by tools other than rotary type

Industry

CPC
B28D5/04

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B28Stoneworking B28DWORKING STONE OR STONE-LIKE MATERIALS B28D5/00Fine working of gems, jewels, crystals

Current Industry

B28D5/04by tools other than rotary type

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for separating a plurality of slices from workpieces by mean...
- Patent number 12,311,455
- Issue date May 27, 2025
- Siltronic AG
- Axel Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for simultaneously slicing a multiplicity of s...
- Patent number 12,311,577
- Issue date May 27, 2025
- Siltronic AG
- Georg Pietsch
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for manufacturing monocrystalline silicon wafer containing a...
- Patent number 12,294,036
- Issue date May 6, 2025
- JINKO SOLAR CO., LTD.
- Xiaolong Bai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for cutting substrate wafer from indium phosphide crystal bar
- Patent number 12,285,819
- Issue date Apr 29, 2025
- THE 13TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION
- Yanlei Shi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for solving bright line scratched during lifting of large-si...
- Patent number 12,275,164
- Issue date Apr 15, 2025
- GUANGDONG JINWAN GOKIN SOLAR TECHNOLOGY CO., LTD
- Mingquan Fu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Workplate for Y-axis compensation of ingot and Y-axis compensation...
- Patent number 12,275,165
- Issue date Apr 15, 2025
- SK SILTRON CO., LTD.
- Ah Reum Kim
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for separating a plurality of slices from workpieces by mean...
- Patent number 12,275,079
- Issue date Apr 15, 2025
- Siltronic AG
- Peter Wiesner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for separating a plurality of slices from workpieces by mean...
- Patent number 12,251,767
- Issue date Mar 18, 2025
- Siltronic AG
- Peter Wiesner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for slicing ingot and wire saw
- Patent number 12,186,939
- Issue date Jan 7, 2025
- Shin-Etsu Handotai Co., Ltd.
- Keiichi Kanbayashi
- B24 - GRINDING POLISHING
Information Patent Grant
SiC wafer and manufacturing method for SiC wafer
- Patent number 12,139,813
- Issue date Nov 12, 2024
- Toyota Tsusho Corporation
- Masatake Nagaya
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for cutting silicon rod and apparatus for dimaond multi-wire...
- Patent number 12,122,067
- Issue date Oct 22, 2024
- Zhonghuan Advanced Semiconductor Technology Co., Ltd.
- Jiazhen Zheng
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Ingot wafering systems and methods for slicing a silicon ingot
- Patent number 12,115,699
- Issue date Oct 15, 2024
- GlobalWafers Co., Ltd.
- Chia Ming Liu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wire saw having dust collecting apparatus
- Patent number 12,109,729
- Issue date Oct 8, 2024
- EGUN CO., LTD.
- Sung Jun Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Acoustic cleaving apparatus and methods of acoustic cleaving
- Patent number 12,103,200
- Issue date Oct 1, 2024
- Crystal Sonic, Inc.
- Mariana Bertoni
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Cutting method
- Patent number 12,097,633
- Issue date Sep 24, 2024
- Disco Corporation
- Takashi Okamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ingot temperature controller and wire sawing device having same
- Patent number 12,090,685
- Issue date Sep 17, 2024
- SK SILTRON CO., LTD.
- Young Il Jin
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for producing semiconductor wafers using a wire saw, wire sa...
- Patent number 12,083,705
- Issue date Sep 10, 2024
- Siltronic AG
- Axel Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Monolayer graphene on non-polar face SiC substrate and control meth...
- Patent number 12,051,585
- Issue date Jul 30, 2024
- Tianjin University
- Lei Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of marking a diamond, markings formed from such methods and...
- Patent number 12,030,217
- Issue date Jul 9, 2024
- MASTER DYNAMIC LIMITED
- Yau Chuen Yiu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Manufacturing method of silicon carbide wafer, silicon carbide wafe...
- Patent number 11,969,917
- Issue date Apr 30, 2024
- SENIC INC.
- Jung-Gyu Kim
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Shaped saw wire with controlled curvature at bends
- Patent number 11,958,122
- Issue date Apr 16, 2024
- BEKAERT BINJIANG STEEL CORD CO., LTD.
- Alain Simonart
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for slicing workpiece and wire saw
- Patent number 11,958,160
- Issue date Apr 16, 2024
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spool with saw wire having elastic and plastic rotations
- Patent number 11,938,654
- Issue date Mar 26, 2024
- BEKAERT BINJIANG STEEL CORD CO., LTD.
- Wenxian Huang
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Indium phosphide substrate, semiconductor epitaxial wafer, and meth...
- Patent number 11,901,170
- Issue date Feb 13, 2024
- JX Metals Corporation
- Shunsuke Oka
- C30 - CRYSTAL GROWTH
Information Patent Grant
Indium phosphide substrate, semiconductor epitaxial wafer, and meth...
- Patent number 11,894,225
- Issue date Feb 6, 2024
- JX Metals Corporation
- Shunsuke Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for slicing ingot
- Patent number 11,878,385
- Issue date Jan 23, 2024
- Shin-Etsu Handotai Co., Ltd.
- Keiichi Kanbayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Wire saw, wire guide roll and method for simultaneously cutting a m...
- Patent number 11,878,359
- Issue date Jan 23, 2024
- Siltronic AG
- Georg Pietsch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wire saw apparatus and wire saw apparatus
- Patent number 11,806,827
- Issue date Nov 7, 2023
- Shin-Etsu Handotai Co., Ltd.
- Yoshihiro Usami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of recycling silicon swarf into electronic grade polysilico...
- Patent number 11,791,435
- Issue date Oct 17, 2023
- Maxeon Solar Pte. Ltd.
- Moon Chun
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Methods of recycling silicon swarf into electronic grade polysilico...
- Patent number 11,784,276
- Issue date Oct 10, 2023
- SunPower Corporation
- Moon Chun
- C01 - INORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
FULLY-AUTOMATIC MULTI-STATION CUTTING MACHINE AND METHOD FOR CUTTIN...
- Publication number 20250162199
- Publication date May 22, 2025
- Fujian Skystone Intelligent Equipment Co., Ltd.
- Haiwei LI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CRYSTAL WAFERING SYSTEM AND METHOD
- Publication number 20250162198
- Publication date May 22, 2025
- SCIENTIFIC VISUAL SA
- Frédéric Falise
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Semiconductor Crystal Wafer Manufacturing Device and Manufacturing...
- Publication number 20250144845
- Publication date May 8, 2025
- SUCCESS Co., Ltd.
- Shinsuke SAKAI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
GEMSTONE
- Publication number 20250107600
- Publication date Apr 3, 2025
- IDD LIMITED
- Ian B. Douglas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire Take-Up and Pay-Off Device and Slicing Machine
- Publication number 20250100186
- Publication date Mar 27, 2025
- QINGDAO GAOCE TECHNOLOGY CO., LTD
- Dang GUO
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SPRAYER FOR SQUARING CRYSTAL ROD AND CRYSTAL ROD SQUARING DEVICE
- Publication number 20250083357
- Publication date Mar 13, 2025
- TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
- Xiaopeng WANG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SEMICONDUCTOR PACKAGE CUTTING SYSTEM AND METHOD
- Publication number 20250083359
- Publication date Mar 13, 2025
- SEMES CO., LTD.
- Changhoon OK
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
UNDER-WIRE SPRAY CLEANING DEVICE FOR WIRE CUTTING MACHINE
- Publication number 20250073955
- Publication date Mar 6, 2025
- TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
- Yannan LI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
DIAMOND WIRE MULTI-WIRE CUTTING MACHINE AND CUTTING DEVICE THEREOF,...
- Publication number 20250058499
- Publication date Feb 20, 2025
- Hunan Yiyuan New Material Technology Co., Ltd
- Jiawei YANG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CUTTING DEVICE AND MULTI-WIRE CUTTING MACHINE INCLUDING CUTTING DEVICE
- Publication number 20250058500
- Publication date Feb 20, 2025
- Hunan Yiyuan New Material Technology Co., Ltd
- Jiawei YANG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR CUTTING SILICON INGOT
- Publication number 20250050542
- Publication date Feb 13, 2025
- SUMCO CORPORATION
- Daisuke HASHIMOTO
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CUTTING MONOCRYSTALLINE SILICON SQUARE ROD
- Publication number 20250033247
- Publication date Jan 30, 2025
- TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
- Jianhua ZHANG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
INTELLIGENT MONITORING SYSTEM AND METHOD FOR WIRE NET WAFERING
- Publication number 20250033246
- Publication date Jan 30, 2025
- TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
- Haiming ZHANG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
LOWER JACKING MEMBER, WIRE WITHDRAWAL METHOD, AND SQUARING MACHINE
- Publication number 20250026041
- Publication date Jan 23, 2025
- FUZHOU SKYWIRETECH CO.,LTD.
- Haiwei LI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHODS FOR CONTROLLING WAFER BREAKAGE DURING INGOT SLICING OPERATIONS
- Publication number 20250026042
- Publication date Jan 23, 2025
- GLOBALWAFERS CO., LTD.
- Jung-Chiang Liao
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
PROCESSING METHOD AND PROCESSING SYSTEM FOR WIRE MESH ABNORMALITY A...
- Publication number 20250018606
- Publication date Jan 16, 2025
- TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
- Haoming ZHANG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
PROCESSING METHOD OF CUTTING THROUGH WORKPIECE AND PROCESSING SYSTEM
- Publication number 20250018604
- Publication date Jan 16, 2025
- TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
- Haoming ZHANG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
GROUP III NITRIDE SINGLE CRYSTAL SUBSTRATE PRODUCING METHOD, AND AL...
- Publication number 20250011971
- Publication date Jan 9, 2025
- Tokuyama Corporation
- Masayuki FUKUDA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF MANUFACTURING WAFER AND SEPARATING APPARATUS
- Publication number 20250010519
- Publication date Jan 9, 2025
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INGOT WAFERING SYSTEMS AND METHODS FOR SLICING A SILICON INGOT
- Publication number 20240416556
- Publication date Dec 19, 2024
- GLOBALWAFERS CO., LTD.
- Chia Ming Liu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Cutting Device of Silicon Rod Cutting System, and Silicon Rod Cutti...
- Publication number 20240416557
- Publication date Dec 19, 2024
- QINGDAO GAOCE TECHNOLOGY CO., LTD
- Shengen HOU
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CNC WIRE CUTTING MACHINE
- Publication number 20240308107
- Publication date Sep 19, 2024
- VISWESH SRINIVASAN
- VISWESH SRINIVASAN
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METAL WIRE AND SAW WIRE
- Publication number 20240286314
- Publication date Aug 29, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Tomohiro KANAZAWA
- G01 - MEASURING TESTING
Information Patent Application
BRICK LOADING/UNLOADING APPARATUS AND METHOD
- Publication number 20240269893
- Publication date Aug 15, 2024
- Hanwha Corporation
- Jong Won LEE
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
LARGE-SIZE SINGLE CRYSTAL CUTTING DEVICE AND METHOD OF THE SAME
- Publication number 20240269894
- Publication date Aug 15, 2024
- TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
- Zhihui LIANG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Processing Method and System for Reducing Warp of Nitrogen-Doped Wafer
- Publication number 20240262008
- Publication date Aug 8, 2024
- Xi'an ESWIN Material Technology Co., Ltd.
- Na YI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SA...
- Publication number 20240246260
- Publication date Jul 25, 2024
- Siltronic AG
- Axel BEYER
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...
- Publication number 20240234125
- Publication date Jul 11, 2024
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
Method for Solving Bright Line Scratched During Lifting of Large-si...
- Publication number 20240217139
- Publication date Jul 4, 2024
- GUANGDONG JINWAN GOKIN SOLAR TECHNOLOGY CO., LTD
- Mingquan FU
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD AND DEVICE FOR PROVIDING WIRE BREAKAGE WARNING
- Publication number 20240175771
- Publication date May 30, 2024
- GLOBALWAFERS CO., LTD.
- Chien-Wen YU
- B28 - WORKING CEMENT, CLAY, OR STONE

by tools other than rotary type

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for separating a plurality of slices from workpieces by mean...

Method and apparatus for simultaneously slicing a multiplicity of s...

Method for manufacturing monocrystalline silicon wafer containing a...

Method for cutting substrate wafer from indium phosphide crystal bar

Method for solving bright line scratched during lifting of large-si...

Workplate for Y-axis compensation of ingot and Y-axis compensation...

Method for separating a plurality of slices from workpieces by mean...

Method for separating a plurality of slices from workpieces by mean...

Method for slicing ingot and wire saw

SiC wafer and manufacturing method for SiC wafer

Method for cutting silicon rod and apparatus for dimaond multi-wire...

Ingot wafering systems and methods for slicing a silicon ingot

Wire saw having dust collecting apparatus

Acoustic cleaving apparatus and methods of acoustic cleaving

Cutting method

Ingot temperature controller and wire sawing device having same

Method for producing semiconductor wafers using a wire saw, wire sa...

Monolayer graphene on non-polar face SiC substrate and control meth...

Method of marking a diamond, markings formed from such methods and...

Manufacturing method of silicon carbide wafer, silicon carbide wafe...

Shaped saw wire with controlled curvature at bends

Method for slicing workpiece and wire saw

Spool with saw wire having elastic and plastic rotations

Indium phosphide substrate, semiconductor epitaxial wafer, and meth...

Indium phosphide substrate, semiconductor epitaxial wafer, and meth...

Method for slicing ingot

Wire saw, wire guide roll and method for simultaneously cutting a m...

Method for manufacturing wire saw apparatus and wire saw apparatus

Methods of recycling silicon swarf into electronic grade polysilico...

Methods of recycling silicon swarf into electronic grade polysilico...

Patents Applicationslast 30 patents

FULLY-AUTOMATIC MULTI-STATION CUTTING MACHINE AND METHOD FOR CUTTIN...

CRYSTAL WAFERING SYSTEM AND METHOD

Semiconductor Crystal Wafer Manufacturing Device and Manufacturing...

GEMSTONE

Wire Take-Up and Pay-Off Device and Slicing Machine

SPRAYER FOR SQUARING CRYSTAL ROD AND CRYSTAL ROD SQUARING DEVICE

SEMICONDUCTOR PACKAGE CUTTING SYSTEM AND METHOD

UNDER-WIRE SPRAY CLEANING DEVICE FOR WIRE CUTTING MACHINE

DIAMOND WIRE MULTI-WIRE CUTTING MACHINE AND CUTTING DEVICE THEREOF,...

CUTTING DEVICE AND MULTI-WIRE CUTTING MACHINE INCLUDING CUTTING DEVICE

METHOD FOR CUTTING SILICON INGOT

CUTTING MONOCRYSTALLINE SILICON SQUARE ROD

INTELLIGENT MONITORING SYSTEM AND METHOD FOR WIRE NET WAFERING

LOWER JACKING MEMBER, WIRE WITHDRAWAL METHOD, AND SQUARING MACHINE

METHODS FOR CONTROLLING WAFER BREAKAGE DURING INGOT SLICING OPERATIONS

PROCESSING METHOD AND PROCESSING SYSTEM FOR WIRE MESH ABNORMALITY A...

PROCESSING METHOD OF CUTTING THROUGH WORKPIECE AND PROCESSING SYSTEM

GROUP III NITRIDE SINGLE CRYSTAL SUBSTRATE PRODUCING METHOD, AND AL...

METHOD OF MANUFACTURING WAFER AND SEPARATING APPARATUS

INGOT WAFERING SYSTEMS AND METHODS FOR SLICING A SILICON INGOT

Cutting Device of Silicon Rod Cutting System, and Silicon Rod Cutti...

CNC WIRE CUTTING MACHINE

METAL WIRE AND SAW WIRE

BRICK LOADING/UNLOADING APPARATUS AND METHOD

LARGE-SIZE SINGLE CRYSTAL CUTTING DEVICE AND METHOD OF THE SAME

Processing Method and System for Reducing Warp of Nitrogen-Doped Wafer

METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SA...

METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...

Method for Solving Bright Line Scratched During Lifting of Large-si...

METHOD AND DEVICE FOR PROVIDING WIRE BREAKAGE WARNING