Capacitor integral with or on the leadframe

Industry

CPC
H01L23/49589

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49589Capacitor integral with or on the leadframe

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package substrate having integrated passive device(s) between leads
- Patent number 12,218,036
- Issue date Feb 4, 2025
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier device and semiconductor die
- Patent number 12,206,371
- Issue date Jan 21, 2025
- Ampleon Netherlands B.V.
- Josephus Henricus Bartholomeus Van Der Zanden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated magnetic assembly with conductive field plates
- Patent number 12,183,693
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,176,271
- Issue date Dec 24, 2024
- Rohm Co., Ltd.
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded metal insulator metal structure
- Patent number 12,170,241
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead package with surface mounted structure
- Patent number 12,159,820
- Issue date Dec 3, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead package with surface mounted structure
- Patent number 12,074,100
- Issue date Aug 27, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method of manufacture
- Patent number 12,068,276
- Issue date Aug 20, 2024
- STMicroelectronics S.R.L.
- Giovanni Graziosi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,990,455
- Issue date May 21, 2024
- Rohm Co., Ltd.
- Hiroyuki Sakairi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for thin film capacitor integration
- Patent number 11,948,871
- Issue date Apr 2, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,923,278
- Issue date Mar 5, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,842,949
- Issue date Dec 12, 2023
- Rohm Co., Ltd.
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated capacitor with extended head bump bond pillar
- Patent number 11,810,843
- Issue date Nov 7, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with flexibility in capacitor design for powe...
- Patent number 11,804,826
- Issue date Oct 31, 2023
- MediaTek Singapore Pte Ltd.
- Zhigang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including electrical component connecting a se...
- Patent number 11,764,134
- Issue date Sep 19, 2023
- STMicroelectronics S.r.l.
- Alberto Arrigoni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assembly having flipped chip transistors
- Patent number 11,742,267
- Issue date Aug 29, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Hitoshi Fujioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flippable leadframe for packaged electronic system having verticall...
- Patent number 11,742,263
- Issue date Aug 29, 2023
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated magnetic assembly with conductive field plates
- Patent number 11,728,289
- Issue date Aug 15, 2023
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,705,442
- Issue date Jul 18, 2023
- Kabushiki Kaisha Toshiba
- Atsushi Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe capacitors
- Patent number 11,688,672
- Issue date Jun 27, 2023
- Texas Instruments Incorporated
- Vijaylaxmi Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,670,558
- Issue date Jun 6, 2023
- Mitsubishi Electric Corporation
- Masafumi Jochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery for multi-chip-package using in-package voltage regu...
- Patent number 11,671,010
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Alan Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,664,298
- Issue date May 30, 2023
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a laser-connected terminal
- Patent number 11,664,342
- Issue date May 30, 2023
- Fuji Electric Co., Ltd.
- Shinji Tada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method
- Patent number 11,626,355
- Issue date Apr 11, 2023
- STMicroelectronics S.r.l.
- Fulvio Vittorio Fontana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing redistribution substrate
- Patent number 11,626,354
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Seokhyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low inductance laser driver packaging using lead-frame and thin die...
- Patent number 11,611,193
- Issue date Mar 21, 2023
- Excelitas Canada, Inc.
- Gabriel Charlebois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate having integrated passive device(s) between leads
- Patent number 11,600,555
- Issue date Mar 7, 2023
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact low inductance chip-on-chip power card
- Patent number 11,538,739
- Issue date Dec 27, 2022
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding between isolation capacitors for multichip modules
- Patent number 11,495,553
- Issue date Nov 8, 2022
- Texas Instruments Incorporated
- Thomas Dyer Bonifield
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
WIDE BANDGAP POWER DEVICES WITH LOW POWER LOOP INDUCTANCE
- Publication number 20250112126
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH INDUCTOR IN MAGNETIC PACKAGE
- Publication number 20250081476
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Hidetoshi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING PACKAGE STRUCTURE
- Publication number 20250046686
- Publication date Feb 6, 2025
- LITE-ON SINGAPORE PTE. LTD.
- YOU-FA WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250029902
- Publication date Jan 23, 2025
- Realtek Semiconductor Corp.
- Nai-Jen Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE
- Publication number 20240413120
- Publication date Dec 12, 2024
- STMicroelectronics S.r.l
- Giovanni GRAZIOSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH WAFER LEVEL CAPACITOR
- Publication number 20240404929
- Publication date Dec 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kapil Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED METAL INSULATOR METAL STRUCTURE
- Publication number 20240363505
- Publication date Oct 31, 2024
- TAIWAN SEMICONDUTOR MANUFACTURING COMPANY, LTD.
- Feng-Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240347430
- Publication date Oct 17, 2024
- Mitsubishi Electric Corporation
- Toshifumi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES
- Publication number 20240290676
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THIN FILM CAPACITOR INTEGRATION
- Publication number 20240194574
- Publication date Jun 13, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING PACKAGE STRUCTURE
- Publication number 20240194573
- Publication date Jun 13, 2024
- LITE-ON SINGAPORE PTE. LTD.
- You-Fa WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240178110
- Publication date May 30, 2024
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH ELECTRICAL INSULATION FEATURES AND ASSOC...
- Publication number 20240153885
- Publication date May 9, 2024
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145413
- Publication date May 2, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Makoto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240112992
- Publication date Apr 4, 2024
- ROHM CO., LTD.
- Isamu NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Die Integrated Circuit System in an Integrated Circuit Package...
- Publication number 20240088112
- Publication date Mar 14, 2024
- TDK - Micronas GmbH
- Paolo Marozzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240055328
- Publication date Feb 15, 2024
- ROHM CO., LTD.
- Atsushi YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE
- Publication number 20240006277
- Publication date Jan 4, 2024
- STMicroelectronics S.r.l
- Alberto ARRIGONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERDIGITAL CAPACITOR
- Publication number 20230402356
- Publication date Dec 14, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MAGNETIC ASSEMBLY WITH CONDUCTIVE FIELD PLATES
- Publication number 20230387043
- Publication date Nov 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230275009
- Publication date Aug 31, 2023
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY FOR MULTI-CHIP-PACKAGE USING IN-PACKAGE VOLTAGE REGU...
- Publication number 20230261572
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alan Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING INTEGRATED PASSIVE DEVICE(S) BETWEEN LEADS
- Publication number 20230207430
- Publication date Jun 29, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IPD COMPONENTS HAVING SIC SUBSTRATES AND DEVICES AND PROCESSES IMPL...
- Publication number 20230197587
- Publication date Jun 22, 2023
- Wolfspeed, Inc.
- Donald FARRELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20230099673
- Publication date Mar 30, 2023
- LAPIS TECHNOLOGY CO., LTD.
- KOYA SHIMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH TEMPERATURE SENSOR
- Publication number 20230014718
- Publication date Jan 19, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF A PASSIVE COMPONENT IN A CAVITY OF AN INTEGRATED CIR...
- Publication number 20220415768
- Publication date Dec 29, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey MORRONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead Frame Based Molded Radio Frequency Package
- Publication number 20220415763
- Publication date Dec 29, 2022
- Ampleon Netherlands B.V.
- Jurgen Raben
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MAGNETIC ASSEMBLY WITH CONDUCTIVE FIELD PLATES
- Publication number 20220384370
- Publication date Dec 1, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THIN FILM CAPACITOR INTEGRATION
- Publication number 20220375836
- Publication date Nov 24, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS

Capacitor integral with or on the leadframe

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package substrate having integrated passive device(s) between leads

Power amplifier device and semiconductor die

Integrated magnetic assembly with conductive field plates

Semiconductor device

Embedded metal insulator metal structure

Flat no-lead package with surface mounted structure

Flat no-lead package with surface mounted structure

Semiconductor device and corresponding method of manufacture

Semiconductor device

Process for thin film capacitor integration

Semiconductor module

Semiconductor device

Integrated capacitor with extended head bump bond pillar

Semiconductor devices with flexibility in capacitor design for powe...

Semiconductor device including electrical component connecting a se...

Power electronics assembly having flipped chip transistors

Flippable leadframe for packaged electronic system having verticall...

Integrated magnetic assembly with conductive field plates

Semiconductor device

Leadframe capacitors

Semiconductor device

Power delivery for multi-chip-package using in-package voltage regu...

Semiconductor module

Semiconductor device with a laser-connected terminal

Semiconductor device and corresponding method

Method of manufacturing redistribution substrate

Low inductance laser driver packaging using lead-frame and thin die...

Package substrate having integrated passive device(s) between leads

Compact low inductance chip-on-chip power card

Wire bonding between isolation capacitors for multichip modules

Patents Applicationslast 30 patents

WIDE BANDGAP POWER DEVICES WITH LOW POWER LOOP INDUCTANCE

INTEGRATED CIRCUIT WITH INDUCTOR IN MAGNETIC PACKAGE

CAPACITIVE COUPLING PACKAGE STRUCTURE

LEAD FRAME AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE

ELECTRONIC DEVICE WITH WAFER LEVEL CAPACITOR

EMBEDDED METAL INSULATOR METAL STRUCTURE

POWER CONVERSION DEVICE AND MANUFACTURING METHOD THEREFOR

SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES

PROCESS FOR THIN FILM CAPACITOR INTEGRATION

CAPACITIVE COUPLING PACKAGE STRUCTURE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICES WITH ELECTRICAL INSULATION FEATURES AND ASSOC...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Dual Die Integrated Circuit System in an Integrated Circuit Package...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE

INTERDIGITAL CAPACITOR

INTEGRATED MAGNETIC ASSEMBLY WITH CONDUCTIVE FIELD PLATES

SEMICONDUCTOR MODULE

POWER DELIVERY FOR MULTI-CHIP-PACKAGE USING IN-PACKAGE VOLTAGE REGU...

PACKAGE SUBSTRATE HAVING INTEGRATED PASSIVE DEVICE(S) BETWEEN LEADS

IPD COMPONENTS HAVING SIC SUBSTRATES AND DEVICES AND PROCESSES IMPL...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE WITH TEMPERATURE SENSOR

INTEGRATION OF A PASSIVE COMPONENT IN A CAVITY OF AN INTEGRATED CIR...

Lead Frame Based Molded Radio Frequency Package

INTEGRATED MAGNETIC ASSEMBLY WITH CONDUCTIVE FIELD PLATES

PROCESS FOR THIN FILM CAPACITOR INTEGRATION