- Rohm Co., Ltd.
- Masatoshi Aketa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional stacking semiconductor assemblies with near zero...
- Patent number 12,027,498
- Issue date Jul 2, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,021,050
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Ho Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for forming solder bumps
- Patent number 11,990,437
- Issue date May 21, 2024
- International Business Machines Corporation
- Eric Peter Lewandowski
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure with a barrier layer
- Patent number 11,984,419
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having stepped conductive pillars
- Patent number 11,955,447
- Issue date Apr 9, 2024
- Advanced Micro Devices, Inc.
- Suming Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
- Patent number 11,908,819
- Issue date Feb 20, 2024
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive traces in semiconductor devices and methods of forming same
- Patent number 11,894,299
- Issue date Feb 6, 2024
- TAIWAN SEMICONDUCTOR LTD
- Chao-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including stress-resistant bonding structures and...
- Patent number 11,887,955
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,876,064
- Issue date Jan 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of manufacturing the same
- Patent number 11,862,587
- Issue date Jan 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Mark Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,842,992
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing pillar structures on semicond...
- Patent number 11,735,549
- Issue date Aug 22, 2023
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall wetting barrier for conductive pillars
- Patent number 11,694,982
- Issue date Jul 4, 2023
- QUALCOMM Incorporated
- Wei Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated pillar dies having integrated electromagnetic shield layers
- Patent number 11,694,970
- Issue date Jul 4, 2023
- NXP B.V.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned pattern formation post spacer etchback in tight pitch...
- Patent number 11,670,510
- Issue date Jun 6, 2023
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes for forming self-healing solder joints and repair of same...
- Patent number 11,646,286
- Issue date May 9, 2023
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of a semiconductor chip and semiconductor...
- Patent number 11,626,370
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
- Patent number 11,545,455
- Issue date Jan 3, 2023
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion beam lithography method based on ion beam lithography system
- Patent number 11,538,653
- Issue date Dec 27, 2022
- Beijing Normal University
- Bin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure with a barrier layer
- Patent number 11,469,203
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and associated semiconduc...
- Patent number 11,469,198
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Ho Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250031434
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES
- Publication number 20240413113
- Publication date Dec 12, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND A PACKAGING METHOD
- Publication number 20240371812
- Publication date Nov 7, 2024
- STATS ChipPAC Pte Ltd.
- MyungHo JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES WITH NEAR ZERO...
- Publication number 20240355783
- Publication date Oct 24, 2024
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE
- Publication number 20240339421
- Publication date Oct 10, 2024
- ROHM CO., LTD.
- Masatoshi AKETA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312939
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-HO TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH A BARRIER LAYER
- Publication number 20240297138
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING STEPPED CONDUCTIVE PILLARS
- Publication number 20240250051
- Publication date Jul 25, 2024
- ADVANCED MICRO DEVICES, INC.
- SUMING HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF
- Publication number 20240243057
- Publication date Jul 18, 2024
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE VARIATION IN HEIGHT OF BUMPS AFTER...
- Publication number 20240243087
- Publication date Jul 18, 2024
- Intel Corporation
- Ryan Joseph Carrazzone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240234357
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- JEONGWEON SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE DEVICE, SEMICONDUCTOR PA...
- Publication number 20240170431
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Chang-Kun KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING DIELECTRIC LAYER ON SURFACE OF WAFER, WAFER ST...
- Publication number 20240162161
- Publication date May 16, 2024
- CHIPMORE TECHNOLOGY CORPORATION LIMITED
- Guanmeng XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128217
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...
- Publication number 20240128219
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...
- Publication number 20240105670
- Publication date Mar 28, 2024
- CYNTEC CO., LTD.
- Chi-Hung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...
- Publication number 20240096627
- Publication date Mar 21, 2024
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION METHOD
- Publication number 20240055382
- Publication date Feb 15, 2024
- Rohm and Haas Electronic Materials L.L.C.
- Mitsuru Haga
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING COPPER PILLAR WITHIN SOLDER BUMP AND...
- Publication number 20240006360
- Publication date Jan 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING PACKAGE STRUCTURE
- Publication number 20230420343
- Publication date Dec 28, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Huifang DAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION METHOD
- Publication number 20230420401
- Publication date Dec 28, 2023
- Rohm and Haas Electronic Materials L.L.C.
- Mitsuru Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric Blocking Layer and Method Forming the Same
- Publication number 20230411329
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING
- Publication number 20230402417
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES
- Publication number 20230268302
- Publication date Aug 24, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE OF A SEMICONDUCTOR CHIP AND METHOD OF MAN...
- Publication number 20230253336
- Publication date Aug 10, 2023
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20230223369
- Publication date Jul 13, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING STEPPED CONDUCTIVE PILLARS
- Publication number 20230154878
- Publication date May 18, 2023
- ADVANCED MICRO DEVICES, INC.
- SUMING HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MEMBERS WITH UNOBSTRUCTED INTERFACIAL AREA FOR DIE ATTAC...
- Publication number 20230137996
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Christlyn Faith Arias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTING BACKPLANE, MANUFACTURING METHOD THEREFOR AND BACKPLANE
- Publication number 20230131247
- Publication date Apr 27, 2023
- BOE TECHNOLOGY GROUP CO., LTD.
- Zhiwei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING CHEMICALLY COATED BUMP BONDS
- Publication number 20230123307
- Publication date Apr 20, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS

by patterning a pre-deposited material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pre-molded leadframes in semiconductor devices

Semiconductor structure comprising up-narrow and down-wide openings...

Leadframes in semiconductor devices

Micro bump, method for forming micro bump, chip interconnection str...

Semiconductor devices and preparation methods thereof

Self aligned pattern formation post spacer etchback in tight pitch...

Supporting backplane, manufacturing method therefor and backplane

Conductive terminal for side facing packages

Electronic component and semiconductor device

Three-dimensional stacking semiconductor assemblies with near zero...

Semiconductor device

System and method for forming solder bumps

Package structure with a barrier layer

Semiconductor chip having stepped conductive pillars

Semiconductor packaging substrate fine pitch metal bump and reinfor...

Conductive traces in semiconductor devices and methods of forming same

Semiconductor die including stress-resistant bonding structures and...

Semiconductor structure and manufacturing method thereof

Semiconductor package structure and method of manufacturing the same

Seal ring structures and methods of forming same

Methods and systems for manufacturing pillar structures on semicond...

Sidewall wetting barrier for conductive pillars

Plated pillar dies having integrated electromagnetic shield layers

Self aligned pattern formation post spacer etchback in tight pitch...

Processes for forming self-healing solder joints and repair of same...

Interconnection structure of a semiconductor chip and semiconductor...

Semiconductor packaging substrate fine pitch metal bump and reinfor...

Ion beam lithography method based on ion beam lithography system

Method for forming package structure with a barrier layer

Semiconductor device manufacturing method and associated semiconduc...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES

ELECTRONIC PACKAGE AND A PACKAGING METHOD

THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES WITH NEAR ZERO...

ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE WITH A BARRIER LAYER

SEMICONDUCTOR CHIP HAVING STEPPED CONDUCTIVE PILLARS

INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF

METHODS AND APPARATUS TO REDUCE VARIATION IN HEIGHT OF BUMPS AFTER...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE DEVICE, SEMICONDUCTOR PA...

METHOD FOR PREPARING DIELECTRIC LAYER ON SURFACE OF WAFER, WAFER ST...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...

ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...

SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...

METALLIZATION METHOD

SEMICONDUCTOR STRUCTURE HAVING COPPER PILLAR WITHIN SOLDER BUMP AND...

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING PACKAGE STRUCTURE

METALLIZATION METHOD

Dielectric Blocking Layer and Method Forming the Same

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING

CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES

INTERCONNECTION STRUCTURE OF A SEMICONDUCTOR CHIP AND METHOD OF MAN...

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

SEMICONDUCTOR CHIP HAVING STEPPED CONDUCTIVE PILLARS

CONDUCTIVE MEMBERS WITH UNOBSTRUCTED INTERFACIAL AREA FOR DIE ATTAC...

SUPPORTING BACKPLANE, MANUFACTURING METHOD THEREFOR AND BACKPLANE

ELECTRONIC DEVICE HAVING CHEMICALLY COATED BUMP BONDS