Capacitors only

Industry

CPC
H01L27/0805

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/0805Capacitors only

Industries

Patents Grantslast 30 patents

Information Patent Grant
On-chip electrostatic discharge sensor
- Patent number 12,148,748
- Issue date Nov 19, 2024
- The Regents of the University of California
- Subramanian Iyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor capacitor array layout capable of generating parasiti...
- Patent number 12,132,045
- Issue date Oct 29, 2024
- Realtek Semiconductor Corporation
- Shih-Hsiung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitors with thick intermediate electrode...
- Patent number 12,100,730
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor (MIMCAP) and methods of forming the...
- Patent number 12,094,763
- Issue date Sep 17, 2024
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Kwang Sing Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having capacitor and manufacturing method thereof
- Patent number 12,087,809
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of fabricating the same
- Patent number 12,080,710
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Kyooho Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with capacitors
- Patent number 12,074,162
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guo-Jyun Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with stacked capacitors
- Patent number 12,068,361
- Issue date Aug 20, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- BingYu Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with capacitors
- Patent number 12,062,686
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guo-Jyun Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low inductance component
- Patent number 12,051,548
- Issue date Jul 30, 2024
- KYOCERA AVX Components Corporation
- Michael W. Kirk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric capacitors and methods of fabrication
- Patent number 12,048,165
- Issue date Jul 23, 2024
- Intel Corporation
- Nazila Haratipour
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure
- Patent number 12,040,352
- Issue date Jul 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Lin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package including the same
- Patent number 12,040,278
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Kiwon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric and paraelectric stack capacitors
- Patent number 11,990,470
- Issue date May 21, 2024
- International Business Machines Corporation
- Takashi Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with capacitors having different dielectric la...
- Patent number 11,984,446
- Issue date May 14, 2024
- SK Hynix Inc.
- Kyu Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device comprising a 3D capacitor and a region surrounded...
- Patent number 11,978,763
- Issue date May 7, 2024
- Murata Manufacturing Co., Ltd.
- Stéphane Bouvier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit comprising a three-dimensional capacitor
- Patent number 11,955,480
- Issue date Apr 9, 2024
- STMicroelectronics (Tours) SAS
- Mohamed Boufnichel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,942,431
- Issue date Mar 26, 2024
- Kioxia Corporation
- Nobuyuki Momo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated filler capacitor cell device and corresponding manufactu...
- Patent number 11,935,828
- Issue date Mar 19, 2024
- STMicroelectronics (Rousset) SAS
- Abderrezak Marzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitors based on dummy through-silicon-vias
- Patent number 11,923,150
- Issue date Mar 5, 2024
- Intel Corporation
- Changyok Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor array structure and method for forming the same
- Patent number 11,925,012
- Issue date Mar 5, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chaojun Sheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor assembly for high capacitance density
- Patent number 11,894,366
- Issue date Feb 6, 2024
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates for semiconductor packages, including hybrid substrates...
- Patent number 11,894,289
- Issue date Feb 6, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor having electrodes with increasing t...
- Patent number 11,894,297
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- I-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable lateral flux capacitor design
- Patent number 11,881,462
- Issue date Jan 23, 2024
- Texas Instruments Incorporated
- Honglin Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit development using adaptive tile design approach...
- Patent number 11,853,672
- Issue date Dec 26, 2023
- International Business Machines Corporation
- Ryan Michael Kruse
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metal-insulator-metal capacitors and methods of forming the same
- Patent number 11,848,352
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with redistribution substrate having embedded...
- Patent number 11,810,915
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor capacitor array layout capable of generating parasiti...
- Patent number 11,810,916
- Issue date Nov 7, 2023
- Realtek Semiconductor Corporation
- Shih-Hsiung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor and method of forming the same
- Patent number 11,810,945
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tao-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20240387608
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Kyooho Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITORS WITH THICK INTERMEDIATE ELECTRODE...
- Publication number 20240387609
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240379734
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC CAPACITORS AND METHODS OF FABRICATION
- Publication number 20240373644
- Publication date Nov 7, 2024
- Intel Corporation
- Nazila Haratipour
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20240371863
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Kyooho JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CAPACITORS
- Publication number 20240355817
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guo-Jyun Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS INTEGRATION CAPACITOR AND MoM CAPACITOR
- Publication number 20240347532
- Publication date Oct 17, 2024
- National Tsing-Hua University
- Ho-Chun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CAPACITOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240347579
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240332198
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Kiwon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282768
- Publication date Aug 22, 2024
- SK HYNIX INC.
- Kyu Jin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240258308
- Publication date Aug 1, 2024
- SK HYNIX INC.
- Kyu Jin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF
- Publication number 20240243057
- Publication date Jul 18, 2024
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FILLER CAPACITOR CELL DEVICE AND CORRESPONDING MANUFACTU...
- Publication number 20240186236
- Publication date Jun 6, 2024
- STMicroelectronics (Rousset) SAS
- Abderrezak Marzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE HAVING HIGH-VOLTAGE...
- Publication number 20240162282
- Publication date May 16, 2024
- KEY FOUNDRY CO., LTD.
- Jong Yeul JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING CAPACITORS BASED ON DUMMY THROUGH-SILICON-VIAS
- Publication number 20240128023
- Publication date Apr 18, 2024
- Intel Corporation
- Changyok Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passive Device Dies With Measurement Structures
- Publication number 20240128261
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fu-Chiang KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES...
- Publication number 20240128163
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE, SEMICONDUCTOR DEVICE, AND INTEGRATED DEVICE MANU...
- Publication number 20240113103
- Publication date Apr 4, 2024
- Huawei Technologies Co., Ltd
- Gaofei TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICAL SUPPORTING STRUCTURE
- Publication number 20240105715
- Publication date Mar 28, 2024
- NANYA TECHNOLOGY CORPORATION
- WEN-CHIEH WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICAL SUPPORTING STRUCTURE
- Publication number 20240105714
- Publication date Mar 28, 2024
- NANYA TECHNOLOGY CORPORATION
- WEN-CHIEH WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD...
- Publication number 20240063111
- Publication date Feb 22, 2024
- KEY FOUNDRY CO., LTD.
- Jong Yeul JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITORS AND METHODS OF FORMING THE SAME
- Publication number 20240063253
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CAPACITOR
- Publication number 20240063251
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tao-Cheng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION SUBSTRATE HAVING EMBEDDED...
- Publication number 20240021608
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- KYOUNG LIM SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR OF SEMICONDUCTOR DEVICE AND DISTRIBUTED MODEL CIRCUIT FOR...
- Publication number 20240014253
- Publication date Jan 11, 2024
- SK HYNIX INC.
- Ung Ki MIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE WITH EMBEDDED CAPACITORS
- Publication number 20230411385
- Publication date Dec 21, 2023
- Intel Corporation
- Seok Ling Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL (MIM) CAPACITOR ARCHITECTURES
- Publication number 20230411278
- Publication date Dec 21, 2023
- Intel Corporation
- Chia-Ching LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING FINFET CAPACITORS
- Publication number 20230387331
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hui Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20230378049
- Publication date Nov 23, 2023
- Changxin Memory Technologies, Inc.
- Xusheng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Warpage High Density Trench Capacitor
- Publication number 20230361166
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Jyun-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS

Capacitors only

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

On-chip electrostatic discharge sensor

Semiconductor capacitor array layout capable of generating parasiti...

Metal-insulator-metal capacitors with thick intermediate electrode...

Metal-insulator-metal capacitor (MIMCAP) and methods of forming the...

Semiconductor device having capacitor and manufacturing method thereof

Semiconductor devices and methods of fabricating the same

Structure and formation method of semiconductor device with capacitors

Semiconductor structure with stacked capacitors

Structure and formation method of semiconductor device with capacitors

Low inductance component

Ferroelectric capacitors and methods of fabrication

Semiconductor structure

Semiconductor device and semiconductor package including the same

Ferroelectric and paraelectric stack capacitors

Semiconductor device with capacitors having different dielectric la...

Electrical device comprising a 3D capacitor and a region surrounded...

Integrated circuit comprising a three-dimensional capacitor

Semiconductor device and manufacturing method thereof

Integrated filler capacitor cell device and corresponding manufactu...

Decoupling capacitors based on dummy through-silicon-vias

Capacitor array structure and method for forming the same

Trench capacitor assembly for high capacitance density

Substrates for semiconductor packages, including hybrid substrates...

Metal-insulator-metal capacitor having electrodes with increasing t...

Reliable lateral flux capacitor design

Integrated circuit development using adaptive tile design approach...

Metal-insulator-metal capacitors and methods of forming the same

Semiconductor package with redistribution substrate having embedded...

Semiconductor capacitor array layout capable of generating parasiti...

Trench capacitor and method of forming the same

Patents Applicationslast 30 patents

CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

METAL-INSULATOR-METAL CAPACITORS WITH THICK INTERMEDIATE ELECTRODE...

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE

FERROELECTRIC CAPACITORS AND METHODS OF FABRICATION

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CAPACITORS

HETEROGENEOUS INTEGRATION CAPACITOR AND MoM CAPACITOR

SEMICONDUCTOR DEVICE HAVING CAPACITOR AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF

INTEGRATED FILLER CAPACITOR CELL DEVICE AND CORRESPONDING MANUFACTU...

MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE HAVING HIGH-VOLTAGE...

DECOUPLING CAPACITORS BASED ON DUMMY THROUGH-SILICON-VIAS

Passive Device Dies With Measurement Structures

SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES...

INTEGRATED DEVICE, SEMICONDUCTOR DEVICE, AND INTEGRATED DEVICE MANU...

SEMICONDUCTOR DEVICE INCLUDING VERTICAL SUPPORTING STRUCTURE

SEMICONDUCTOR DEVICE INCLUDING VERTICAL SUPPORTING STRUCTURE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD...

METAL-INSULATOR-METAL CAPACITORS AND METHODS OF FORMING THE SAME

TRENCH CAPACITOR

SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION SUBSTRATE HAVING EMBEDDED...

CAPACITOR OF SEMICONDUCTOR DEVICE AND DISTRIBUTED MODEL CIRCUIT FOR...

PACKAGE WITH EMBEDDED CAPACITORS

METAL INSULATOR METAL (MIM) CAPACITOR ARCHITECTURES

DECOUPLING FINFET CAPACITORS

SEMICONDUCTOR STRUCTURE

Low Warpage High Density Trench Capacitor