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H01L2224/02319

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/02319by using a preform

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package structure with through-via in molding compound and dielectr...
- Patent number 12,009,322
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LTHC as charging barrier in info package formation
- Patent number 11,923,353
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 11,908,692
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution layers formed utilizing du...
- Patent number 11,600,582
- Issue date Mar 7, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LTHC as charging barrier in InFO package formation
- Patent number 11,437,361
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,251,141
- Issue date Feb 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask assembly and method for fabricating a chip package
- Patent number 11,107,680
- Issue date Aug 31, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having singular wire bond on bonding pads
- Patent number 11,056,465
- Issue date Jul 6, 2021
- Intel Corporation
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor package
- Patent number 10,971,429
- Issue date Apr 6, 2021
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,879,227
- Issue date Dec 29, 2020
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,861,842
- Issue date Dec 8, 2020
- STMicroelectronics S.r.l.
- Alberto Pagani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
CTE compensation for wafer-level and chip-scale packages and assemb...
- Patent number 10,847,469
- Issue date Nov 24, 2020
- Cubic Corporation
- Kenneth J. Vanhille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with electromagnetic interference shielding
- Patent number 10,714,431
- Issue date Jul 14, 2020
- UTAC HEADQUARTERS PTE. LTD.
- Antonio Bambalan Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution layers formed utilizing du...
- Patent number 10,707,181
- Issue date Jul 7, 2020
- Amkor Technology Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heat-dissipating structure and method of...
- Patent number 10,679,955
- Issue date Jun 9, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming package structure
- Patent number 10,672,729
- Issue date Jun 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,607,920
- Issue date Mar 31, 2020
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor package
- Patent number 10,607,921
- Issue date Mar 31, 2020
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,580,763
- Issue date Mar 3, 2020
- Renesas Electronics Corporation
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LTHC as charging barrier in InFO package formation
- Patent number 10,522,526
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,453,833
- Issue date Oct 22, 2019
- STMicroelectonics S.R.L.
- Alberto Pagani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 10,403,592
- Issue date Sep 3, 2019
- United Test & Assembly Center Ltd.
- Yongbo Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,319,708
- Issue date Jun 11, 2019
- STMicroelectronics S.r.l.
- Alberto Pagani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 10,283,377
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,224,318
- Issue date Mar 5, 2019
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,177,103
- Issue date Jan 8, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Moon Hee Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with pillar and bump structures
- Patent number 10,128,207
- Issue date Nov 13, 2018
- STMicroelectronics Pte Ltd
- Yun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly with facing active surfaces of first...
- Patent number 10,032,756
- Issue date Jul 24, 2018
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 9,881,911
- Issue date Jan 30, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 9,847,325
- Issue date Dec 19, 2017
- Renesas Electronics Corporation
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240290734
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LTHC AS CHARGING BARRIER IN INFO PACKAGE FORMATION
- Publication number 20240222352
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Col., Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...
- Publication number 20230207502
- Publication date Jun 29, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20220165689
- Publication date May 26, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A CHIP PACKAGE
- Publication number 20210391168
- Publication date Dec 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...
- Publication number 20200335461
- Publication date Oct 22, 2020
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20200294944
- Publication date Sep 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR PACKAGE
- Publication number 20200194340
- Publication date Jun 18, 2020
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20200118994
- Publication date Apr 16, 2020
- RENESAS ELECTRONICS CORPORATION
- Yoichiro KURITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20190348387
- Publication date Nov 14, 2019
- UTAC Headquarters Pte. Ltd.
- Yongbo YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190139787
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASK ASSEMBLY AND METHOD FOR FABRICATING A CHIP PACKAGE
- Publication number 20190067001
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20190051614
- Publication date Feb 14, 2019
- UTAC Headquarters Pte. Ltd.
- Antonio Bambalan DIMAANO JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LTHC as Charging Barrier in InFO Package Formation
- Publication number 20190035774
- Publication date Jan 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20190013282
- Publication date Jan 10, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Moon Hee YI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20180286823
- Publication date Oct 4, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180197831
- Publication date Jul 12, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20180130784
- Publication date May 10, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20180102353
- Publication date Apr 12, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20180019237
- Publication date Jan 18, 2018
- RENESAS ELECTRONICS CORPORATION
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20170236810
- Publication date Aug 17, 2017
- RENESAS ELECTRONICS CORPORATION
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE REINFORCED PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE
- Publication number 20160172344
- Publication date Jun 16, 2016
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...
- Publication number 20150221601
- Publication date Aug 6, 2015
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF WIRING STRUCTURE FOR IMPROVING CROWN-LIKE DEFECT
- Publication number 20140251946
- Publication date Sep 11, 2014
- XINTEC INC.
- Yi-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire-Based Methodology of Widening the Pitch of Semiconductor Chip...
- Publication number 20130307141
- Publication date Nov 21, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Charles Anthony Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20130241025
- Publication date Sep 19, 2013
- STMicroelectronics S.r. I.
- Alberto PAGANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF MAKING
- Publication number 20130075890
- Publication date Mar 28, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF MAKING
- Publication number 20130075928
- Publication date Mar 28, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20120309167
- Publication date Dec 6, 2012
- Sang-Wook PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FILMS USEFUL IN SEMICONDUCTOR PACKAGING APPLICATIONS, AN...
- Publication number 20120292086
- Publication date Nov 22, 2012
- E.I. du Pont de Nemours and Company
- Brian C. Auman
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

by using a preform

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structure with through-via in molding compound and dielectr...

LTHC as charging barrier in info package formation

Method for fabricating a chip package

Semiconductor device with redistribution layers formed utilizing du...

LTHC as charging barrier in InFO package formation

Package structure

Mask assembly and method for fabricating a chip package

Semiconductor package having singular wire bond on bonding pads

Method for forming a semiconductor package

Electronic device

Electronic system having increased coupling by using horizontal and...

CTE compensation for wafer-level and chip-scale packages and assemb...

Semiconductor packages with electromagnetic interference shielding

Semiconductor device with redistribution layers formed utilizing du...

Semiconductor package with heat-dissipating structure and method of...

Package structure and method of forming package structure

Semiconductor package

Method for forming a semiconductor package

Electronic device

LTHC as charging barrier in InFO package formation

Electronic system having increased coupling by using horizontal and...

Semiconductor packages and methods of packaging semiconductor devices

Electronic system having increased coupling by using horizontal and...

Integrated fan-out package and manufacturing method thereof

Electronic device

Fan-out semiconductor package

Semiconductor packages with pillar and bump structures

Semiconductor package assembly with facing active surfaces of first...

Electronic system having increased coupling by using horizontal and...

Electronic device

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

LTHC AS CHARGING BARRIER IN INFO PACKAGE FORMATION

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...

PACKAGE STRUCTURE

METHOD FOR FABRICATING A CHIP PACKAGE

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...

PACKAGE STRUCTURE

METHOD FOR FORMING A SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

MASK ASSEMBLY AND METHOD FOR FABRICATING A CHIP PACKAGE

SEMICONDUCTOR PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHIELDING

LTHC as Charging Barrier in InFO Package Formation

FAN-OUT SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND METHOD OF FORMING PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

ELECTRONIC DEVICE

ELECTRONIC DEVICE

LOW PROFILE REINFORCED PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...

FABRICATION METHOD OF WIRING STRUCTURE FOR IMPROVING CROWN-LIKE DEFECT

Wire-Based Methodology of Widening the Pitch of Semiconductor Chip...

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

INTEGRATED CIRCUIT AND METHOD OF MAKING

INTEGRATED CIRCUIT AND METHOD OF MAKING

METHOD OF FABRICATING SEMICONDUCTOR DEVICE

INTERPOSER FILMS USEFUL IN SEMICONDUCTOR PACKAGING APPLICATIONS, AN...