Capacitive arrangements

Industry

CPC
H01L23/642

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/642Capacitive arrangements

Industries

Patents Grantslast 30 patents

Information Patent Grant
Embedded inductors and integrated voltage regulators for packaged s...
- Patent number 12,183,692
- Issue date Dec 31, 2024
- SARAS MICRO DEVICES, INC.
- Carlos Riera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configurable metal—insulator—metal capacitor and devices
- Patent number 12,183,669
- Issue date Dec 31, 2024
- MACOM Technology Solutions Holdings, Inc.
- Jeremy Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical circuit of semiconductor channel resistor and apparatus...
- Patent number 12,176,306
- Issue date Dec 24, 2024
- Electronics and Telecommunications Research Institute
- Sang Heung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to voltage compensated switch stack
- Patent number 12,176,304
- Issue date Dec 24, 2024
- Skyworks Solutions, Inc.
- Hanching Fuh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through wafer trench isolation between transistors in an integrated...
- Patent number 12,148,717
- Issue date Nov 19, 2024
- Texas Instruments Incorporated
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride (GAN) three-dimensional integrated circuit technology
- Patent number 12,148,747
- Issue date Nov 19, 2024
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with interposer between integrated circuit dies
- Patent number 12,136,615
- Issue date Nov 5, 2024
- Qorvo US, Inc.
- Matthew Essar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-sided embeddable capacitors for packaged semiconductor devices
- Patent number 12,136,601
- Issue date Nov 5, 2024
- SARAS MICRO DEVICES, INC.
- Carlos Andres Riera Cercado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with capacitance die
- Patent number 12,132,028
- Issue date Oct 29, 2024
- Amazon Technologies, Inc.
- Bassam Abdel-Dayem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier module
- Patent number 12,119,793
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making the same
- Patent number 12,113,031
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating thereof
- Patent number 12,113,035
- Issue date Oct 8, 2024
- Samsung Electronics Co., Ltd.
- Jin-su Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded resistor-capacitor film for fan out wafer level packaging
- Patent number 12,100,674
- Issue date Sep 24, 2024
- Dialog Semiconductor (UK) Limited
- Ernesto Gutierrez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data processing device
- Patent number 12,094,802
- Issue date Sep 17, 2024
- Delta Electronics (Shanghai) Co., Ltd.
- Pengkai Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device capable of realizing a wide band impedance mat...
- Patent number 12,094,840
- Issue date Sep 17, 2024
- Sumitomo Electric Device Innovations, Inc.
- Masahiro Hirayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Size and efficiency of dies
- Patent number 12,094,827
- Issue date Sep 17, 2024
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip protected against back-face attacks
- Patent number 12,087,708
- Issue date Sep 10, 2024
- STMicroelectronics (Crolles 2) SAS
- Sebastien Petitdidier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic apparatus
- Patent number 12,080,745
- Issue date Sep 3, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Takatoshi Kameshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die fine grain integrated voltage regulation
- Patent number 12,068,324
- Issue date Aug 20, 2024
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,068,234
- Issue date Aug 20, 2024
- United Microelectronics Corp.
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a lateral transistor device and an inve...
- Patent number 12,068,379
- Issue date Aug 20, 2024
- Infineon Technologies Austria AG
- Oliver Häberlen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adapter board and method for forming same, packaging method, and pa...
- Patent number 12,068,233
- Issue date Aug 20, 2024
- SEMICONDUCTOR MANUFACTURING NORTH CHINA (BEIJING) CORPORATION
- Cai Qiaoming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Size and efficiency of dies
- Patent number 12,051,651
- Issue date Jul 30, 2024
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated physical unclonable function device
- Patent number 12,052,376
- Issue date Jul 30, 2024
- STMicroelectronics (Crolles 2) SAS
- Benoit Froment
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip card body, method for forming a chip card body and chip card
- Patent number 12,051,640
- Issue date Jul 30, 2024
- Infineon Technologies AG
- Walther Pachler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency integrated circuit
- Patent number 12,040,290
- Issue date Jul 16, 2024
- National Tsing Hua University
- Rachit Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a trench capacitor with wafer bow
- Patent number 12,033,806
- Issue date Jul 9, 2024
- SK keyfoundry Inc.
- Seung Mo Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,033,924
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and method of manufacturing the interposer
- Patent number 12,014,935
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High linear range humidity sensor
- Patent number 11,977,044
- Issue date May 7, 2024
- Murata Manufacturing Co., Ltd.
- Vivek Saraf
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING DEEP TRE...
- Publication number 20250006665
- Publication date Jan 2, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Structures and Assemblies
- Publication number 20240429182
- Publication date Dec 26, 2024
- KYOCERA AVX Components Corporation
- Laurent Desclos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVING SIZE AND EFFICIENCY OF DIES
- Publication number 20240413089
- Publication date Dec 12, 2024
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR COMPONENT
- Publication number 20240413056
- Publication date Dec 12, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chi Hyeon JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA PROCESSING DEVICE
- Publication number 20240404915
- Publication date Dec 5, 2024
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Pengkai JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240395735
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL TESTING OF SEMICONDUCTOR PACKAGES
- Publication number 20240387296
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya Huei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240387414
- Publication date Nov 21, 2024
- DENSO CORPORATION
- Masakazu SHIGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20240371787
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING PASSIVE COMPONENT AND METHOD OF MANU...
- Publication number 20240371797
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-TAI LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENERGY HARVEST AND STORAGE DEVICE FOR SEMICONDUCTOR CHIPS AND METHO...
- Publication number 20240371798
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuen-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER POWER, CONVERTER WITH DEVICES HAVING REDUCED LATERAL CUR...
- Publication number 20240363604
- Publication date Oct 31, 2024
- pSemi Corporation
- David Giuliano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVER AND UNDER INTERCONNECTS
- Publication number 20240347443
- Publication date Oct 17, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Die Substrate with Edge-Mounted Capacitors
- Publication number 20240332223
- Publication date Oct 3, 2024
- NVIDIA Corporation
- Tracy Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR EMBEDDING FOR FLIP CHIP PACKAGES
- Publication number 20240332433
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE SEMICONDUCTOR PACKAGE CAPACITORS AND METHOD
- Publication number 20240332222
- Publication date Oct 3, 2024
- Intel Corporation
- Archanna Srinivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321701
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Jeonghyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321812
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Takeshi MURASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321775
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Shlege LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A TRENCH CAPACITOR WITH WAFER BOW
- Publication number 20240312725
- Publication date Sep 19, 2024
- SK keyfoundry Inc.
- Seung Mo JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE INCLUDING AT LEAST ONE AIR GAP AND METHOD FOR MAN...
- Publication number 20240304523
- Publication date Sep 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE INCLUDING AT LEAST ONE AIR GAP AND METHOD FOR MAN...
- Publication number 20240304522
- Publication date Sep 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY RF PACKAGE CONFIGURATIONS
- Publication number 20240282722
- Publication date Aug 22, 2024
- Infinera Corporation
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING THERMAL DISSIPATION STRUCTURE THEREIN AND...
- Publication number 20240258122
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE ELECTRONIC COMPONENT
- Publication number 20240234389
- Publication date Jul 11, 2024
- Murata Manufacturing Co., Ltd.
- Yukihiro FUJITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE
- Publication number 20240234283
- Publication date Jul 11, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN P...
- Publication number 20240222295
- Publication date Jul 4, 2024
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES
- Publication number 20240213156
- Publication date Jun 27, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240194618
- Publication date Jun 13, 2024
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- HUI DONG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...
- Publication number 20240186227
- Publication date Jun 6, 2024
- Intel Corporation
- Haobo Chen
- H01 - BASIC ELECTRIC ELEMENTS

Capacitive arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embedded inductors and integrated voltage regulators for packaged s...

Configurable metal—insulator—metal capacitor and devices

Electrical circuit of semiconductor channel resistor and apparatus...

Devices and methods related to voltage compensated switch stack

Through wafer trench isolation between transistors in an integrated...

Gallium nitride (GAN) three-dimensional integrated circuit technology

Electronic package with interposer between integrated circuit dies

Single-sided embeddable capacitors for packaged semiconductor devices

Semiconductor package with capacitance die

Power amplifier module

Semiconductor device and method of making the same

Semiconductor device and method for fabricating thereof

Embedded resistor-capacitor film for fan out wafer level packaging

Data processing device

Semiconductor device capable of realizing a wide band impedance mat...

Size and efficiency of dies

Chip protected against back-face attacks

Solid-state imaging device and electronic apparatus

Multi-die fine grain integrated voltage regulation

Semiconductor structure

Semiconductor device having a lateral transistor device and an inve...

Adapter board and method for forming same, packaging method, and pa...

Size and efficiency of dies

Integrated physical unclonable function device

Chip card body, method for forming a chip card body and chip card

Radio frequency integrated circuit

Method of manufacturing a trench capacitor with wafer bow

Semiconductor package

Interposer and method of manufacturing the interposer

High linear range humidity sensor

Patents Applicationslast 30 patents

METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING DEEP TRE...

Multilayer Structures and Assemblies

IMPROVING SIZE AND EFFICIENCY OF DIES

CAPACITOR COMPONENT

DATA PROCESSING DEVICE

ELECTRONIC DEVICE

ELECTRICAL TESTING OF SEMICONDUCTOR PACKAGES

POWER MODULE

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR STRUCTURE HAVING PASSIVE COMPONENT AND METHOD OF MANU...

ENERGY HARVEST AND STORAGE DEVICE FOR SEMICONDUCTOR CHIPS AND METHO...

MULTILAYER POWER, CONVERTER WITH DEVICES HAVING REDUCED LATERAL CUR...

OVER AND UNDER INTERCONNECTS

Chip Die Substrate with Edge-Mounted Capacitors

CAPACITOR EMBEDDING FOR FLIP CHIP PACKAGES

CONFIGURABLE SEMICONDUCTOR PACKAGE CAPACITORS AND METHOD

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

METHOD OF MANUFACTURING A TRENCH CAPACITOR WITH WAFER BOW

CIRCUIT STRUCTURE INCLUDING AT LEAST ONE AIR GAP AND METHOD FOR MAN...

CIRCUIT STRUCTURE INCLUDING AT LEAST ONE AIR GAP AND METHOD FOR MAN...

BALL GRID ARRAY RF PACKAGE CONFIGURATIONS

PACKAGE STRUCTURE HAVING THERMAL DISSIPATION STRUCTURE THEREIN AND...

COMPOSITE ELECTRONIC COMPONENT

ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE

STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN P...

LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...