8917205

Information

• Patent Grant
• 8917205

• References
• Source

• Patent Number

  8,917,205

• Date Filed

  Not available

• Date Issued

  Tuesday, December 23, 2014
  10 years ago

• CPC

  • H01L23/49822 - Multilayer substrates
  • H01L23/3677 - Wire-like or pin-like cooling fins or heat sinks
  • H01L23/66 - High-frequency adaptations
  • H01L24/48 - of an individual wire connector
  • H01L2223/6683 - for monolithic microwave integrated circuit [MMIC]
  • H01L2224/48175 - the item being metallic
  • H01L2924/01019 - Potassium [K]
  • H01L2924/09701 - Low temperature co-fired ceramic [LTCC]
  • H01L2924/1423 - Monolithic Microwave Integrated Circuit [MMIC]
  • H01L2924/15174 - in different layers of the multilayer substrate
  • H01L2924/15192 - Resurf arrangement of the internal vias
  • H01L2924/16152 - Cap comprising a cavity for hosting the device
  • H01L2924/16172 - with a principal constituent of the material being a metal or a metalloid
  • H01L2924/16196 - Cap forming a cavity
  • H01L2924/19041 - being a capacitor
  • H01L2924/19105 - in a side-by-side arrangement on a common die mounting substrate
  • H01L2924/19107 - off-chip wires
  • H01L2924/30107 - Inductance
  • H01L2924/3011 - Impedance