Capacitive arrangements

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H01L23/642

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/642Capacitive arrangements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit including standard cells and at least one capaci...
- Patent number 12,356,725
- Issue date Jul 8, 2025
- STMicroelectronics (Rousset) SAS
- Abderrezak Marzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic system formed by electrically connected and gal...
- Patent number 12,354,998
- Issue date Jul 8, 2025
- STMicroelectronics S.r.l.
- Dario Paci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable and embeddable vertical capacitors in semiconductor devic...
- Patent number 12,347,628
- Issue date Jul 1, 2025
- SARAS MICRO DEVICES, INC.
- Ryan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate underfill formation for an integrated circuit ass...
- Patent number 12,341,121
- Issue date Jun 24, 2025
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrateless double-sided embedded multi-die interconnect bridge
- Patent number 12,341,129
- Issue date Jun 24, 2025
- Intel Corporation
- Biancun Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated capacitors
- Patent number 12,334,455
- Issue date Jun 17, 2025
- Chipletz, Inc.
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and structure with electronic component
- Patent number 12,336,085
- Issue date Jun 17, 2025
- Murata Manufacturing Co., Ltd.
- Kazunori Tsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically tolerant couplers
- Patent number 12,327,164
- Issue date Jun 10, 2025
- International Business Machines Corporation
- Timothy Phung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of resistance and capacitance reduction to circuit output n...
- Patent number 12,324,228
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chia Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid integrated circuit package
- Patent number 12,300,621
- Issue date May 13, 2025
- Infinera Corporation
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure and method for forming the same
- Patent number 12,295,149
- Issue date May 6, 2025
- ANHUI CAMBRICON INFORMATION TECHNOLOGY CO., LTD.
- Shuai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated capacitors
- Patent number 12,288,756
- Issue date Apr 29, 2025
- Chipletz, Inc.
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a trench capacitor with wafer bow
- Patent number 12,288,648
- Issue date Apr 29, 2025
- SK keyfoundry Inc.
- Seung Mo Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 12,272,673
- Issue date Apr 8, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-group package having a deep trench device
- Patent number 12,249,590
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 12,230,560
- Issue date Feb 18, 2025
- Mediatek Inc.
- Che-Hung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with reinforced element
- Patent number 12,218,080
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMIB architecture with dedicated metal layers for improving power d...
- Patent number 12,218,063
- Issue date Feb 4, 2025
- Intel Corporation
- Jianyong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply system and power supply module
- Patent number 12,211,827
- Issue date Jan 28, 2025
- Delta Electronics (Shanghai) Co., Ltd.
- Pengkai Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective area metal process for improved metallurgical bonding of...
- Patent number 12,191,346
- Issue date Jan 7, 2025
- SARAS MICRO DEVICES, INC.
- Bartlet DeProspo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded inductors and integrated voltage regulators for packaged s...
- Patent number 12,183,692
- Issue date Dec 31, 2024
- SARAS MICRO DEVICES, INC.
- Carlos Riera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configurable metal—insulator—metal capacitor and devices
- Patent number 12,183,669
- Issue date Dec 31, 2024
- MACOM Technology Solutions Holdings, Inc.
- Jeremy Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical circuit of semiconductor channel resistor and apparatus...
- Patent number 12,176,306
- Issue date Dec 24, 2024
- Electronics and Telecommunications Research Institute
- Sang Heung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to voltage compensated switch stack
- Patent number 12,176,304
- Issue date Dec 24, 2024
- Skyworks Solutions, Inc.
- Hanching Fuh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through wafer trench isolation between transistors in an integrated...
- Patent number 12,148,717
- Issue date Nov 19, 2024
- Texas Instruments Incorporated
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride (GAN) three-dimensional integrated circuit technology
- Patent number 12,148,747
- Issue date Nov 19, 2024
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with interposer between integrated circuit dies
- Patent number 12,136,615
- Issue date Nov 5, 2024
- Qorvo US, Inc.
- Matthew Essar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-sided embeddable capacitors for packaged semiconductor devices
- Patent number 12,136,601
- Issue date Nov 5, 2024
- SARAS MICRO DEVICES, INC.
- Carlos Andres Riera Cercado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with capacitance die
- Patent number 12,132,028
- Issue date Oct 29, 2024
- Amazon Technologies, Inc.
- Bassam Abdel-Dayem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier module
- Patent number 12,119,793
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR EMBEDDING ELECTRONIC COMPONENTS IN SUBSTRATES
- Publication number 20250233087
- Publication date Jul 17, 2025
- ADVANCED MICRO DEVICES, INC.
- Arsalan Alam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250226364
- Publication date Jul 10, 2025
- Advanced Semiconductor Engineering, Inc.
- Hung Yi CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INDUCTORS AND INTEGRATED VOLTAGE REGULATORS FOR PACKAGED S...
- Publication number 20250226337
- Publication date Jul 10, 2025
- SARAS MICRO DEVICES, INC.
- Carlos Andres Riera Cercado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE CHIP, SEMICONDUCTOR PACKAGE INCLUDING BRIDGE CHIP AND METHOD...
- Publication number 20250226331
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Seokbeom YONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250226336
- Publication date Jul 10, 2025
- MEDIATEK SINGAPORE PTE LTD
- Zhigang DUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR CERAMIC COMPONENTS EMBEDDED IN A SUBSTRATE CORE
- Publication number 20250218982
- Publication date Jul 3, 2025
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECTS FOR PACKAGES CONTAINING PHOTONIC INTEGRATE...
- Publication number 20250219034
- Publication date Jul 3, 2025
- Celestial AI Inc.
- Matteo Staffaroni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR MOUNTING SEMICONDUCTOR DEVICES IN CAVITIES
- Publication number 20250218956
- Publication date Jul 3, 2025
- Intel Corporation
- Shayan Kaviani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEDESTALS FOR SEMICONDUCTOR COMPONENTS EMBEDDED IN PACKAGE SUBSTRAT...
- Publication number 20250218958
- Publication date Jul 3, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING ASYMMETRIC METALLIZATION STRUCTURES DISPOSED ON OP...
- Publication number 20250218966
- Publication date Jul 3, 2025
- QUALCOMM Incorporated
- Manuel ALDRETE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED INTEGRATED CAPACITOR...
- Publication number 20250218983
- Publication date Jul 3, 2025
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED GLASS PATCH WITH INTE...
- Publication number 20250218955
- Publication date Jul 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO EMBED SEMICONDUCTOR DEVICES IN CORES OF PA...
- Publication number 20250218960
- Publication date Jul 3, 2025
- Intel Corporation
- Clay Bradley Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR A STACK OF COMPONENTS EMBEDDED IN A SUBSTRATE CORE
- Publication number 20250218962
- Publication date Jul 3, 2025
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE AND CONDUCTIVE VIAS EMBEDDED IN A SUBSTRATE
- Publication number 20250218963
- Publication date Jul 3, 2025
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR CONNECTED COMPONENTS EMBEDDED IN A SUBSTRATE CORE
- Publication number 20250218964
- Publication date Jul 3, 2025
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-GROUP PACKAGE HAVING A DEEP TRENCH DEVICE
- Publication number 20250210583
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED VOLTAGE REGULATION MODULE
- Publication number 20250210548
- Publication date Jun 26, 2025
- Chipletz, Inc.
- Siddharth Ravichandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR AN EMBEDDED BRIDGING PACKAGE ARCHITECTURE
- Publication number 20250201690
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183186
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Sungoh Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE STRUCTURES IN EMBEDDED BRIDGE ARCHITECTURES
- Publication number 20250183179
- Publication date Jun 5, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250174581
- Publication date May 29, 2025
- NANYA TECHNOLOGY CORPORATION
- DA-ZEN CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250167141
- Publication date May 22, 2025
- Samsung Electronics, Co., Ltd.
- YoungJun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES INCLUDING TRENCH CAPACITORS AND METHODS OF FORMING THE SAME
- Publication number 20250157915
- Publication date May 15, 2025
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- ANTHONY JEREMY VILLALON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH REINFORCED ELEMENT
- Publication number 20250149469
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250149489
- Publication date May 8, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250132271
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Kyojin Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMIB ARCHITECTURE WITH DEDICATED METAL LAYERS FOR IMPROVING POWER D...
- Publication number 20250125268
- Publication date Apr 17, 2025
- Intel Corporation
- Jianyong XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC RANDOM-ACCESS MEMORY DEVICES AND METHODS OF MANUFACTURING T...
- Publication number 20250125287
- Publication date Apr 17, 2025
- WINBOND ELECTRONICS CORP.
- Te-Hsuan PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250125286
- Publication date Apr 17, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- James Wong
- H01 - BASIC ELECTRIC ELEMENTS

Capacitive arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit including standard cells and at least one capaci...

Packaged electronic system formed by electrically connected and gal...

Stackable and embeddable vertical capacitors in semiconductor devic...

Through-substrate underfill formation for an integrated circuit ass...

Substrateless double-sided embedded multi-die interconnect bridge

Semiconductor package with integrated capacitors

Structure and structure with electronic component

Mechanically tolerant couplers

Methods of resistance and capacitance reduction to circuit output n...

Hybrid integrated circuit package

Capacitor structure and method for forming the same

Semiconductor package with integrated capacitors

Method of manufacturing a trench capacitor with wafer bow

Capacitive coupling in a direct-bonded interface for microelectroni...

Die-group package having a deep trench device

Semiconductor package structure

Package structure with reinforced element

EMIB architecture with dedicated metal layers for improving power d...

Power supply system and power supply module

Selective area metal process for improved metallurgical bonding of...

Embedded inductors and integrated voltage regulators for packaged s...

Configurable metal—insulator—metal capacitor and devices

Electrical circuit of semiconductor channel resistor and apparatus...

Devices and methods related to voltage compensated switch stack

Through wafer trench isolation between transistors in an integrated...

Gallium nitride (GAN) three-dimensional integrated circuit technology

Electronic package with interposer between integrated circuit dies

Single-sided embeddable capacitors for packaged semiconductor devices

Semiconductor package with capacitance die

Power amplifier module

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR EMBEDDING ELECTRONIC COMPONENTS IN SUBSTRATES

PACKAGE STRUCTURE

EMBEDDED INDUCTORS AND INTEGRATED VOLTAGE REGULATORS FOR PACKAGED S...

BRIDGE CHIP, SEMICONDUCTOR PACKAGE INCLUDING BRIDGE CHIP AND METHOD...

SEMICONDUCTOR PACKAGE STRUCTURE

TECHNOLOGIES FOR CERAMIC COMPONENTS EMBEDDED IN A SUBSTRATE CORE

ELECTRICAL INTERCONNECTS FOR PACKAGES CONTAINING PHOTONIC INTEGRATE...

METHODS AND APPARATUS FOR MOUNTING SEMICONDUCTOR DEVICES IN CAVITIES

PEDESTALS FOR SEMICONDUCTOR COMPONENTS EMBEDDED IN PACKAGE SUBSTRAT...

SUBSTRATE HAVING ASYMMETRIC METALLIZATION STRUCTURES DISPOSED ON OP...

MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED INTEGRATED CAPACITOR...

MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED GLASS PATCH WITH INTE...

METHODS AND APPARATUS TO EMBED SEMICONDUCTOR DEVICES IN CORES OF PA...

TECHNOLOGIES FOR A STACK OF COMPONENTS EMBEDDED IN A SUBSTRATE CORE

DIE AND CONDUCTIVE VIAS EMBEDDED IN A SUBSTRATE

TECHNOLOGIES FOR CONNECTED COMPONENTS EMBEDDED IN A SUBSTRATE CORE

DIE-GROUP PACKAGE HAVING A DEEP TRENCH DEVICE

EMBEDDED VOLTAGE REGULATION MODULE

SYSTEM AND METHODS FOR AN EMBEDDED BRIDGING PACKAGE ARCHITECTURE

SEMICONDUCTOR PACKAGE

PASSIVE STRUCTURES IN EMBEDDED BRIDGE ARCHITECTURES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

STRUCTURES INCLUDING TRENCH CAPACITORS AND METHODS OF FORMING THE SAME

PACKAGE STRUCTURE WITH REINFORCED ELEMENT

Multi-Die Fine Grain Integrated Voltage Regulation

SEMICONDUCTOR PACKAGE

EMIB ARCHITECTURE WITH DEDICATED METAL LAYERS FOR IMPROVING POWER D...

DYNAMIC RANDOM-ACCESS MEMORY DEVICES AND METHODS OF MANUFACTURING T...

SEMICONDUCTOR DEVICE