Capacitive arrangements

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H01L23/642

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/642Capacitive arrangements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Mechanically tolerant couplers
- Patent number 12,327,164
- Issue date Jun 10, 2025
- International Business Machines Corporation
- Timothy Phung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of resistance and capacitance reduction to circuit output n...
- Patent number 12,324,228
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chia Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid integrated circuit package
- Patent number 12,300,621
- Issue date May 13, 2025
- Infinera Corporation
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure and method for forming the same
- Patent number 12,295,149
- Issue date May 6, 2025
- ANHUI CAMBRICON INFORMATION TECHNOLOGY CO., LTD.
- Shuai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated capacitors
- Patent number 12,288,756
- Issue date Apr 29, 2025
- Chipletz, Inc.
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a trench capacitor with wafer bow
- Patent number 12,288,648
- Issue date Apr 29, 2025
- SK keyfoundry Inc.
- Seung Mo Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 12,272,673
- Issue date Apr 8, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-group package having a deep trench device
- Patent number 12,249,590
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 12,230,560
- Issue date Feb 18, 2025
- Mediatek Inc.
- Che-Hung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with reinforced element
- Patent number 12,218,080
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMIB architecture with dedicated metal layers for improving power d...
- Patent number 12,218,063
- Issue date Feb 4, 2025
- Intel Corporation
- Jianyong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply system and power supply module
- Patent number 12,211,827
- Issue date Jan 28, 2025
- Delta Electronics (Shanghai) Co., Ltd.
- Pengkai Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective area metal process for improved metallurgical bonding of...
- Patent number 12,191,346
- Issue date Jan 7, 2025
- SARAS MICRO DEVICES, INC.
- Bartlet DeProspo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded inductors and integrated voltage regulators for packaged s...
- Patent number 12,183,692
- Issue date Dec 31, 2024
- SARAS MICRO DEVICES, INC.
- Carlos Riera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configurable metal—insulator—metal capacitor and devices
- Patent number 12,183,669
- Issue date Dec 31, 2024
- MACOM Technology Solutions Holdings, Inc.
- Jeremy Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical circuit of semiconductor channel resistor and apparatus...
- Patent number 12,176,306
- Issue date Dec 24, 2024
- Electronics and Telecommunications Research Institute
- Sang Heung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to voltage compensated switch stack
- Patent number 12,176,304
- Issue date Dec 24, 2024
- Skyworks Solutions, Inc.
- Hanching Fuh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through wafer trench isolation between transistors in an integrated...
- Patent number 12,148,717
- Issue date Nov 19, 2024
- Texas Instruments Incorporated
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride (GAN) three-dimensional integrated circuit technology
- Patent number 12,148,747
- Issue date Nov 19, 2024
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with interposer between integrated circuit dies
- Patent number 12,136,615
- Issue date Nov 5, 2024
- Qorvo US, Inc.
- Matthew Essar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-sided embeddable capacitors for packaged semiconductor devices
- Patent number 12,136,601
- Issue date Nov 5, 2024
- SARAS MICRO DEVICES, INC.
- Carlos Andres Riera Cercado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with capacitance die
- Patent number 12,132,028
- Issue date Oct 29, 2024
- Amazon Technologies, Inc.
- Bassam Abdel-Dayem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier module
- Patent number 12,119,793
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making the same
- Patent number 12,113,031
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating thereof
- Patent number 12,113,035
- Issue date Oct 8, 2024
- Samsung Electronics Co., Ltd.
- Jin-su Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded resistor-capacitor film for fan out wafer level packaging
- Patent number 12,100,674
- Issue date Sep 24, 2024
- Dialog Semiconductor (UK) Limited
- Ernesto Gutierrez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data processing device
- Patent number 12,094,802
- Issue date Sep 17, 2024
- Delta Electronics (Shanghai) Co., Ltd.
- Pengkai Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device capable of realizing a wide band impedance mat...
- Patent number 12,094,840
- Issue date Sep 17, 2024
- Sumitomo Electric Device Innovations, Inc.
- Masahiro Hirayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Size and efficiency of dies
- Patent number 12,094,827
- Issue date Sep 17, 2024
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip protected against back-face attacks
- Patent number 12,087,708
- Issue date Sep 10, 2024
- STMicroelectronics (Crolles 2) SAS
- Sebastien Petitdidier
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183186
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Sungoh Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE STRUCTURES IN EMBEDDED BRIDGE ARCHITECTURES
- Publication number 20250183179
- Publication date Jun 5, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250174581
- Publication date May 29, 2025
- NANYA TECHNOLOGY CORPORATION
- DA-ZEN CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250167141
- Publication date May 22, 2025
- Samsung Electronics, Co., Ltd.
- YoungJun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES INCLUDING TRENCH CAPACITORS AND METHODS OF FORMING THE SAME
- Publication number 20250157915
- Publication date May 15, 2025
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- ANTHONY JEREMY VILLALON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH REINFORCED ELEMENT
- Publication number 20250149469
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250149489
- Publication date May 8, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250132271
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Kyojin Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMIB ARCHITECTURE WITH DEDICATED METAL LAYERS FOR IMPROVING POWER D...
- Publication number 20250125268
- Publication date Apr 17, 2025
- Intel Corporation
- Jianyong XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC RANDOM-ACCESS MEMORY DEVICES AND METHODS OF MANUFACTURING T...
- Publication number 20250125287
- Publication date Apr 17, 2025
- WINBOND ELECTRONICS CORP.
- Te-Hsuan PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250125286
- Publication date Apr 17, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- James Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250125318
- Publication date Apr 17, 2025
- Mitsubishi Electric Corporation
- Shin Chaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Publication number 20250125202
- Publication date Apr 17, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO VOLTAGE COMPENSATED SWITCH STACK
- Publication number 20250125288
- Publication date Apr 17, 2025
- Skyworks Solutions, Inc.
- Hanching Fuh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20250113438
- Publication date Apr 3, 2025
- Shinko Electric Industries Co., Ltd.
- Tomoyuki SHIMODAIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AN ISOLATION STRUCTURE AND METHODS OF P...
- Publication number 20250107276
- Publication date Mar 27, 2025
- Infineon Technologies Austria AG
- Annett Winzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250096162
- Publication date Mar 20, 2025
- CXMT Corporation
- You FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID METHODS AND STRUCTURES FOR INCREASING CAPACITANCE DENSITY IN...
- Publication number 20250098184
- Publication date Mar 20, 2025
- ADVANCED MICRO DEVICES, INC.
- Arsalan Alam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR INCREASING CAPACITANCE DENSITY IN INTEGR...
- Publication number 20250096161
- Publication date Mar 20, 2025
- ADVANCED MICRO DEVICES, INC.
- Arsalan Alam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096118
- Publication date Mar 20, 2025
- KIOXIA Corporation
- Kunio OTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087603
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Young Lyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087637
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Substrates for Large, High Performance Power Packages
- Publication number 20250087566
- Publication date Mar 13, 2025
- Google LLC
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH AN EMBEDDED PASSIVE DEVICE
- Publication number 20250079348
- Publication date Mar 6, 2025
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...
- Publication number 20250079244
- Publication date Mar 6, 2025
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH WAFER TRENCH ISOLATION BETWEEN TRANSISTORS IN AN INTEGRATED...
- Publication number 20250079340
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE METAL - INSULATOR - METAL CAPACITOR AND DEVICES AND PR...
- Publication number 20250070016
- Publication date Feb 27, 2025
- MACOM Technology Solutions Holdings, Inc.
- Jeremy FISHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY SYSTEM AND POWER SUPPLY MODULE
- Publication number 20250062296
- Publication date Feb 20, 2025
- DELTA ELECTRONICS (SHANGHAI) CO.,LTD.
- Pengkai JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062186
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Junghoo Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ASSEMBLY INCLUDING THE SAME
- Publication number 20250054825
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Jaehyun LIM
- H01 - BASIC ELECTRIC ELEMENTS

Capacitive arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Mechanically tolerant couplers

Methods of resistance and capacitance reduction to circuit output n...

Hybrid integrated circuit package

Capacitor structure and method for forming the same

Semiconductor package with integrated capacitors

Method of manufacturing a trench capacitor with wafer bow

Capacitive coupling in a direct-bonded interface for microelectroni...

Die-group package having a deep trench device

Semiconductor package structure

Package structure with reinforced element

EMIB architecture with dedicated metal layers for improving power d...

Power supply system and power supply module

Selective area metal process for improved metallurgical bonding of...

Embedded inductors and integrated voltage regulators for packaged s...

Configurable metal—insulator—metal capacitor and devices

Electrical circuit of semiconductor channel resistor and apparatus...

Devices and methods related to voltage compensated switch stack

Through wafer trench isolation between transistors in an integrated...

Gallium nitride (GAN) three-dimensional integrated circuit technology

Electronic package with interposer between integrated circuit dies

Single-sided embeddable capacitors for packaged semiconductor devices

Semiconductor package with capacitance die

Power amplifier module

Semiconductor device and method of making the same

Semiconductor device and method for fabricating thereof

Embedded resistor-capacitor film for fan out wafer level packaging

Data processing device

Semiconductor device capable of realizing a wide band impedance mat...

Size and efficiency of dies

Chip protected against back-face attacks

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

PASSIVE STRUCTURES IN EMBEDDED BRIDGE ARCHITECTURES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

STRUCTURES INCLUDING TRENCH CAPACITORS AND METHODS OF FORMING THE SAME

PACKAGE STRUCTURE WITH REINFORCED ELEMENT

Multi-Die Fine Grain Integrated Voltage Regulation

SEMICONDUCTOR PACKAGE

EMIB ARCHITECTURE WITH DEDICATED METAL LAYERS FOR IMPROVING POWER D...

DYNAMIC RANDOM-ACCESS MEMORY DEVICES AND METHODS OF MANUFACTURING T...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

DEVICES AND METHODS RELATED TO VOLTAGE COMPENSATED SWITCH STACK

WIRING BOARD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING AN ISOLATION STRUCTURE AND METHODS OF P...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR

HYBRID METHODS AND STRUCTURES FOR INCREASING CAPACITANCE DENSITY IN...

METHODS AND STRUCTURES FOR INCREASING CAPACITANCE DENSITY IN INTEGR...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

Advanced Substrates for Large, High Performance Power Packages

PACKAGE COMPRISING A SUBSTRATE WITH AN EMBEDDED PASSIVE DEVICE

METHOD OF MANUFACTURING PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...

THROUGH WAFER TRENCH ISOLATION BETWEEN TRANSISTORS IN AN INTEGRATED...

CONFIGURABLE METAL - INSULATOR - METAL CAPACITOR AND DEVICES AND PR...

POWER SUPPLY SYSTEM AND POWER SUPPLY MODULE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ASSEMBLY INCLUDING THE SAME