Capacitor

Industry

CPC
H01L2924/1205

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1205Capacitor

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
IPD modules with flexible connection scheme in packaging
- Patent number 12,368,141
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure and method of making the same
- Patent number 12,336,201
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jian-Shiou Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assembly with hybrid bonding
- Patent number 12,300,655
- Issue date May 13, 2025
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,272,662
- Issue date Apr 8, 2025
- United Microelectronics Corporation
- Chien-Ming Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,266,648
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 12,255,153
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical receiving circuit
- Patent number 12,243,862
- Issue date Mar 4, 2025
- Nippon Telegraph and Telephone Corporation
- Atsushi Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device having laterally extending capacitors of different le...
- Patent number 12,238,917
- Issue date Feb 25, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-typed integrated passive device (IPD) components and devices...
- Patent number 12,230,614
- Issue date Feb 18, 2025
- MACOM Technology Solutions Holdings, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for improving power integrity characteristics
- Patent number 12,213,256
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Junghwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical devices and methods of manufacture
- Patent number 12,199,046
- Issue date Jan 14, 2025
- Faraday Semi, Inc.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device
- Patent number 12,173,207
- Issue date Dec 24, 2024
- Celanese Mercury Holdings Inc.
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package and method of fabricating the same
- Patent number 12,154,875
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,080,692
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Keisuke Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep partition power delivery with deep trench capacitor
- Patent number 12,068,295
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die fine grain integrated voltage regulation
- Patent number 12,068,324
- Issue date Aug 20, 2024
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF device without silicon handle substrate for enhanced thermal and...
- Patent number 12,062,623
- Issue date Aug 13, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 12,009,335
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,002,794
- Issue date Jun 4, 2024
- Rohm Co., Ltd.
- Takumi Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,967,528
- Issue date Apr 23, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,942,431
- Issue date Mar 26, 2024
- Kioxia Corporation
- Nobuyuki Momo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive device (IPD) components and a package and proces...
- Patent number 11,935,879
- Issue date Mar 19, 2024
- Wolfspeed, Inc.
- Eng Wah Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF device without silicon handle substrate for enhanced thermal and...
- Patent number 11,923,313
- Issue date Mar 5, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 11,901,281
- Issue date Feb 13, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming integrated circuit package
- Patent number 11,876,026
- Issue date Jan 16, 2024
- Medtronic, Inc.
- Chunho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with support members and assoc...
- Patent number 11,855,065
- Issue date Dec 26, 2023
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with die support members and a...
- Patent number 11,824,044
- Issue date Nov 21, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,824,054
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor structure with a deep trench capacitor structures and...
- Publication number 20250240985
- Publication date Jul 24, 2025
- UNITED MICROELECTRONICS CORP.
- Yi-Fan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component
- Publication number 20250218989
- Publication date Jul 3, 2025
- INTELPRO INC.
- Lung-Kun Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR POWER AND SPACER COMPONENTS EMBEDDED IN A SUBSTRAT...
- Publication number 20250218904
- Publication date Jul 3, 2025
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technologies for Components Embedded in a Substrate Core
- Publication number 20250219040
- Publication date Jul 3, 2025
- Intel Corporation
- Tolga ACIKALIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED PASSIVE ASSEMBLIES FOR EMBEDDING IN THICK CORES
- Publication number 20250218906
- Publication date Jul 3, 2025
- Intel Corporation
- Zhixin XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER FOR EMBEDDED COMPONENT IN CORE
- Publication number 20250218952
- Publication date Jul 3, 2025
- Intel Corporation
- Benjamin DUONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONITORING OF ELECTRONIC PACKAGES
- Publication number 20250210444
- Publication date Jun 26, 2025
- SK Hynix NAND Product Solutions Corp. (dba Solidigm)
- Jorge MARTINEZ ARAIZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR AN EMBEDDED BRIDGING PACKAGE ARCHITECTURE
- Publication number 20250201690
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH MIM CAPACITOR AND FABRICATING METHOD OF THE SAME
- Publication number 20250194118
- Publication date Jun 12, 2025
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layered Metal Frame Power Package
- Publication number 20250183130
- Publication date Jun 5, 2025
- Ferric Inc.
- Noah Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED VERTICAL POWER MODULE
- Publication number 20250183144
- Publication date Jun 5, 2025
- Analog Devices, Inc.
- John David Brazzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20250174407
- Publication date May 29, 2025
- Murata Manufacturing Co., Ltd.
- Hisaki KITAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20250167048
- Publication date May 22, 2025
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157912
- Publication date May 15, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Takuma MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PASSIVE DEVICES FOR INTEGRATED CIRCUITS AND METHODS OF FOR...
- Publication number 20250149427
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Yueh Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250149489
- Publication date May 8, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDE BANDGAP POWER DEVICES WITH LOW POWER LOOP INDUCTANCE
- Publication number 20250112126
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISAGGREGATED PROCESSOR ARCHITECTURES USING SELECTIVE TRANSFER TEC...
- Publication number 20250112204
- Publication date Apr 3, 2025
- Intel Corporation
- Adel Elsherbini
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES
- Publication number 20250105136
- Publication date Mar 27, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND EL...
- Publication number 20250098172
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Hak Seon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, WIRELESS COMMUNICATION DEVICE, AND METHOD FOR...
- Publication number 20250096180
- Publication date Mar 20, 2025
- Fujitsu Limited
- Shirou OZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250098289
- Publication date Mar 20, 2025
- Kabushiki Kaisha Toshiba
- Yusuke KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH A PASSIVE COMPONENT BLOCK
- Publication number 20250096111
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Michelle Yejin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH INDUCTOR IN MAGNETIC PACKAGE
- Publication number 20250081476
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Hidetoshi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH AN EMBEDDED PASSIVE DEVICE
- Publication number 20250079348
- Publication date Mar 6, 2025
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES AS A SOLID STA...
- Publication number 20250079399
- Publication date Mar 6, 2025
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING SUBSTRATE WITH PASSIVE ELECTRONIC COMPONENT EMBEDD...
- Publication number 20250070001
- Publication date Feb 27, 2025
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250046738
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250038095
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Junho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INTEGRATED STACK CAPACITOR (ISC) IN SUBSTRATE BUILD-UP LAYER
- Publication number 20250014986
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Rui ZHANG
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

IPD modules with flexible connection scheme in packaging

Capacitor structure and method of making the same

Integrated circuit assembly with hybrid bonding

Semiconductor structure

Package structure

Wire bond wires for interference shielding

Optical receiving circuit

Memory device having laterally extending capacitors of different le...

Multi-typed integrated passive device (IPD) components and devices...

Semiconductor package for improving power integrity characteristics

Electrical devices and methods of manufacture

Method of manufacturing an electronic device

Package and method of fabricating the same

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method to minimize stress on stack via

Deep partition power delivery with deep trench capacitor

Multi-die fine grain integrated voltage regulation

RF device without silicon handle substrate for enhanced thermal and...

Structure and method of forming a joint assembly

Semiconductor device

Multiple plated via arrays of different wire heights on a same subs...

Structure and method for fabricating a computing system with an int...

Semiconductor device and manufacturing method thereof

Integrated passive device (IPD) components and a package and proces...

RF device without silicon handle substrate for enhanced thermal and...

Bonded structures with integrated passive component

Method of forming integrated circuit package

Stacked semiconductor die assemblies with support members and assoc...

Stacked semiconductor die assemblies with die support members and a...

Package structure

Patents Applicationslast 30 patents

Semiconductor structure with a deep trench capacitor structures and...

Electronic Component

TECHNOLOGIES FOR POWER AND SPACER COMPONENTS EMBEDDED IN A SUBSTRAT...

Technologies for Components Embedded in a Substrate Core

RECONSTITUTED PASSIVE ASSEMBLIES FOR EMBEDDING IN THICK CORES

SPACER FOR EMBEDDED COMPONENT IN CORE

MONITORING OF ELECTRONIC PACKAGES

SYSTEM AND METHODS FOR AN EMBEDDED BRIDGING PACKAGE ARCHITECTURE

INTERPOSER WITH MIM CAPACITOR AND FABRICATING METHOD OF THE SAME

Multi-Layered Metal Frame Power Package

STACKED VERTICAL POWER MODULE

ELECTRONIC COMPONENT

Structure and Method for Fabricating a Computing System with an Int...

SEMICONDUCTOR DEVICE

EMBEDDED PASSIVE DEVICES FOR INTEGRATED CIRCUITS AND METHODS OF FOR...

Multi-Die Fine Grain Integrated Voltage Regulation

WIDE BANDGAP POWER DEVICES WITH LOW POWER LOOP INDUCTANCE

DISAGGREGATED PROCESSOR ARCHITECTURES USING SELECTIVE TRANSFER TEC...

CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES

SEMICONDUCTOR MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND EL...

SEMICONDUCTOR DEVICE, WIRELESS COMMUNICATION DEVICE, AND METHOD FOR...

SEMICONDUCTOR DEVICE

PACKAGE COMPRISING A SUBSTRATE WITH A PASSIVE COMPONENT BLOCK

INTEGRATED CIRCUIT WITH INDUCTOR IN MAGNETIC PACKAGE

PACKAGE COMPRISING A SUBSTRATE WITH AN EMBEDDED PASSIVE DEVICE

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES AS A SOLID STA...

DEVICE INCLUDING SUBSTRATE WITH PASSIVE ELECTRONIC COMPONENT EMBEDD...

PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

EMBEDDED INTEGRATED STACK CAPACITOR (ISC) IN SUBSTRATE BUILD-UP LAYER