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H01L2224/95146

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/95146by surface tension

Industries

Patents Grantslast 30 patents

Information Patent Grant
Micro light emitting device array and method of manufacturing the s...
- Patent number 12,166,021
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and fluidic manufacture thereof
- Patent number 11,721,792
- Issue date Aug 8, 2023
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro light emitting device array and method of manufacturing the same
- Patent number 11,610,872
- Issue date Mar 21, 2023
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing assembly pads on a carrier for the self-a...
- Patent number 11,380,648
- Issue date Jul 5, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Léa Di Cioccio
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor chip transfer method and transfer tool
- Patent number 11,114,411
- Issue date Sep 7, 2021
- OSRAM OLED GmbH
- Thomas Schwarz
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Automatic registration between circuit dies and interconnects
- Patent number 10,971,468
- Issue date Apr 6, 2021
- 3M Innovative Properties Company
- Ankit Mahajan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming complex electronic circuits by interconnecting g...
- Patent number 10,964,665
- Issue date Mar 30, 2021
- Nthdegree Technologies Worldwide, Inc.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring micro device
- Patent number 10,937,674
- Issue date Mar 2, 2021
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and fluidic manufacture thereof
- Patent number 10,930,819
- Issue date Feb 23, 2021
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for mass arrangement of micro-component devices
- Patent number 10,748,792
- Issue date Aug 18, 2020
- MAVEN OPTRONICS CO., LTD.
- Chieh Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printing complex electronic circuits using a printable solution def...
- Patent number 10,499,499
- Issue date Dec 3, 2019
- NthDegree Technologies Worldwide Inc.
- William Johnstone Ray
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for direct bonding with self-alignment using ultrasound
- Patent number 10,438,921
- Issue date Oct 8, 2019
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Frank Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for self-alignment of integrated circuit dies
- Patent number 10,431,515
- Issue date Oct 1, 2019
- Marvell World Trade Ltd.
- Long-Ching Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method to neutralize incorrectly oriented printed diodes
- Patent number 10,412,833
- Issue date Sep 10, 2019
- NthDegree Technologies Worldwide Inc.
- Richard Austin Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor chip
- Patent number 10,354,973
- Issue date Jul 16, 2019
- TDK Corporation
- Makoto Orikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and fluidic manufacture thereof
- Patent number 10,230,020
- Issue date Mar 12, 2019
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor package
- Patent number 10,163,847
- Issue date Dec 25, 2018
- TDK Corporation
- Makoto Orikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual solder layer for fluidic self assembly and electrical componen...
- Patent number 10,039,194
- Issue date Jul 31, 2018
- OSRAM SYLVANIA Inc.
- Jeffery Serre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing pattern substrate and method of locating co...
- Patent number 10,005,663
- Issue date Jun 26, 2018
- Konica Minolta, Inc.
- Naoki Yamamoto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for assembling a component with a flexible foi...
- Patent number 9,918,392
- Issue date Mar 13, 2018
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Gari Arutinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printing complex electronic circuits using a patterned hydrophobic...
- Patent number 9,913,371
- Issue date Mar 6, 2018
- NthDegree Technologies Worldwide Inc.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture of wafer—panel die package assembly technology
- Patent number 9,893,047
- Issue date Feb 13, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arranging method
- Patent number 9,806,057
- Issue date Oct 31, 2017
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method for forming a carrier having inward side walls in pa...
- Patent number 9,586,207
- Issue date Mar 7, 2017
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Sebastien Mermoz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Printing complex electronic circuits
- Patent number 9,572,249
- Issue date Feb 14, 2017
- Nthdegree Technologies Worldwide Inc.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip support substrate, chip support method, three-dimensional inte...
- Patent number 9,449,948
- Issue date Sep 20, 2016
- Tohoku University
- Mitsumasa Koyanagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for fluid guided self-assembly of microcomponents
- Patent number 9,408,312
- Issue date Aug 2, 2016
- IMEC
- Ann Witvrouw
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fluid guided self-assembly of microcomponents
- Patent number 9,196,603
- Issue date Nov 24, 2015
- IMEC
- Ann Witvrouw
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip-to-wafer bonding method and three-dimensional integrated semic...
- Patent number 8,697,543
- Issue date Apr 15, 2014
- Semiconductor Manufacturing International (Beijing) Corporation
- Yunqi Sui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of attaching die using self-assembling monolayer and package...
- Patent number 8,656,582
- Issue date Feb 25, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Seung Seoup Lee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429198
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR SELF-ALIGNING BATCH PICK AND PLACE DIE BO...
- Publication number 20240429199
- Publication date Dec 26, 2024
- Intel Corporation
- Yi Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LIGHT EMITTING DEVICE ARRAY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230084493
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR ARRANGEMENT
- Publication number 20230005877
- Publication date Jan 5, 2023
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED-POSITION-ALIGNING METHOD FOR TRANSFERRING CHIP AND SYSTEM...
- Publication number 20220189911
- Publication date Jun 16, 2022
- Yu-Jung WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LIGHT EMITTING DEVICE ARRAY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220122953
- Publication date Apr 21, 2022
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20220068876
- Publication date Mar 3, 2022
- SAMSUNG DISPLAY CO., LTD.
- Young Rag DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP TRANSFER METHOD AND TRANSFER TOOL
- Publication number 20190252350
- Publication date Aug 15, 2019
- Thomas Schwarz
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Light Emitting Device and Fluidic Manufacture Thereof
- Publication number 20190181304
- Publication date Jun 13, 2019
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR CHIP
- Publication number 20190013293
- Publication date Jan 10, 2019
- TDK Corporation
- Makoto ORIKASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
- Publication number 20180254255
- Publication date Sep 6, 2018
- TDK Corporation
- Makoto ORIKASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DIRECT BONDING WITH SELF-ALIGNMENT USING ULTRASOUND
- Publication number 20180218997
- Publication date Aug 2, 2018
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frank FOURNEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURE OF WAFER - PANEL DIE PACKAGE ASSEMBLY TECHNOLOGY
- Publication number 20170221872
- Publication date Aug 3, 2017
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SUPPORT SUBSTRATE, CHIP SUPPORT METHOD, THREE-DIMENSIONAL INTE...
- Publication number 20150228622
- Publication date Aug 13, 2015
- TOHOKU UNIVERSITY
- Mitsumasa Koyanagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUITRY CONFIGURABLE BASED ON DEVICE ORIENTATION
- Publication number 20140332825
- Publication date Nov 13, 2014
- Osram Sylvania Inc.
- Jeffery J. Serre
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTING COMPLEX ELECTRONIC CIRCUITS
- Publication number 20140268591
- Publication date Sep 18, 2014
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A CHIP HAVING A WATER-REPELLENT OBVERSE SURF...
- Publication number 20140080261
- Publication date Mar 20, 2014
- PANASONIC CORPORATION
- Hidekazu ARASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-TO-WAFER BONDING METHOD AND THREE-DIMENSIONAL INTEGRATED SEMIC...
- Publication number 20130147059
- Publication date Jun 13, 2013
- Semiconductor Manufacturing International (Beijing) Corporation
- YUNQI SUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer Wafer Bonding Method and Apparatus
- Publication number 20130140713
- Publication date Jun 6, 2013
- Taiwan Semiconductro Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING METHOD AND MOUNTING DEVICE
- Publication number 20120291950
- Publication date Nov 22, 2012
- TOKYO ELECTRON LIMITED
- Masahiko Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR FLUID GUIDED SELF-ASSEMBLY OF MICROCOMPONENTS
- Publication number 20120285010
- Publication date Nov 15, 2012
- IMEC
- Ann Witvrouw
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR DISPOSING A COMPONENT
- Publication number 20120207930
- Publication date Aug 16, 2012
- PANASONIC CORPORATION
- Hidekazu ARASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING THREE-DIMENSIONAL INTEGRATED...
- Publication number 20120021563
- Publication date Jan 26, 2012
- TOHOKU UNIVERSITY
- Mitsumasa Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DISPOSING A COMPONENT
- Publication number 20110229642
- Publication date Sep 22, 2011
- PANASONIC CORPORATION
- Hidekazu ARASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLY OF CHIPS ON A SUBSTRATE
- Publication number 20110033976
- Publication date Feb 10, 2011
- COMMISS. A L'ENERGIE ATOM ET AUX ENERG ALTERNA
- Lea Di Cioccio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ATTACHING DIE USING SELF-ASSEMBLING MONOLAYER AND PACKAGE...
- Publication number 20100187002
- Publication date Jul 29, 2010
- Seung Seoup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MOUNTING ELECTRONIC CIRCUIT CONSTITUTING MEMBER AND RELEV...
- Publication number 20100147441
- Publication date Jun 17, 2010
- PANASONIC CORPORATION
- Tohru NAKAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Assembled Electrical Contacts
- Publication number 20100139954
- Publication date Jun 10, 2010
- Christopher J. Morris
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF MOUNTING ELECTRONIC CIRCUIT CONSTITUTING MEMBER AND RELEV...
- Publication number 20090265929
- Publication date Oct 29, 2009
- Matsushita Electric Industrial Co., Ltd.
- Tohru Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus For Aligning Microchips On Substrate And Method For The Same
- Publication number 20070269914
- Publication date Nov 22, 2007
- National Tsing-Hua University
- J. Andrew Yeh
- H01 - BASIC ELECTRIC ELEMENTS

by surface tension

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Micro light emitting device array and method of manufacturing the s...

Light emitting device and fluidic manufacture thereof

Micro light emitting device array and method of manufacturing the same

Process for manufacturing assembly pads on a carrier for the self-a...

Semiconductor chip transfer method and transfer tool

Automatic registration between circuit dies and interconnects

Method for forming complex electronic circuits by interconnecting g...

Method for transferring micro device

Light emitting device and fluidic manufacture thereof

Method and system for mass arrangement of micro-component devices

Printing complex electronic circuits using a printable solution def...

Method for direct bonding with self-alignment using ultrasound

Methods and apparatus for self-alignment of integrated circuit dies

Method to neutralize incorrectly oriented printed diodes

Method for producing semiconductor chip

Light emitting device and fluidic manufacture thereof

Method for producing semiconductor package

Dual solder layer for fluidic self assembly and electrical componen...

Method of manufacturing pattern substrate and method of locating co...

Method and apparatus for assembling a component with a flexible foi...

Printing complex electronic circuits using a patterned hydrophobic...

Manufacture of wafer—panel die package assembly technology

Chip arranging method

Etching method for forming a carrier having inward side walls in pa...

Printing complex electronic circuits

Chip support substrate, chip support method, three-dimensional inte...

Apparatus for fluid guided self-assembly of microcomponents

Method for fluid guided self-assembly of microcomponents

Chip-to-wafer bonding method and three-dimensional integrated semic...

Method of attaching die using self-assembling monolayer and package...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHODS AND APPARATUS FOR SELF-ALIGNING BATCH PICK AND PLACE DIE BO...

MICRO LIGHT EMITTING DEVICE ARRAY AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING A SEMICONDUCTOR ARRANGEMENT

AUTOMATED-POSITION-ALIGNING METHOD FOR TRANSFERRING CHIP AND SYSTEM...

MICRO LIGHT EMITTING DEVICE ARRAY AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR CHIP TRANSFER METHOD AND TRANSFER TOOL

Light Emitting Device and Fluidic Manufacture Thereof

METHOD FOR PRODUCING SEMICONDUCTOR CHIP

METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE

METHOD FOR DIRECT BONDING WITH SELF-ALIGNMENT USING ULTRASOUND

MANUFACTURE OF WAFER - PANEL DIE PACKAGE ASSEMBLY TECHNOLOGY

CHIP SUPPORT SUBSTRATE, CHIP SUPPORT METHOD, THREE-DIMENSIONAL INTE...

CIRCUITRY CONFIGURABLE BASED ON DEVICE ORIENTATION

PRINTING COMPLEX ELECTRONIC CIRCUITS

METHOD FOR FABRICATING A CHIP HAVING A WATER-REPELLENT OBVERSE SURF...

CHIP-TO-WAFER BONDING METHOD AND THREE-DIMENSIONAL INTEGRATED SEMIC...

Interposer Wafer Bonding Method and Apparatus

MOUNTING METHOD AND MOUNTING DEVICE

METHOD AND APPARATUS FOR FLUID GUIDED SELF-ASSEMBLY OF MICROCOMPONENTS

METHOD FOR DISPOSING A COMPONENT

METHOD AND APPARATUS FOR MANUFACTURING THREE-DIMENSIONAL INTEGRATED...

METHOD FOR DISPOSING A COMPONENT

SELF-ASSEMBLY OF CHIPS ON A SUBSTRATE

METHOD OF ATTACHING DIE USING SELF-ASSEMBLING MONOLAYER AND PACKAGE...

METHOD OF MOUNTING ELECTRONIC CIRCUIT CONSTITUTING MEMBER AND RELEV...

Self-Assembled Electrical Contacts

METHOD OF MOUNTING ELECTRONIC CIRCUIT CONSTITUTING MEMBER AND RELEV...

Apparatus For Aligning Microchips On Substrate And Method For The Same