Membership
Tour
Register
Log in
by transfer printing
Follow
Industry
CPC
H01L2224/2744
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/2744
by transfer printing
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Systems and methods for fabricating silicon die stacks for electron...
Patent number
12,027,489
Issue date
Jul 2, 2024
Ukyo Jeong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device and method of transferring electronic element usi...
Patent number
12,009,339
Issue date
Jun 11, 2024
Seoul National University R&DB Foundation
Yongtaek Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device and method of transferring electronic element usi...
Patent number
11,848,303
Issue date
Dec 19, 2023
Seoul National University R&DB Foundation
Yongtaek Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sintering materials and attachment methods using same
Patent number
11,389,865
Issue date
Jul 19, 2022
Alpha Assembly Solutions Inc.
Shamik Ghoshal
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Enhanced adhesive materials and processes for 3D applications
Patent number
11,168,234
Issue date
Nov 9, 2021
International Business Machines Corporation
James L. Hedrick
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Method for permanently bonding wafers
Patent number
10,825,793
Issue date
Nov 3, 2020
EV Group E. Thallner GmbH
Thomas Plach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Enhanced adhesive materials and processes for 3D applications
Patent number
10,767,084
Issue date
Sep 8, 2020
International Business Machines Corporation
James L. Hedrick
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Ag underlayer-attached metallic member, Ag underlayer-attached insu...
Patent number
10,734,297
Issue date
Aug 4, 2020
Mitsubishi Materials Corporation
Shuji Nishimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low-temperature bonding with spaced nanorods and eutectic alloys
Patent number
10,646,964
Issue date
May 12, 2020
Northeastern University
Stephen Peter Stagon
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for producing a substrate arrangement, substrate arrangement...
Patent number
10,622,331
Issue date
Apr 14, 2020
Heraeus Deutschland GmbH & Co. KG
Andreas Hinrich
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Grant
Method for producing a connecting medium on an assembly partner, me...
Patent number
10,615,138
Issue date
Apr 7, 2020
Infineon Technologies AG
Nicolas Heuck
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device
Patent number
10,504,749
Issue date
Dec 10, 2019
Mitsubishi Materials Corporation
Shuji Nishimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing metal powder
Patent number
10,130,995
Issue date
Nov 20, 2018
Alpha Assembly Solutions Inc.
Nirmalya Kumar Chaki
C01 - INORGANIC CHEMISTRY
Information
Patent Grant
Metallic particle paste, cured product using same, and semiconducto...
Patent number
10,086,478
Issue date
Oct 2, 2018
Kabushiki Kaisha Toshiba
Daisuke Hiratsuka
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of attaching an electronic part to a copper plate having a s...
Patent number
9,831,157
Issue date
Nov 28, 2017
Dowa Metaltech Co., Ltd.
Naoya Sunachi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip metal alloy thermal interface material
Patent number
9,780,067
Issue date
Oct 3, 2017
Advanced Micro Devices, Inc.
Daniel Cavasin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for producing a material-bonding connection between a semico...
Patent number
9,659,793
Issue date
May 23, 2017
Infineon Technologies AG
Nicolas Heuck
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for bonding metallic contact areas with solution of a sacrif...
Patent number
9,640,510
Issue date
May 2, 2017
EV Group E. Thallner GmbH
Bernhard Rebhan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder paste
Patent number
9,610,655
Issue date
Apr 4, 2017
LG Innotek Co., Ltd
Deok Ki Hwang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonded processed semiconductor structures and carriers
Patent number
9,553,014
Issue date
Jan 24, 2017
Soitec
Mariam Sadaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Preform structure for soldering a semiconductor chip arrangement, a...
Patent number
9,536,851
Issue date
Jan 3, 2017
Infineon Technologies AG
Friedrich Kroener
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Process for connecting joining parts
Patent number
9,502,376
Issue date
Nov 22, 2016
Osram Opto Semiconductors GmbH
Andreas Plöβl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fastening chips with a contact element onto a substrate...
Patent number
9,245,869
Issue date
Jan 26, 2016
EV Group E. Thallner GmbH
Jurgen Burggraf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit arrangement for a thermally conductive chip assembly and a...
Patent number
9,224,666
Issue date
Dec 29, 2015
Rhode & Schwarz GmbH & Co. KG
Robert Ziegler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated bondline spacers for wafer level packaged circuit devices
Patent number
9,187,312
Issue date
Nov 17, 2015
Raytheon Company
Roland Gooch
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Integrated bondline spacers for wafer level packaged circuit devices
Patent number
9,174,836
Issue date
Nov 3, 2015
Raytheon Company
Roland Gooch
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor composite apparatus, method for manufacturing the sem...
Patent number
9,093,562
Issue date
Jul 28, 2015
Oki Data Corporation
Mitsuhiko Ogihara
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Grant
Bonded processed semiconductor structures and carriers
Patent number
9,041,214
Issue date
May 26, 2015
Soitec
Mariam Sadaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contacting means and method for contacting electrical components
Patent number
8,925,789
Issue date
Jan 6, 2015
Heraeus Materials Technology GmbH & Co. KG
Michael Schäfer
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Integrated bondline spacers for wafer level packaged circuit devices
Patent number
8,736,045
Issue date
May 27, 2014
Raytheon Company
Roland Gooch
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
Information
Patent Application
SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...
Publication number
20240371819
Publication date
Nov 7, 2024
NANO-X IMAGING LTD.
Ukyo JEONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Channel Manufacturing Method
Publication number
20240312943
Publication date
Sep 19, 2024
SEIKO EPSON CORPORATION
Junichi OKAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20240145366
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Dongjoon Oh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...
Publication number
20240047415
Publication date
Feb 8, 2024
NANO-X IMAGING LTD
Ukyo JEONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...
Publication number
20220271004
Publication date
Aug 25, 2022
Seoul National University R&DB Foundation
Yongtaek HONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Publication number
20220230989
Publication date
Jul 21, 2022
Nitto Denko Corporation
Mayu Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...
Publication number
20220059496
Publication date
Feb 24, 2022
Seoul National University R&DB Foundation
Yongtaek HONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COVER FILM AND APPLICATION THEREOF
Publication number
20190244927
Publication date
Aug 8, 2019
TAIFLEX SCIENTIFIC CO., LTD.
Sheng-Chin Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS
Publication number
20180340100
Publication date
Nov 29, 2018
International Business Machines Corporation
James L. Hedrick
B82 - NANO-TECHNOLOGY
Information
Patent Application
METHOD FOR PRODUCING A SUBSTRATE ARRANGEMENT, SUBSTRATE ARRANGEMENT...
Publication number
20180286831
Publication date
Oct 4, 2018
Heraeus Deutschland GmbH & Co. KG
Andreas HINRICH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS
Publication number
20170229423
Publication date
Aug 10, 2017
EV GROUP E. THALLNER GMBH
Thomas Plach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP METAL ALLOY THERMAL INTERFACE MATERIAL
Publication number
20160358884
Publication date
Dec 8, 2016
Daniel Cavasin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PREFORM STRUCTURE FOR SOLDERING A SEMICONDUCTOR CHIP ARRANGEMENT, A...
Publication number
20160071814
Publication date
Mar 10, 2016
INFINEON TECHNOLOGIES AG
Friedrich Kroener
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
Publication number
20140346643
Publication date
Nov 27, 2014
Roland Gooch
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SOLDER PASTE
Publication number
20140332116
Publication date
Nov 13, 2014
LG Innotek Co., Ltd.
Deok Ki Hwang
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
UNIVERSAL NANOPATTERNABLE INTERFACIAL BONDING
Publication number
20140283982
Publication date
Sep 25, 2014
Tingrui Pan
B32 - LAYERED PRODUCTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20140284795
Publication date
Sep 25, 2014
SK HYNIX INC.
Sang Eun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Manufacturing Method Thereof
Publication number
20140252576
Publication date
Sep 11, 2014
Hitachi, Ltd
Hisashi Tanie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
Publication number
20140193948
Publication date
Jul 10, 2014
Raytheon Company
Roland Gooch
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
Publication number
20140124899
Publication date
May 8, 2014
Raytheon Company
Roland Gooch
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...
Publication number
20130313309
Publication date
Nov 28, 2013
Masayuki KITAJIMA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT ARRANGEMENT FOR A THERMALLY CONDUCTIVE CHIP ASSEMBLY AND A...
Publication number
20130277846
Publication date
Oct 24, 2013
ROHDE & SCHWARZ GMBH & CO. KG
Robert Ziegler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED PROCESSED SEMICONDUCTOR STRUCTURES AND CARRIERS
Publication number
20130256907
Publication date
Oct 3, 2013
Mariam Sadaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Producing a Metal Layer on a Substrate and Device
Publication number
20120292773
Publication date
Nov 22, 2012
INFINEON TECHNOLOGIES AG
Khalil Hosseini
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Contacting Means and Method for Contacting Electrical Components
Publication number
20120055978
Publication date
Mar 8, 2012
HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
Michael SCHÄFER
B22 - CASTING POWDER METALLURGY
Information
Patent Application
TEMPORARY SEMICONDUCTOR STRUCTURE BONDING METHODS AND RELATED BONDE...
Publication number
20120013013
Publication date
Jan 19, 2012
Mariam Sadaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor composite apparatus, method for manufacturing the sem...
Publication number
20110081738
Publication date
Apr 7, 2011
Oki Data Corporation
Mitsuhiko Ogihara
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Application
Semiconductor composite apparatus, method for manufacturing the sem...
Publication number
20060097354
Publication date
May 11, 2006
Mitsuhiko Ogihara
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS