carbon based polymeric organic or inorganic material

Industry

CPC
H01L21/02118

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02118carbon based polymeric organic or inorganic material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Solvent annealing of an organic planarization layer
- Patent number 12,362,168
- Issue date Jul 15, 2025
- International Business Machines Corporation
- Jing Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,363,961
- Issue date Jul 15, 2025
- Infineon Technologies AG
- Carsten Schaeffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for splitting semiconductor wafers
- Patent number 12,356,700
- Issue date Jul 8, 2025
- Infineon Technologies AG
- Christian Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device...
- Patent number 12,347,671
- Issue date Jul 1, 2025
- Tokyo Electron Limited
- Tatsuya Yamaguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Treatment of spin on organic material to improve wet resistance
- Patent number 12,347,727
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tzu-Yang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern-forming method and composition
- Patent number 12,332,563
- Issue date Jun 17, 2025
- JSR Corporation
- Hiroyuki Komatsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Selective passivation and selective deposition
- Patent number 12,322,593
- Issue date Jun 3, 2025
- ASM IP Holding B.V.
- Jan Willem Hub Maes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stimulus responsive polymer films and formulations
- Patent number 12,322,588
- Issue date Jun 3, 2025
- Lam Research Corporation
- Gregory Blachut
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 12,300,507
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of organic films
- Patent number 12,300,505
- Issue date May 13, 2025
- ASM IP Holding B.V.
- Eva E. Tois
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for stabilization of self-assembled monolayers (SAMs) using...
- Patent number 12,290,835
- Issue date May 6, 2025
- Tokyo Electron Limited
- Omid Zandi
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Adhesion layer for multi-layer photoresist
- Patent number 12,292,684
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etch of a substrate
- Patent number 12,261,049
- Issue date Mar 25, 2025
- Applied Materials , Inc.
- David Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP safe alignment mark
- Patent number 12,255,150
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huang-Jen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Long-term implantable electronic devices
- Patent number 12,220,239
- Issue date Feb 11, 2025
- Northwestern University
- John A. Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of organic films
- Patent number 12,205,820
- Issue date Jan 21, 2025
- ASM IP Holding B.V.
- Eva E. Tois
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of direct-bonded optoelectronic devices
- Patent number 12,199,082
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective molecular layer deposition of organic and hybrid organic-...
- Patent number 12,191,139
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- Tapash Chakraborty
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Selective passivation and selective deposition
- Patent number 12,170,197
- Issue date Dec 17, 2024
- ASM IP Holding B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for separating dies from a semiconductor substrate
- Patent number 12,170,226
- Issue date Dec 17, 2024
- Infineon Technologies AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chuck assembly, planarization process, apparatus and method of manu...
- Patent number 12,165,903
- Issue date Dec 10, 2024
- Canon Kabushiki Kaisha
- Seth J. Bamesberger
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Direct-bonded LED arrays drivers
- Patent number 12,166,024
- Issue date Dec 10, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-shot encapsulation
- Patent number 12,166,001
- Issue date Dec 10, 2024
- Semtech Corporation
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor phase deposition of organic films
- Patent number 12,138,654
- Issue date Nov 12, 2024
- ASM IP Holding B.V.
- Viljami J. Pore
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for depositing blocking layers on metal surfaces
- Patent number 12,131,900
- Issue date Oct 29, 2024
- Applied Materials, Inc.
- Bhaskar Jyoti Bhuyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 12,116,670
- Issue date Oct 15, 2024
- Tokyo Electron Limited
- Koichi Matsunaga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sacrificial protection layer for environmentally sensitive surfaces...
- Patent number 12,119,218
- Issue date Oct 15, 2024
- Lam Research Corporation
- Stephen M. Sirard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming topology-controlled amorphous carbon polymer film
- Patent number 12,112,940
- Issue date Oct 8, 2024
- ASM IP Holding B.V.
- Timothee Julien Vincent Blanquart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective blocking of metal surfaces using bifunctional self-assemb...
- Patent number 12,094,766
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Michael L. McSwiney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a nitrogen-containing carbon film and system for...
- Patent number 12,068,154
- Issue date Aug 20, 2024
- ASM IP Holding B.V.
- Hirotsugu Sugiura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PROCESSING COMPOSITION, COMPOUND, METHOD FOR P...
- Publication number 20250230321
- Publication date Jul 17, 2025
- FUJIFILM CORPORATION
- Naoya Shimoju
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ENCAPSULATED FLEXIBLE ELECTRONICS FOR LONG-TERM IMPLANTATION
- Publication number 20250213162
- Publication date Jul 3, 2025
- Northwestern University
- John A. ROGERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CORE SUBSTRATE AND METHOD OF PRODUCING THE METAL CORE SUBSTRATE
- Publication number 20250210425
- Publication date Jun 26, 2025
- Nitto Denko Corporation
- Takahiro IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AREA-SELECTIVE DEPOSITION USING DIAZIRINES OR DIAZO COMPOUNDS AS OV...
- Publication number 20250196131
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Ishwar Singh
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FILM FORMING METHOD AND FILM FORMING APPARATUS
- Publication number 20250183032
- Publication date Jun 5, 2025
- TOKYO ELECTRON LIMITED
- Shuji AZUMO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR REMOVING RESIDUES FROM A SUBSTRATE SURFACE
- Publication number 20250183088
- Publication date Jun 5, 2025
- IMEC vzw
- Efrain Altamirano Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIAL FOR PRODUCING A SEMICONDUCTOR PACKAGING STRUCTURE BASED ON...
- Publication number 20250183027
- Publication date Jun 5, 2025
- UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
- Jimin Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A POWER SEMICONDUCTOR COMPONENT HAVING CONTACT...
- Publication number 20250157931
- Publication date May 15, 2025
- SEMIKRON DANFOSS ELEKTRONIK GMBH & CO. KG
- Bernhard KÖNIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OLIGOMER FILM FOR BOTTOM-UP GAP FILL PROCESSES
- Publication number 20250125195
- Publication date Apr 17, 2025
- Applied Materials, Inc.
- Feng Q. Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250125156
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Hiroshi SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MEMORY STRUCTURES FOR THREE-DIMENSIONAL NONVOLAT...
- Publication number 20250118547
- Publication date Apr 10, 2025
- IMEC vzw
- Sana Rachidi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PATTERNS
- Publication number 20250115691
- Publication date Apr 10, 2025
- Samsung SDI Co., Ltd.
- Seung-Wook SHIN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DEPOSITION OF ORGANIC FILMS
- Publication number 20250118562
- Publication date Apr 10, 2025
- ASM IP HOLDING B.V.
- Eva E. Tois
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
STRETCHABLE INSULATING FILM, METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20250109263
- Publication date Apr 3, 2025
- Samsung Electronics Co., Ltd.
- Joo Young KIM
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
DIRECT-BONDED LED ARRAYS AND DRIVER CIRCUITS
- Publication number 20250105234
- Publication date Mar 27, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF ORGANIC POLYMER MATERIAL AND DEPOSITION ASS...
- Publication number 20250092509
- Publication date Mar 20, 2025
- ASM IP HOLDING B.V.
- Bhagyesh Purohit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION OF ORGANIC MATERIAL
- Publication number 20250079161
- Publication date Mar 6, 2025
- ASM IP HOLDING B.V.
- Adam Vianna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHUCK ASSEMBLY, PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANU...
- Publication number 20250069938
- Publication date Feb 27, 2025
- Canon Kabushiki Kaisha
- SETH J. BAMESBERGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PASSIVATION AND SELECTIVE DEPOSITION
- Publication number 20250069885
- Publication date Feb 27, 2025
- ASM IP HOLDING B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS FROM A WAFER WITH SEL...
- Publication number 20250054746
- Publication date Feb 13, 2025
- ROBERT BOSCH GmbH
- Bernhard Polzinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT-BONDED OPTOELECTRONIC DEVICES
- Publication number 20250038161
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing warpage in a package of stacked integrated circuit dies
- Publication number 20250029948
- Publication date Jan 23, 2025
- Marvell Asia Pte Ltd.
- Runzi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VAPOR PHASE DEPOSITION OF ORGANIC FILMS
- Publication number 20250025911
- Publication date Jan 23, 2025
- ASM IP HOLDING B.V.
- Viljami J. Pore
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR REMOVING UPPER PART OF SACRIFICIAL LAYER, AND SACRIFICIA...
- Publication number 20250014899
- Publication date Jan 9, 2025
- Merck Patent GmbH
- Takashi SEKITO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SELECTIVE DEPOSITION PROCESSES ON SEMICONDUCTOR SUBSTRATES
- Publication number 20250006485
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Mark Saly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SACRIFICIAL PROTECTION LAYER FOR ENVIRONMENTALLY SENSITIVE SURFACES...
- Publication number 20240429040
- Publication date Dec 26, 2024
- LAM RESEARCH CORPORATION
- Stephen M. Sirard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PROCESSED SUBSTRATE
- Publication number 20240429061
- Publication date Dec 26, 2024
- MASANOBU HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL ETCHING WITH REDUCED TILT ANGLE
- Publication number 20240429064
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITING FILM
- Publication number 20240429039
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Eun Hyea Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER MOISTURE REPELLING FILMS FOR FRONT END FET APPLICATIONS
- Publication number 20240413098
- Publication date Dec 12, 2024
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS

carbon based polymeric organic or inorganic material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solvent annealing of an organic planarization layer

Semiconductor device

Method for splitting semiconductor wafers

Semiconductor device manufacturing method and semiconductor device...

Treatment of spin on organic material to improve wet resistance

Pattern-forming method and composition

Selective passivation and selective deposition

Stimulus responsive polymer films and formulations

Method of manufacturing a semiconductor device

Deposition of organic films

Methods for stabilization of self-assembled monolayers (SAMs) using...

Adhesion layer for multi-layer photoresist

Selective etch of a substrate

CMP safe alignment mark

Long-term implantable electronic devices

Deposition of organic films

Method of direct-bonded optoelectronic devices

Selective molecular layer deposition of organic and hybrid organic-...

Selective passivation and selective deposition

Method for separating dies from a semiconductor substrate

Chuck assembly, planarization process, apparatus and method of manu...

Direct-bonded LED arrays drivers

Single-shot encapsulation

Vapor phase deposition of organic films

Methods for depositing blocking layers on metal surfaces

Substrate processing method and substrate processing apparatus

Sacrificial protection layer for environmentally sensitive surfaces...

Method of forming topology-controlled amorphous carbon polymer film

Selective blocking of metal surfaces using bifunctional self-assemb...

Method of forming a nitrogen-containing carbon film and system for...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PROCESSING COMPOSITION, COMPOUND, METHOD FOR P...

ENCAPSULATED FLEXIBLE ELECTRONICS FOR LONG-TERM IMPLANTATION

METAL CORE SUBSTRATE AND METHOD OF PRODUCING THE METAL CORE SUBSTRATE

AREA-SELECTIVE DEPOSITION USING DIAZIRINES OR DIAZO COMPOUNDS AS OV...

FILM FORMING METHOD AND FILM FORMING APPARATUS

METHOD FOR REMOVING RESIDUES FROM A SUBSTRATE SURFACE

MATERIAL FOR PRODUCING A SEMICONDUCTOR PACKAGING STRUCTURE BASED ON...

METHOD FOR PRODUCING A POWER SEMICONDUCTOR COMPONENT HAVING CONTACT...

OLIGOMER FILM FOR BOTTOM-UP GAP FILL PROCESSES

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHODS OF FORMING MEMORY STRUCTURES FOR THREE-DIMENSIONAL NONVOLAT...

METHOD OF FORMING PATTERNS

DEPOSITION OF ORGANIC FILMS

STRETCHABLE INSULATING FILM, METHOD OF MANUFACTURING THE SAME, AND...

DIRECT-BONDED LED ARRAYS AND DRIVER CIRCUITS

SELECTIVE DEPOSITION OF ORGANIC POLYMER MATERIAL AND DEPOSITION ASS...

DEPOSITION OF ORGANIC MATERIAL

CHUCK ASSEMBLY, PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANU...

SELECTIVE PASSIVATION AND SELECTIVE DEPOSITION

METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS FROM A WAFER WITH SEL...

DIRECT-BONDED OPTOELECTRONIC DEVICES

Reducing warpage in a package of stacked integrated circuit dies

VAPOR PHASE DEPOSITION OF ORGANIC FILMS

METHOD FOR REMOVING UPPER PART OF SACRIFICIAL LAYER, AND SACRIFICIA...

SELECTIVE DEPOSITION PROCESSES ON SEMICONDUCTOR SUBSTRATES

SACRIFICIAL PROTECTION LAYER FOR ENVIRONMENTALLY SENSITIVE SURFACES...

METHOD FOR MANUFACTURING PROCESSED SUBSTRATE

METAL ETCHING WITH REDUCED TILT ANGLE

METHOD OF DEPOSITING FILM

MULTILAYER MOISTURE REPELLING FILMS FOR FRONT END FET APPLICATIONS