Capacitor

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CPC
H01L2924/1205

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/1205Capacitor

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electrical devices and methods of manufacture
- Patent number 12,199,046
- Issue date Jan 14, 2025
- Faraday Semi, Inc.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device
- Patent number 12,173,207
- Issue date Dec 24, 2024
- Celanese Mercury Holdings Inc.
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package and method of fabricating the same
- Patent number 12,154,875
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,080,692
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Keisuke Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep partition power delivery with deep trench capacitor
- Patent number 12,068,295
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die fine grain integrated voltage regulation
- Patent number 12,068,324
- Issue date Aug 20, 2024
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF device without silicon handle substrate for enhanced thermal and...
- Patent number 12,062,623
- Issue date Aug 13, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 12,009,335
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,002,794
- Issue date Jun 4, 2024
- Rohm Co., Ltd.
- Takumi Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,967,528
- Issue date Apr 23, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,942,431
- Issue date Mar 26, 2024
- Kioxia Corporation
- Nobuyuki Momo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive device (IPD) components and a package and proces...
- Patent number 11,935,879
- Issue date Mar 19, 2024
- Wolfspeed, Inc.
- Eng Wah Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF device without silicon handle substrate for enhanced thermal and...
- Patent number 11,923,313
- Issue date Mar 5, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 11,901,281
- Issue date Feb 13, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming integrated circuit package
- Patent number 11,876,026
- Issue date Jan 16, 2024
- Medtronic, Inc.
- Chunho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with support members and assoc...
- Patent number 11,855,065
- Issue date Dec 26, 2023
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with die support members and a...
- Patent number 11,824,044
- Issue date Nov 21, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,824,054
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,810,867
- Issue date Nov 7, 2023
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IPD modules with flexible connection scheme in packaging
- Patent number 11,798,925
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep partition power delivery with deep trench capacitor
- Patent number 11,784,172
- Issue date Oct 10, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING HSINCHU, CO., LTD.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor and display substrate having the same
- Patent number 11,769,834
- Issue date Sep 26, 2023
- Samsung Display Co., Ltd.
- Jong Yun Kim
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Capacitor integrated structure
- Patent number 11,756,989
- Issue date Sep 12, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Wei-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method of manufacturing electronic module
- Patent number 11,756,906
- Issue date Sep 12, 2023
- Murata Manufacturing Co., Ltd.
- Takashi Iwamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced dummy die for MCP
- Patent number 11,756,941
- Issue date Sep 12, 2023
- Intel Corporation
- John Fallin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF device without silicon handle substrate for enhanced thermal and...
- Patent number 11,710,704
- Issue date Jul 25, 2023
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package utilizing molded interposer
- Patent number 11,710,693
- Issue date Jul 25, 2023
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assembly with hybrid bonding
- Patent number 11,670,614
- Issue date Jun 6, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED INTEGRATED STACK CAPACITOR (ISC) IN SUBSTRATE BUILD-UP LAYER
- Publication number 20250014986
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Rui ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250015033
- Publication date Jan 9, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING SAME
- Publication number 20250015066
- Publication date Jan 9, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Xiaochen XUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH SUPERIMPOSED CHIPS AND CAPACITIVE CONNECTION
- Publication number 20250006626
- Publication date Jan 2, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Didier BELOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING DEEP TRE...
- Publication number 20250006665
- Publication date Jan 2, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Decoupling Capacitor Structures And Assemblies
- Publication number 20240429157
- Publication date Dec 26, 2024
- KYOCERA AVX Components Corporation
- Laurent Desclos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...
- Publication number 20240421051
- Publication date Dec 19, 2024
- Deca Technologies USA, Inc.
- Timothy L. OLSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240413106
- Publication date Dec 12, 2024
- United Microelectronics Corp.
- Chien-Ming Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IPD MODULES WITH FLEXIBLE CONNECTION SCHEME IN PACKAGING
- Publication number 20240405005
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-IN PACKAGE COMPONENT, ELECTRONIC DEVICE, AND SYSTEM-IN PACKA...
- Publication number 20240405007
- Publication date Dec 5, 2024
- Huawei Technologies Co., Ltd
- Lei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240363568
- Publication date Oct 31, 2024
- MEDIATEK SINGAPORE PTE LTD
- Zhigang DUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BIDIRECTIONAL FOUR QUADRANT SWITCHES WITH DRIVERS AND IN...
- Publication number 20240355717
- Publication date Oct 24, 2024
- Navitas Semiconductor Limited
- Alfred Hesener
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP PARTITION POWER DELIVERY WITH DEEP TRENCH CAPACITOR
- Publication number 20240355799
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Die Substrate with Edge-Mounted Capacitors
- Publication number 20240332223
- Publication date Oct 3, 2024
- NVIDIA Corporation
- Tracy Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING A SEMICONDUCT...
- Publication number 20240312874
- Publication date Sep 19, 2024
- SERIPHY TECHNOLOGY CORPORATION
- TZU-WEI CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED RADIO FREQUENCY POWERED LIGHT EMITTING DIODE CHIPS AND F...
- Publication number 20240290766
- Publication date Aug 29, 2024
- CreeLED, Inc.
- Michael Check
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20240282743
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING A CAPACITOR FORMED IN A C...
- Publication number 20240282740
- Publication date Aug 22, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Matthew Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE ELEMENT AND ELECTRONIC DEVICE
- Publication number 20240282866
- Publication date Aug 22, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Kento KAWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...
- Publication number 20240274583
- Publication date Aug 15, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-ON-DIE PACKAGE ARCHITECTURE
- Publication number 20240258212
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rajen MURUGAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
- Publication number 20240258302
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Hui SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20240243012
- Publication date Jul 18, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR COMPONENT AND SEMICONDUCTOR PACKAGE INCLUDING CAPACITOR C...
- Publication number 20240222263
- Publication date Jul 4, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICES (IPD) HAVING A BASEBAND DAMPING RESISTOR...
- Publication number 20240213184
- Publication date Jun 27, 2024
- Wolfspeed, Inc.
- Haedong JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY DEVICE PACKAGES
- Publication number 20240213188
- Publication date Jun 27, 2024
- Analog Devices, Inc.
- Santosh Anil Kudtarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD
- Publication number 20240178178
- Publication date May 30, 2024
- STMicroelectronics International N.V.
- Francesca DE VITI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER
- Publication number 20240153937
- Publication date May 9, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240145322
- Publication date May 2, 2024
- Medtronic, Inc.
- Chunho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
- Publication number 20240128186
- Publication date Apr 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrical devices and methods of manufacture

Method of manufacturing an electronic device

Package and method of fabricating the same

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method to minimize stress on stack via

Deep partition power delivery with deep trench capacitor

Multi-die fine grain integrated voltage regulation

RF device without silicon handle substrate for enhanced thermal and...

Structure and method of forming a joint assembly

Semiconductor device

Multiple plated via arrays of different wire heights on a same subs...

Structure and method for fabricating a computing system with an int...

Semiconductor device and manufacturing method thereof

Integrated passive device (IPD) components and a package and proces...

RF device without silicon handle substrate for enhanced thermal and...

Bonded structures with integrated passive component

Method of forming integrated circuit package

Stacked semiconductor die assemblies with support members and assoc...

Stacked semiconductor die assemblies with die support members and a...

Package structure

Wire bond wires for interference shielding

IPD modules with flexible connection scheme in packaging

Deep partition power delivery with deep trench capacitor

Thin film transistor and display substrate having the same

Capacitor integrated structure

Electronic module and method of manufacturing electronic module

Enhanced dummy die for MCP

RF device without silicon handle substrate for enhanced thermal and...

Wafer level package utilizing molded interposer

Integrated circuit assembly with hybrid bonding

Patents Applicationslast 30 patents

EMBEDDED INTEGRATED STACK CAPACITOR (ISC) IN SUBSTRATE BUILD-UP LAYER

Multi-Die Fine Grain Integrated Voltage Regulation

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING SAME

INTEGRATED CIRCUIT WITH SUPERIMPOSED CHIPS AND CAPACITIVE CONNECTION

METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING DEEP TRE...

Decoupling Capacitor Structures And Assemblies

MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

IPD MODULES WITH FLEXIBLE CONNECTION SCHEME IN PACKAGING

SYSTEM-IN PACKAGE COMPONENT, ELECTRONIC DEVICE, AND SYSTEM-IN PACKA...

SEMICONDUCTOR STRUCTURE

INTEGRATED BIDIRECTIONAL FOUR QUADRANT SWITCHES WITH DRIVERS AND IN...

DEEP PARTITION POWER DELIVERY WITH DEEP TRENCH CAPACITOR

Chip Die Substrate with Edge-Mounted Capacitors

SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING A SEMICONDUCT...

INTEGRATED RADIO FREQUENCY POWERED LIGHT EMITTING DIODE CHIPS AND F...

Structure and Method of Forming a Joint Assembly

INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING A CAPACITOR FORMED IN A C...

PASSIVE ELEMENT AND ELECTRONIC DEVICE

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...

SUBSTRATE-ON-DIE PACKAGE ARCHITECTURE

SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION

Structure and Method for Fabricating a Computing System with an Int...

CAPACITOR COMPONENT AND SEMICONDUCTOR PACKAGE INCLUDING CAPACITOR C...

INTEGRATED PASSIVE DEVICES (IPD) HAVING A BASEBAND DAMPING RESISTOR...

HIGH FREQUENCY DEVICE PACKAGES

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD

INTERPOSER

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT