by using a laminate characterized by the insulating layer

Industry

CPC
H05K3/4655

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4655by using a laminate characterized by the insulating layer

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semi-flex component carrier with dielectric material having high el...
- Patent number 12,058,810
- Issue date Aug 6, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated component carrier with a thermoplastic structure
- Patent number 12,048,089
- Issue date Jul 23, 2024
- AT&SAustria Technologie & Systemtechnik
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with low-solvent fiber-free dielectric layer
- Patent number 12,041,730
- Issue date Jul 16, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Seok Kim Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible laminated board and multilayer circuit board
- Patent number 11,985,762
- Issue date May 14, 2024
- UBE EXSYMO CO., LTD.
- Eisuke Tachibana
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Multilayer circuit board and manufacturing method therefor
- Patent number 11,956,904
- Issue date Apr 9, 2024
- STEMCO CO., LTD.
- Jae Soo Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package manufacturing method, and adhesive sheet used...
- Patent number 11,935,865
- Issue date Mar 19, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Toshimi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board preparation method
- Patent number 11,937,377
- Issue date Mar 19, 2024
- SHENNAN CIRCUITS CO., LTD.
- Changsheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phenoxy resin, resin composition including same, cured object obtai...
- Patent number 11,807,711
- Issue date Nov 7, 2023
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Hiroshi Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing the same
- Patent number 11,700,685
- Issue date Jul 11, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a closed cavity printed circuit board with pattern...
- Patent number 11,622,453
- Issue date Apr 4, 2023
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies for downhole use
- Patent number 11,619,128
- Issue date Apr 4, 2023
- Baker Hughes Holdings LLC
- Silke Bramlage
- E21 - EARTH DRILLING MINING
Information Patent Grant
Packaged integrated circuit with interposing functionality and meth...
- Patent number 11,605,569
- Issue date Mar 14, 2023
- AT&SAustria Technologie & Systemtechnik AG
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer board insulating sheet, multilayer board, and method of...
- Patent number 11,546,989
- Issue date Jan 3, 2023
- TDK Corporation
- Seiko Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel-to-reel lamination methods and devices in FPC fabrication
- Patent number 11,516,921
- Issue date Nov 29, 2022
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel-to-reel laser ablation methods and devices in FPC fabrication
- Patent number 11,490,523
- Issue date Nov 1, 2022
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated component carrier with a thermoplastic structure
- Patent number 11,483,923
- Issue date Oct 25, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making printed circuit board structure including a closed...
- Patent number 11,445,620
- Issue date Sep 13, 2022
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 11,382,218
- Issue date Jul 5, 2022
- TDK Corporation
- Takaaki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, and resin film, metal foil with resin, metal cla...
- Patent number 11,345,784
- Issue date May 31, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kyosuke Michigami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, resin film, laminate, multilayer printed wiring...
- Patent number 11,339,251
- Issue date May 24, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuki Nagai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of making printed circuit board and laminated structure
- Patent number 11,343,918
- Issue date May 24, 2022
- Sumitomo Electric Industries, Ltd.
- Shigeaki Uemura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite film for electronic devices using high frequency band sig...
- Patent number 11,331,888
- Issue date May 17, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Aya Kasahara
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer laminate and method for producing multilayer printed wir...
- Patent number 11,285,700
- Issue date Mar 29, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Yoshihiro Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-flex component carrier with dielectric material having high el...
- Patent number 11,284,508
- Issue date Mar 22, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 11,277,925
- Issue date Mar 15, 2022
- Ibiden Co., Ltd.
- Toshihide Makino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate and electronic apparatus
- Patent number 11,266,016
- Issue date Mar 1, 2022
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency circuit board and method for manufacturing the same
- Patent number 11,197,368
- Issue date Dec 7, 2021
- Avary Holding (Shenzhen) Co., Limited.
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, printed circuit board, prepreg
- Patent number 11,114,354
- Issue date Sep 7, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Akira Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component embedded by laminate sheet
- Patent number 11,116,083
- Issue date Sep 7, 2021
- AT&S (China) Co. Ltd.
- Annie Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating metal foil with N-heterocyclic carbene compounds containing...
- Patent number 11,102,892
- Issue date Aug 24, 2021
- International Business Machines Corporation
- Dylan J. Boday
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTIL...
- Publication number 20250040059
- Publication date Jan 30, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Tomoyuki KAWAHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...
- Publication number 20240397636
- Publication date Nov 28, 2024
- NVIDIA Corporation
- Oren STEINBERG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240373554
- Publication date Nov 7, 2024
- LG Innotek Co., Ltd.
- Jae Man BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME
- Publication number 20240237189
- Publication date Jul 11, 2024
- Meiko Electronics Co., Ltd.
- Tohru MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20240206051
- Publication date Jun 20, 2024
- Murata Manufacturing Co., Ltd.
- Kaori KOIZUMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME
- Publication number 20240138053
- Publication date Apr 25, 2024
- Meiko Electronics Co., Ltd.
- Tohru MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE, LAMINATE WITH BUILDUP LAYER, LAMINATE WITH METAL FOIL, AN...
- Publication number 20240057252
- Publication date Feb 15, 2024
- SEKISUI KASEI CO., LTD.
- Koichiro OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240023250
- Publication date Jan 18, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20230422412
- Publication date Dec 28, 2023
- TOPPAN INC.
- Akihiro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...
- Publication number 20230328897
- Publication date Oct 12, 2023
- Showa Denko Materials Co., Ltd.
- Hiroyuki IZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING A CLOSED CAVITY PRINTED CIRCUIT BOARD WITH PATTERN...
- Publication number 20230328901
- Publication date Oct 12, 2023
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE PROTECTION OF ELECTRONIC COMPONENT EMBEDDED...
- Publication number 20230164911
- Publication date May 25, 2023
- INFINEON TECHNOLOGIES AG
- Mahadi-Ul HASSAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER RESIN SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20230119857
- Publication date Apr 20, 2023
- Murata Manufacturing Co., Ltd.
- Yoshimasa NISHI
- B32 - LAYERED PRODUCTS
Information Patent Application
Laminated Component Carrier With a Thermoplastic Structure
- Publication number 20230054846
- Publication date Feb 23, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTIL...
- Publication number 20220408568
- Publication date Dec 22, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Tomoyuki KAWAHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD PREPARATION METHOD
- Publication number 20220386472
- Publication date Dec 1, 2022
- SHENNAN CIRCUITS CO., LTD.
- CHANGSHENG TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Opposing Planar Electrically Conductive Surfaces Connected for Esta...
- Publication number 20220248532
- Publication date Aug 4, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Bernhard Reitmaier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-Flex Component Carrier With Dielectric Material Having High El...
- Publication number 20220159828
- Publication date May 19, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHENOXY RESIN, RESIN COMPOSITION INCLUDING SAME, CURED OBJECT OBTAI...
- Publication number 20220098360
- Publication date Mar 31, 2022
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Hiroshi Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Component Carrier With Low-Solvent Fiber-Free Dielectric Layer
- Publication number 20220078923
- Publication date Mar 10, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Seok Kim Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING THE SAME
- Publication number 20220053629
- Publication date Feb 17, 2022
- Avary Holding (Shenzhen) Co., Limited.
- FU-YUN SHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210385939
- Publication date Dec 9, 2021
- Avary Holding (Shenzhen) Co., Limited.
- FU-YUN SHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, AND RESIN FILM, METAL FOIL WITH RESIN, METAL CLA...
- Publication number 20210363308
- Publication date Nov 25, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Kyosuke MICHIGAMI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR PACKAGE MANUFACTURING METHOD, AND ADHESIVE SHEET USED...
- Publication number 20210327848
- Publication date Oct 21, 2021
- Mitsui Mining and Smelting Co., Ltd.
- Toshimi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING PRINTED CIRCUIT BOARD STRUCTURE INCLUDING A CLOSED...
- Publication number 20210315110
- Publication date Oct 7, 2021
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A CLOSED CAVITY PRINTED CIRCUIT BOARD WITH PATTERN...
- Publication number 20210315109
- Publication date Oct 7, 2021
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN MULTILAYER SUBSTRATE AND ELECTRONIC APPARATUS
- Publication number 20210267051
- Publication date Aug 26, 2021
- Murata Manufacturing Co., Ltd.
- Yusuke KAMITSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA THIN DIELECTRIC PRINTED CIRCUIT BOARDS WITH THIN LAMINATES AN...
- Publication number 20210243903
- Publication date Aug 5, 2021
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE LAMINATED BOARD AND MULTILAYER CIRCUIT BOARD
- Publication number 20210153348
- Publication date May 20, 2021
- UBE EXSYMO CO., LTD.
- Eisuke TACHIBANA
- B32 - LAYERED PRODUCTS
Information Patent Application
Reel-to-Reel Laser Welding Methods and Devices in FPC Fabrication
- Publication number 20210092854
- Publication date Mar 25, 2021
- Manaflex, LLC
- Robert Clinton Lane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by using a laminate characterized by the insulating layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semi-flex component carrier with dielectric material having high el...

Laminated component carrier with a thermoplastic structure

Component carrier with low-solvent fiber-free dielectric layer

Flexible laminated board and multilayer circuit board

Multilayer circuit board and manufacturing method therefor

Semiconductor package manufacturing method, and adhesive sheet used...

Circuit board preparation method

Phenoxy resin, resin composition including same, cured object obtai...

Method for manufacturing the same

Method of making a closed cavity printed circuit board with pattern...

Electronics assemblies for downhole use

Packaged integrated circuit with interposing functionality and meth...

Multilayer board insulating sheet, multilayer board, and method of...

Reel-to-reel lamination methods and devices in FPC fabrication

Reel-to-reel laser ablation methods and devices in FPC fabrication

Laminated component carrier with a thermoplastic structure

Method of making printed circuit board structure including a closed...

Printed wiring board and method for manufacturing the same

Resin composition, and resin film, metal foil with resin, metal cla...

Resin composition, resin film, laminate, multilayer printed wiring...

Method of making printed circuit board and laminated structure

Composite film for electronic devices using high frequency band sig...

Multilayer laminate and method for producing multilayer printed wir...

Semi-flex component carrier with dielectric material having high el...

Wiring board and method for manufacturing the same

Resin multilayer substrate and electronic apparatus

High-frequency circuit board and method for manufacturing the same

Printed wiring board, printed circuit board, prepreg

Electronic component embedded by laminate sheet

Coating metal foil with N-heterocyclic carbene compounds containing...

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTIL...

METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME

WIRING BOARD

DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME

LAMINATE, LAMINATE WITH BUILDUP LAYER, LAMINATE WITH METAL FOIL, AN...

WIRING SUBSTRATE

MULTILAYER WIRING BOARD

MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...

METHOD OF MAKING A CLOSED CAVITY PRINTED CIRCUIT BOARD WITH PATTERN...

ELECTROSTATIC DISCHARGE PROTECTION OF ELECTRONIC COMPONENT EMBEDDED...

MULTILAYER RESIN SUBSTRATE AND METHOD FOR PRODUCING SAME

Laminated Component Carrier With a Thermoplastic Structure

METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTIL...

CIRCUIT BOARD PREPARATION METHOD

Opposing Planar Electrically Conductive Surfaces Connected for Esta...

Semi-Flex Component Carrier With Dielectric Material Having High El...

PHENOXY RESIN, RESIN COMPOSITION INCLUDING SAME, CURED OBJECT OBTAI...

Component Carrier With Low-Solvent Fiber-Free Dielectric Layer

METHOD FOR MANUFACTURING THE SAME

HIGH-FREQUENCY CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

RESIN COMPOSITION, AND RESIN FILM, METAL FOIL WITH RESIN, METAL CLA...

SEMICONDUCTOR PACKAGE MANUFACTURING METHOD, AND ADHESIVE SHEET USED...

METHOD OF MAKING PRINTED CIRCUIT BOARD STRUCTURE INCLUDING A CLOSED...

METHOD OF MAKING A CLOSED CAVITY PRINTED CIRCUIT BOARD WITH PATTERN...

RESIN MULTILAYER SUBSTRATE AND ELECTRONIC APPARATUS

ULTRA THIN DIELECTRIC PRINTED CIRCUIT BOARDS WITH THIN LAMINATES AN...

FLEXIBLE LAMINATED BOARD AND MULTILAYER CIRCUIT BOARD

Reel-to-Reel Laser Welding Methods and Devices in FPC Fabrication