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Method for slicing ingot
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Patent number 11,878,385
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Issue date Jan 23, 2024
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Shin-Etsu Handotai Co., Ltd.
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Keiichi Kanbayashi
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B24 - GRINDING POLISHING
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Silicon wafer forming method
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Patent number 11,511,374
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Issue date Nov 29, 2022
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Disco Corporation
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Kazuma Sekiya
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Gemstone verification
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Patent number 11,428,641
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Issue date Aug 30, 2022
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Sahajanand Technologies Private Limited
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Munjal Dhirajlal Gajjar
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B28 - WORKING CEMENT, CLAY, OR STONE
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Method for slicing workpiece
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Patent number 11,389,991
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Issue date Jul 19, 2022
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Shin-Etsu Handotai Co., Ltd.
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Shiro Toyoda
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Peeling apparatus
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Patent number 11,358,306
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Issue date Jun 14, 2022
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Disco Corporation
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Kazuyuki Hinohara
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Workpiece processing method
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Patent number 11,167,446
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Issue date Nov 9, 2021
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Disco Corporation
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Naoko Yamamoto
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B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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