by tools other than rotary type

Industry

CPC
B28D5/04

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B28Stoneworking B28DWORKING STONE OR STONE-LIKE MATERIALS B28D5/00Fine working of gems, jewels, crystals

Current Industry

B28D5/04by tools other than rotary type

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for slicing ingot and wire saw
- Patent number 12,186,939
- Issue date Jan 7, 2025
- Shin-Etsu Handotai Co., Ltd.
- Keiichi Kanbayashi
- B24 - GRINDING POLISHING
Information Patent Grant
SiC wafer and manufacturing method for SiC wafer
- Patent number 12,139,813
- Issue date Nov 12, 2024
- Toyota Tsusho Corporation
- Masatake Nagaya
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for cutting silicon rod and apparatus for dimaond multi-wire...
- Patent number 12,122,067
- Issue date Oct 22, 2024
- Zhonghuan Advanced Semiconductor Technology Co., Ltd.
- Jiazhen Zheng
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Ingot wafering systems and methods for slicing a silicon ingot
- Patent number 12,115,699
- Issue date Oct 15, 2024
- GlobalWafers Co., Ltd.
- Chia Ming Liu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wire saw having dust collecting apparatus
- Patent number 12,109,729
- Issue date Oct 8, 2024
- EGUN CO., LTD.
- Sung Jun Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Acoustic cleaving apparatus and methods of acoustic cleaving
- Patent number 12,103,200
- Issue date Oct 1, 2024
- Crystal Sonic, Inc.
- Mariana Bertoni
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Cutting method
- Patent number 12,097,633
- Issue date Sep 24, 2024
- Disco Corporation
- Takashi Okamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ingot temperature controller and wire sawing device having same
- Patent number 12,090,685
- Issue date Sep 17, 2024
- SK SILTRON CO., LTD.
- Young Il Jin
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for producing semiconductor wafers using a wire saw, wire sa...
- Patent number 12,083,705
- Issue date Sep 10, 2024
- Siltronic AG
- Axel Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Monolayer graphene on non-polar face SiC substrate and control meth...
- Patent number 12,051,585
- Issue date Jul 30, 2024
- Tianjin University
- Lei Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of marking a diamond, markings formed from such methods and...
- Patent number 12,030,217
- Issue date Jul 9, 2024
- MASTER DYNAMIC LIMITED
- Yau Chuen Yiu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Manufacturing method of silicon carbide wafer, silicon carbide wafe...
- Patent number 11,969,917
- Issue date Apr 30, 2024
- SENIC INC.
- Jung-Gyu Kim
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Shaped saw wire with controlled curvature at bends
- Patent number 11,958,122
- Issue date Apr 16, 2024
- BEKAERT BINJIANG STEEL CORD CO., LTD.
- Alain Simonart
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for slicing workpiece and wire saw
- Patent number 11,958,160
- Issue date Apr 16, 2024
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spool with saw wire having elastic and plastic rotations
- Patent number 11,938,654
- Issue date Mar 26, 2024
- BEKAERT BINJIANG STEEL CORD CO., LTD.
- Wenxian Huang
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Indium phosphide substrate, semiconductor epitaxial wafer, and meth...
- Patent number 11,901,170
- Issue date Feb 13, 2024
- JX Metals Corporation
- Shunsuke Oka
- C30 - CRYSTAL GROWTH
Information Patent Grant
Indium phosphide substrate, semiconductor epitaxial wafer, and meth...
- Patent number 11,894,225
- Issue date Feb 6, 2024
- JX Metals Corporation
- Shunsuke Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for slicing ingot
- Patent number 11,878,385
- Issue date Jan 23, 2024
- Shin-Etsu Handotai Co., Ltd.
- Keiichi Kanbayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Wire saw, wire guide roll and method for simultaneously cutting a m...
- Patent number 11,878,359
- Issue date Jan 23, 2024
- Siltronic AG
- Georg Pietsch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wire saw apparatus and wire saw apparatus
- Patent number 11,806,827
- Issue date Nov 7, 2023
- Shin-Etsu Handotai Co., Ltd.
- Yoshihiro Usami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of recycling silicon swarf into electronic grade polysilico...
- Patent number 11,791,435
- Issue date Oct 17, 2023
- Maxeon Solar Pte. Ltd.
- Moon Chun
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Methods of recycling silicon swarf into electronic grade polysilico...
- Patent number 11,784,276
- Issue date Oct 10, 2023
- SunPower Corporation
- Moon Chun
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Method for manufacturing hexagonal semiconductor plate crystal
- Patent number 11,772,301
- Issue date Oct 3, 2023
- Mitsubishi Chemical Corporation
- Hirofumi Uchida
- C30 - CRYSTAL GROWTH
Information Patent Grant
Ultrasonic resonator support structure and ultrasonic vibration mac...
- Patent number 11,759,975
- Issue date Sep 19, 2023
- TAKADA CORPORATION
- Keiichi Yotsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Slurry sprayers, adjustable supports for same, and methods for slic...
- Patent number 11,752,665
- Issue date Sep 12, 2023
- GlobalWafers Co., Ltd.
- Chia Ming Liu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for manufacturing monocrystalline silicon wafer containing a...
- Patent number 11,742,453
- Issue date Aug 29, 2023
- JINKO SOLAR CO., LTD.
- Xiaolong Bai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for preparing SiC ingot, method for preparing SiC wafer and...
- Patent number 11,708,644
- Issue date Jul 25, 2023
- SENIC INC.
- Jong Hwi Park
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Wire saw apparatus and method for manufacturing wafer
- Patent number 11,584,037
- Issue date Feb 21, 2023
- Shin-Etsu Handotai Co., Ltd.
- Kazutoshi Mizushima
- B24 - GRINDING POLISHING
Information Patent Grant
Method for manufacturing ingot block, method for manufacturing semi...
- Patent number 11,587,792
- Issue date Feb 21, 2023
- Sumco Corporation
- Yasuhiro Saito
- C30 - CRYSTAL GROWTH
Information Patent Grant
Silicon wafer forming method
- Patent number 11,511,374
- Issue date Nov 29, 2022
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR CUTTING SILICON INGOT
- Publication number 20250050542
- Publication date Feb 13, 2025
- SUMCO CORPORATION
- Daisuke HASHIMOTO
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CUTTING MONOCRYSTALLINE SILICON SQUARE ROD
- Publication number 20250033247
- Publication date Jan 30, 2025
- TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
- Jianhua ZHANG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
INTELLIGENT MONITORING SYSTEM AND METHOD FOR WIRE NET WAFERING
- Publication number 20250033246
- Publication date Jan 30, 2025
- TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
- Haiming ZHANG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
LOWER JACKING MEMBER, WIRE WITHDRAWAL METHOD, AND SQUARING MACHINE
- Publication number 20250026041
- Publication date Jan 23, 2025
- FUZHOU SKYWIRETECH CO.,LTD.
- Haiwei LI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHODS FOR CONTROLLING WAFER BREAKAGE DURING INGOT SLICING OPERATIONS
- Publication number 20250026042
- Publication date Jan 23, 2025
- GLOBALWAFERS CO., LTD.
- Jung-Chiang Liao
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
PROCESSING METHOD AND PROCESSING SYSTEM FOR WIRE MESH ABNORMALITY A...
- Publication number 20250018606
- Publication date Jan 16, 2025
- TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
- Haoming ZHANG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
PROCESSING METHOD OF CUTTING THROUGH WORKPIECE AND PROCESSING SYSTEM
- Publication number 20250018604
- Publication date Jan 16, 2025
- TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
- Haoming ZHANG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
GROUP III NITRIDE SINGLE CRYSTAL SUBSTRATE PRODUCING METHOD, AND AL...
- Publication number 20250011971
- Publication date Jan 9, 2025
- Tokuyama Corporation
- Masayuki FUKUDA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF MANUFACTURING WAFER AND SEPARATING APPARATUS
- Publication number 20250010519
- Publication date Jan 9, 2025
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INGOT WAFERING SYSTEMS AND METHODS FOR SLICING A SILICON INGOT
- Publication number 20240416556
- Publication date Dec 19, 2024
- GLOBALWAFERS CO., LTD.
- Chia Ming Liu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Cutting Device of Silicon Rod Cutting System, and Silicon Rod Cutti...
- Publication number 20240416557
- Publication date Dec 19, 2024
- QINGDAO GAOCE TECHNOLOGY CO., LTD
- Shengen HOU
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CNC WIRE CUTTING MACHINE
- Publication number 20240308107
- Publication date Sep 19, 2024
- VISWESH SRINIVASAN
- VISWESH SRINIVASAN
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METAL WIRE AND SAW WIRE
- Publication number 20240286314
- Publication date Aug 29, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Tomohiro KANAZAWA
- G01 - MEASURING TESTING
Information Patent Application
BRICK LOADING/UNLOADING APPARATUS AND METHOD
- Publication number 20240269893
- Publication date Aug 15, 2024
- Hanwha Corporation
- Jong Won LEE
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
LARGE-SIZE SINGLE CRYSTAL CUTTING DEVICE AND METHOD OF THE SAME
- Publication number 20240269894
- Publication date Aug 15, 2024
- TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
- Zhihui LIANG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Processing Method and System for Reducing Warp of Nitrogen-Doped Wafer
- Publication number 20240262008
- Publication date Aug 8, 2024
- Xi'an ESWIN Material Technology Co., Ltd.
- Na YI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SA...
- Publication number 20240246260
- Publication date Jul 25, 2024
- Siltronic AG
- Axel BEYER
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...
- Publication number 20240234125
- Publication date Jul 11, 2024
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
Method for Solving Bright Line Scratched During Lifting of Large-si...
- Publication number 20240217139
- Publication date Jul 4, 2024
- GUANGDONG JINWAN GOKIN SOLAR TECHNOLOGY CO., LTD
- Mingquan FU
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD AND DEVICE FOR PROVIDING WIRE BREAKAGE WARNING
- Publication number 20240175771
- Publication date May 30, 2024
- GLOBALWAFERS CO., LTD.
- Chien-Wen YU
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...
- Publication number 20240136173
- Publication date Apr 25, 2024
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
MONOCRYSTALLINE SILICON CARBIDE SUBSTRATE, METHOD FOR MANUFACTURING...
- Publication number 20240105782
- Publication date Mar 28, 2024
- TANKEBLUE SEMICONDUCTOR CO., LTD.
- Yanfang LOU
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SYSTEMS FOR AUTHENTICATION AND RELATED DEVICES AND METHODS
- Publication number 20240104326
- Publication date Mar 28, 2024
- EllansaLabs Inc.
- Omar Besim HAKIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MONOCRYSTALLINE SILICON MICRO-NANO DUAL-SCALE ANTI-REFLECTION TEXTU...
- Publication number 20230405874
- Publication date Dec 21, 2023
- SHANDONG UNIVERSITY
- Chuanzhen HUANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALLOY WIRE ROD AND PREPARATION METHOD AND APPLICATION THEREOF
- Publication number 20230407441
- Publication date Dec 21, 2023
- Xiamen Honglu Tungsten Molybdenum Industry Co., Ltd.
- Minfeng TANG
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SYSTEMS AND METHODS FOR CONTROLLING SURFACE PROFILES OF WAFERS SLIC...
- Publication number 20230390962
- Publication date Dec 7, 2023
- GLOBALWAFERS CO., LTD.
- Sumeet S. Bhagavat
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
PEELING APPARATUS
- Publication number 20230373129
- Publication date Nov 23, 2023
- Disco Corporation
- Koyo HONOKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MONOCRYSTALLINE SILICON WAFER CONTAINING A...
- Publication number 20230361238
- Publication date Nov 9, 2023
- Jinko Solar Co., Ltd.
- Xiaolong Bai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Monocrystalline SIC Substrates Having an Asymmetrical Geometry and...
- Publication number 20230317780
- Publication date Oct 5, 2023
- SICRYSTAL GMBH
- Kuniyoshi OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR SIMULTANEOUSLY SLICING A MULTIPLICITY OF S...
- Publication number 20230311363
- Publication date Oct 5, 2023
- SILTRONIC AG
- Georg Pietsch
- B28 - WORKING CEMENT, CLAY, OR STONE

by tools other than rotary type

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for slicing ingot and wire saw

SiC wafer and manufacturing method for SiC wafer

Method for cutting silicon rod and apparatus for dimaond multi-wire...

Ingot wafering systems and methods for slicing a silicon ingot

Wire saw having dust collecting apparatus

Acoustic cleaving apparatus and methods of acoustic cleaving

Cutting method

Ingot temperature controller and wire sawing device having same

Method for producing semiconductor wafers using a wire saw, wire sa...

Monolayer graphene on non-polar face SiC substrate and control meth...

Method of marking a diamond, markings formed from such methods and...

Manufacturing method of silicon carbide wafer, silicon carbide wafe...

Shaped saw wire with controlled curvature at bends

Method for slicing workpiece and wire saw

Spool with saw wire having elastic and plastic rotations

Indium phosphide substrate, semiconductor epitaxial wafer, and meth...

Indium phosphide substrate, semiconductor epitaxial wafer, and meth...

Method for slicing ingot

Wire saw, wire guide roll and method for simultaneously cutting a m...

Method for manufacturing wire saw apparatus and wire saw apparatus

Methods of recycling silicon swarf into electronic grade polysilico...

Methods of recycling silicon swarf into electronic grade polysilico...

Method for manufacturing hexagonal semiconductor plate crystal

Ultrasonic resonator support structure and ultrasonic vibration mac...

Slurry sprayers, adjustable supports for same, and methods for slic...

Method for manufacturing monocrystalline silicon wafer containing a...

Method for preparing SiC ingot, method for preparing SiC wafer and...

Wire saw apparatus and method for manufacturing wafer

Method for manufacturing ingot block, method for manufacturing semi...

Silicon wafer forming method

Patents Applicationslast 30 patents

METHOD FOR CUTTING SILICON INGOT

CUTTING MONOCRYSTALLINE SILICON SQUARE ROD

INTELLIGENT MONITORING SYSTEM AND METHOD FOR WIRE NET WAFERING

LOWER JACKING MEMBER, WIRE WITHDRAWAL METHOD, AND SQUARING MACHINE

METHODS FOR CONTROLLING WAFER BREAKAGE DURING INGOT SLICING OPERATIONS

PROCESSING METHOD AND PROCESSING SYSTEM FOR WIRE MESH ABNORMALITY A...

PROCESSING METHOD OF CUTTING THROUGH WORKPIECE AND PROCESSING SYSTEM

GROUP III NITRIDE SINGLE CRYSTAL SUBSTRATE PRODUCING METHOD, AND AL...

METHOD OF MANUFACTURING WAFER AND SEPARATING APPARATUS

INGOT WAFERING SYSTEMS AND METHODS FOR SLICING A SILICON INGOT

Cutting Device of Silicon Rod Cutting System, and Silicon Rod Cutti...

CNC WIRE CUTTING MACHINE

METAL WIRE AND SAW WIRE

BRICK LOADING/UNLOADING APPARATUS AND METHOD

LARGE-SIZE SINGLE CRYSTAL CUTTING DEVICE AND METHOD OF THE SAME

Processing Method and System for Reducing Warp of Nitrogen-Doped Wafer

METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SA...

METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...

Method for Solving Bright Line Scratched During Lifting of Large-si...

METHOD AND DEVICE FOR PROVIDING WIRE BREAKAGE WARNING

METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...

MONOCRYSTALLINE SILICON CARBIDE SUBSTRATE, METHOD FOR MANUFACTURING...

SYSTEMS FOR AUTHENTICATION AND RELATED DEVICES AND METHODS

MONOCRYSTALLINE SILICON MICRO-NANO DUAL-SCALE ANTI-REFLECTION TEXTU...

ALLOY WIRE ROD AND PREPARATION METHOD AND APPLICATION THEREOF

SYSTEMS AND METHODS FOR CONTROLLING SURFACE PROFILES OF WAFERS SLIC...

PEELING APPARATUS

METHOD FOR MANUFACTURING MONOCRYSTALLINE SILICON WAFER CONTAINING A...

Monocrystalline SIC Substrates Having an Asymmetrical Geometry and...

METHOD AND APPARATUS FOR SIMULTANEOUSLY SLICING A MULTIPLICITY OF S...