Cap forming a cavity

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H01L2924/16196

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/16196Cap forming a cavity

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,784,156
- Issue date Oct 10, 2023
- Mitsubishi Electric Corporation
- Takuya Kitabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heatsink
- Patent number 11,694,972
- Issue date Jul 4, 2023
- Mediatek Inc.
- Kuang-Han Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device package with reduced radio frequency losses
- Patent number 11,574,879
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Pedro Augusto Borrego Lambin Torres Amaral
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Flexible shield for semiconductor devices
- Patent number 11,177,226
- Issue date Nov 16, 2021
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management application of interconnect substrates
- Patent number 10,748,845
- Issue date Aug 18, 2020
- Volterra Semiconductor Corporation
- Mihalis Michael
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with temperature detecting element
- Patent number 10,580,754
- Issue date Mar 3, 2020
- Mitsubishi Electric Corporation
- Shinya Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for thermal interface material (TIM) bond lin...
- Patent number 10,529,645
- Issue date Jan 7, 2020
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management application of interconnect substrates
- Patent number 10,332,827
- Issue date Jun 25, 2019
- Volterra Semiconductor Corporation
- Mihalis Michael
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management applications of interconnect substrates
- Patent number 9,520,342
- Issue date Dec 13, 2016
- Volterra Semiconductor Corporation
- Mihalis Michael
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a plurality of semiconductor chips,...
- Patent number 9,460,938
- Issue date Oct 4, 2016
- Renesas Electronics Corporation
- Hiroyasu Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked silicon package assembly having enhanced lid adhesion
- Patent number 9,418,909
- Issue date Aug 16, 2016
- Xilinx, Inc.
- Raghunandan Chaware
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 9,391,029
- Issue date Jul 12, 2016
- Kabushiki Kaisha Toshiba
- Shinya Hayashiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a cap unit with concave portion and me...
- Patent number 9,299,627
- Issue date Mar 29, 2016
- Kabushiki Kaisha Toshiba
- Toshihiko Nagano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management applications of interconnect substrates
- Patent number 9,099,340
- Issue date Aug 4, 2015
- Volterra Semiconductor Corporation
- Mihalis Michael
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus, method of making the same, and transceiving d...
- Patent number 8,952,846
- Issue date Feb 10, 2015
- Fujitsu Limited
- Akihiko Akasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
8917205
- Patent number 8,917,205
- Issue date Dec 23, 2014
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale semiconductor die packaging method
- Patent number 8,703,540
- Issue date Apr 22, 2014
- Semtech Corporation
- Andrew J. Bonthron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale semiconductor die packaging method
- Patent number 8,367,469
- Issue date Feb 5, 2013
- Semtech Corporation
- Andrew J. Bonthron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly with chip-scale packaging
- Patent number 8,093,714
- Issue date Jan 10, 2012
- Semtech Corporation
- Andrew J. Bonthron
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATION SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20240395655
- Publication date Nov 28, 2024
- Intel Corporation
- Avi Tsarfati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONI...
- Publication number 20240250054
- Publication date Jul 25, 2024
- NVIDIA Corporation
- Malcolm GUTENBURG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED LIQUID COOLING
- Publication number 20240222222
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Improved Heat Dissipation Efficiency and Method for Fo...
- Publication number 20240063079
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20230187305
- Publication date Jun 15, 2023
- Hitachi Astemo, Ltd.
- Hiromi SHIMAZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230178451
- Publication date Jun 8, 2023
- Siliconware Precision Industries Co., Ltd.
- Hsin-Jou Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING PACKAGE HOUSING IN ENGRAVED SURFACE FO...
- Publication number 20230011694
- Publication date Jan 12, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE...
- Publication number 20220399300
- Publication date Dec 15, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220102312
- Publication date Mar 31, 2022
- Mitsubishi Electric Corporation
- Takuya KITABAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HEATSINK
- Publication number 20210384142
- Publication date Dec 9, 2021
- MEDIATEK INC.
- Kuang-Han Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MANAGEMENT APPLICATION OF INTERCONNECT SUBSTRATES
- Publication number 20190341344
- Publication date Nov 7, 2019
- Volterra Semiconductor Corporation
- Mihalis Michael
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR THERMAL INTERFACE MATERIAL (TIM) BOND LIN...
- Publication number 20180358280
- Publication date Dec 13, 2018
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140327138
- Publication date Nov 6, 2014
- RENESAS ELECTRONICS CORPORATION
- Hiroyasu Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140210066
- Publication date Jul 31, 2014
- KABUSHIKI KAISHA TOSHIBA
- Toshihiko Nagano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE SEMICONDUCTOR DIE PACKAGING METHOD
- Publication number 20130130441
- Publication date May 23, 2013
- SEMTECH CORPORATION
- Andrew J. BONTHRON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MANAGEMENT APPLICATIONS OF INTERCONNECT SUBSTRATES
- Publication number 20130087366
- Publication date Apr 11, 2013
- Volterra Semiconductor Corporation
- Mihalis Michael
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE SEMICONDUCTOR DIE PACKAGING METHOD
- Publication number 20120115279
- Publication date May 10, 2012
- SEMTECH CORPORATION
- Andrew J. BONTHRON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS, METHOD OF MAKING THE SAME, AND TRANSCEIVING D...
- Publication number 20120092218
- Publication date Apr 19, 2012
- Fujitsu Limited
- Akihiko Akasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLY WITH CHIP-SCALE PACKAGING
- Publication number 20110140260
- Publication date Jun 16, 2011
- Sierra Monolithics, Inc.
- Andrew J. Bonthron
- H01 - BASIC ELECTRIC ELEMENTS

Cap forming a cavity

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Semiconductor package with heatsink

Device package with reduced radio frequency losses

Flexible shield for semiconductor devices

Power management application of interconnect substrates

Semiconductor module with temperature detecting element

Methods and apparatus for thermal interface material (TIM) bond lin...

Power management application of interconnect substrates

Power management applications of interconnect substrates

Semiconductor device including a plurality of semiconductor chips,...

Stacked silicon package assembly having enhanced lid adhesion

Electronic device

Semiconductor package having a cap unit with concave portion and me...

Power management applications of interconnect substrates

Electronic apparatus, method of making the same, and transceiving d...

8917205

Chip-scale semiconductor die packaging method

Chip-scale semiconductor die packaging method

Chip assembly with chip-scale packaging

Patents Applicationslast 30 patents

HEAT DISSIPATION SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES

BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONI...

EMBEDDED LIQUID COOLING

Package with Improved Heat Dissipation Efficiency and Method for Fo...

POWER MODULE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE HAVING PACKAGE HOUSING IN ENGRAVED SURFACE FO...

CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE WITH HEATSINK

POWER MANAGEMENT APPLICATION OF INTERCONNECT SUBSTRATES

METHODS AND APPARATUS FOR THERMAL INTERFACE MATERIAL (TIM) BOND LIN...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

CHIP-SCALE SEMICONDUCTOR DIE PACKAGING METHOD

POWER MANAGEMENT APPLICATIONS OF INTERCONNECT SUBSTRATES

CHIP-SCALE SEMICONDUCTOR DIE PACKAGING METHOD

ELECTRONIC APPARATUS, METHOD OF MAKING THE SAME, AND TRANSCEIVING D...

CHIP ASSEMBLY WITH CHIP-SCALE PACKAGING