carbon based polymeric organic or inorganic material

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CPC
H01L21/02118

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02118carbon based polymeric organic or inorganic material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Long-term implantable electronic devices
- Patent number 12,220,239
- Issue date Feb 11, 2025
- Northwestern University
- John A. Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of organic films
- Patent number 12,205,820
- Issue date Jan 21, 2025
- ASM IP Holding B.V.
- Eva E. Tois
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of direct-bonded optoelectronic devices
- Patent number 12,199,082
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective molecular layer deposition of organic and hybrid organic-...
- Patent number 12,191,139
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- Tapash Chakraborty
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Selective passivation and selective deposition
- Patent number 12,170,197
- Issue date Dec 17, 2024
- ASM IP Holding B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for separating dies from a semiconductor substrate
- Patent number 12,170,226
- Issue date Dec 17, 2024
- Infineon Technologies AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chuck assembly, planarization process, apparatus and method of manu...
- Patent number 12,165,903
- Issue date Dec 10, 2024
- Canon Kabushiki Kaisha
- Seth J. Bamesberger
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Direct-bonded LED arrays drivers
- Patent number 12,166,024
- Issue date Dec 10, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-shot encapsulation
- Patent number 12,166,001
- Issue date Dec 10, 2024
- Semtech Corporation
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor phase deposition of organic films
- Patent number 12,138,654
- Issue date Nov 12, 2024
- ASM IP Holding B.V.
- Viljami J. Pore
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for depositing blocking layers on metal surfaces
- Patent number 12,131,900
- Issue date Oct 29, 2024
- Applied Materials, Inc.
- Bhaskar Jyoti Bhuyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sacrificial protection layer for environmentally sensitive surfaces...
- Patent number 12,119,218
- Issue date Oct 15, 2024
- Lam Research Corporation
- Stephen M. Sirard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 12,116,670
- Issue date Oct 15, 2024
- Tokyo Electron Limited
- Koichi Matsunaga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming topology-controlled amorphous carbon polymer film
- Patent number 12,112,940
- Issue date Oct 8, 2024
- ASM IP Holding B.V.
- Timothee Julien Vincent Blanquart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective blocking of metal surfaces using bifunctional self-assemb...
- Patent number 12,094,766
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Michael L. McSwiney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a nitrogen-containing carbon film and system for...
- Patent number 12,068,154
- Issue date Aug 20, 2024
- ASM IP Holding B.V.
- Hirotsugu Sugiura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing method and substrate processing system
- Patent number 12,051,571
- Issue date Jul 30, 2024
- Tokyo Electron Limited
- Kazuya Ichiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming nanostructures using self-assembled nucleic acid...
- Patent number RE50029
- Issue date Jul 2, 2024
- Micron Technology, Inc.
- Scott E. Sills
Information Patent Grant
Dielectric layer, interconnection structure using the same, and man...
- Patent number 12,014,919
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Chen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective patterning with molecular layer deposition
- Patent number 11,990,369
- Issue date May 21, 2024
- Applied Materials, Inc.
- Bhaskar Jyoti Bhuyan
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Manufacturing method of original plate and semiconductor device
- Patent number 11,978,660
- Issue date May 7, 2024
- Kioxia Corporation
- Hirotaka Tsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Area selective carbon-based film deposition
- Patent number 11,972,940
- Issue date Apr 30, 2024
- Applied Materials, Inc.
- Xinke Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor film composition, method for manufacturing semiconduc...
- Patent number 11,965,109
- Issue date Apr 23, 2024
- Mitsui Chemicals, Inc.
- Yasuhisa Kayaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor ele...
- Patent number 11,942,382
- Issue date Mar 26, 2024
- Mitsubishi Electric Corporation
- Noritsugu Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 11,935,757
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,915,936
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Wei Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning method and manufacturing method of semiconductor device
- Patent number 11,908,701
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christine Y Ouyang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive polyimide compositions
- Patent number 11,899,364
- Issue date Feb 13, 2024
- Fujifilm Electronic Materials U.S.A., Inc.
- Binod B. De
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method making the same
- Patent number 11,894,226
- Issue date Feb 6, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- PingHeng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal capping layer and methods thereof
- Patent number 11,894,266
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS FROM A WAFER WITH SEL...
- Publication number 20250054746
- Publication date Feb 13, 2025
- ROBERT BOSCH GmbH
- Bernhard Polzinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT-BONDED OPTOELECTRONIC DEVICES
- Publication number 20250038161
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VAPOR PHASE DEPOSITION OF ORGANIC FILMS
- Publication number 20250025911
- Publication date Jan 23, 2025
- ASM IP HOLDING B.V.
- Viljami J. Pore
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Reducing warpage in a package of stacked integrated circuit dies
- Publication number 20250029948
- Publication date Jan 23, 2025
- Marvell Asia Pte Ltd.
- Runzi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING UPPER PART OF SACRIFICIAL LAYER, AND SACRIFICIA...
- Publication number 20250014899
- Publication date Jan 9, 2025
- Merck Patent GmbH
- Takashi SEKITO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SELECTIVE DEPOSITION PROCESSES ON SEMICONDUCTOR SUBSTRATES
- Publication number 20250006485
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Mark Saly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SACRIFICIAL PROTECTION LAYER FOR ENVIRONMENTALLY SENSITIVE SURFACES...
- Publication number 20240429040
- Publication date Dec 26, 2024
- LAM RESEARCH CORPORATION
- Stephen M. Sirard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PROCESSED SUBSTRATE
- Publication number 20240429061
- Publication date Dec 26, 2024
- MASANOBU HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL ETCHING WITH REDUCED TILT ANGLE
- Publication number 20240429064
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITING FILM
- Publication number 20240429039
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Eun Hyea Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER MOISTURE REPELLING FILMS FOR FRONT END FET APPLICATIONS
- Publication number 20240413098
- Publication date Dec 12, 2024
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON FRAGMENT DEFECT REDUCTION IN GRINDING PROCESS
- Publication number 20240387312
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP SAFE ALIGNMENT MARK
- Publication number 20240387398
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huang-Jen HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Processing Using a Two-Dimensional Polymer
- Publication number 20240363333
- Publication date Oct 31, 2024
- TOKYO ELECTRON LIMITED
- Kandabara Tapily
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240363334
- Publication date Oct 31, 2024
- Kokusai Electric Corporation
- Keitaro HAMADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR APPARATUS, POWER CONVERTER AND MANUFACTURING METHOD F...
- Publication number 20240355874
- Publication date Oct 24, 2024
- Mitsubishi Electric Corporation
- Atsufumi INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SEPARATING DIES FROM A SEMICONDUCTOR SUBSTRATE
- Publication number 20240339361
- Publication date Oct 10, 2024
- INFINEON TECHNOLOGIES AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION AND METHODS USING SAME FOR CARBON DOPED SILICON CONTAIN...
- Publication number 20240304438
- Publication date Sep 12, 2024
- VERSUM MATERIALS US, LLC
- Haripin Chandra
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DIELECTRIC LAYER, INTERCONNECTION STRUCTURE USING THE SAME, AND MAN...
- Publication number 20240297038
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Chen HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND VIBRATOR DEVICE
- Publication number 20240258202
- Publication date Aug 1, 2024
- SEIKO EPSON CORPORATION
- Yusuke Matsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AREA SELECTIVE CARBON-BASED FILM DEPOSITION
- Publication number 20240234127
- Publication date Jul 11, 2024
- Applied Materials, Inc.
- Xinke Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PATTERNING BASED ON IN-SITU FORMATION OF BLOCK COPOYLMER THROUGH DE...
- Publication number 20240222119
- Publication date Jul 4, 2024
- Intel Corporation
- Eungnak Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SELECTIVELY FORMING A PASSIVATION LAYER ON A DIELECTRIC...
- Publication number 20240222135
- Publication date Jul 4, 2024
- ASM IP HOLDING B.V.
- Daniele Chiappe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20240186148
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN ORGANIC POLYMER COMPRISING POLYIMIDE
- Publication number 20240177992
- Publication date May 30, 2024
- ASM IP HOLDING B.V.
- Andrea Illiberi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sidewall Inorganic Passivation for Dielectric Etching Via Surface M...
- Publication number 20240162043
- Publication date May 16, 2024
- TOKYO ELECTRON LIMITED
- Du Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BENZYL COMPOUND PASSIVATION FOR SELECTIVE DEPOSITION AND SELECTIVE...
- Publication number 20240145232
- Publication date May 2, 2024
- Applied Materials, Inc.
- Feng Q. Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of Improving Package Creepage Distance
- Publication number 20240105447
- Publication date Mar 28, 2024
- NEXPERIA B.V.
- Hans-Juergen Funke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT-BONDED OPTOELECTRONIC DEVICES
- Publication number 20240063199
- Publication date Feb 22, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PASSIVATION AND SELECTIVE DEPOSITION
- Publication number 20240047197
- Publication date Feb 8, 2024
- ASM IP HOLDING B.V.
- Jan Willem Hub Maes
- H01 - BASIC ELECTRIC ELEMENTS

carbon based polymeric organic or inorganic material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Long-term implantable electronic devices

Deposition of organic films

Method of direct-bonded optoelectronic devices

Selective molecular layer deposition of organic and hybrid organic-...

Selective passivation and selective deposition

Method for separating dies from a semiconductor substrate

Chuck assembly, planarization process, apparatus and method of manu...

Direct-bonded LED arrays drivers

Single-shot encapsulation

Vapor phase deposition of organic films

Methods for depositing blocking layers on metal surfaces

Sacrificial protection layer for environmentally sensitive surfaces...

Substrate processing method and substrate processing apparatus

Method of forming topology-controlled amorphous carbon polymer film

Selective blocking of metal surfaces using bifunctional self-assemb...

Method of forming a nitrogen-containing carbon film and system for...

Substrate processing method and substrate processing system

Methods of forming nanostructures using self-assembled nucleic acid...

Dielectric layer, interconnection structure using the same, and man...

Selective patterning with molecular layer deposition

Manufacturing method of original plate and semiconductor device

Area selective carbon-based film deposition

Semiconductor film composition, method for manufacturing semiconduc...

Semiconductor device and method for manufacturing semiconductor ele...

Method of manufacturing a semiconductor device

Semiconductor structure and manufacturing method thereof

Patterning method and manufacturing method of semiconductor device

Photosensitive polyimide compositions

Semiconductor device and method making the same

Metal capping layer and methods thereof

Patents Applicationslast 30 patents

METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS FROM A WAFER WITH SEL...

DIRECT-BONDED OPTOELECTRONIC DEVICES

VAPOR PHASE DEPOSITION OF ORGANIC FILMS

Reducing warpage in a package of stacked integrated circuit dies

METHOD FOR REMOVING UPPER PART OF SACRIFICIAL LAYER, AND SACRIFICIA...

SELECTIVE DEPOSITION PROCESSES ON SEMICONDUCTOR SUBSTRATES

SACRIFICIAL PROTECTION LAYER FOR ENVIRONMENTALLY SENSITIVE SURFACES...

METHOD FOR MANUFACTURING PROCESSED SUBSTRATE

METAL ETCHING WITH REDUCED TILT ANGLE

METHOD OF DEPOSITING FILM

MULTILAYER MOISTURE REPELLING FILMS FOR FRONT END FET APPLICATIONS

SILICON FRAGMENT DEFECT REDUCTION IN GRINDING PROCESS

CMP SAFE ALIGNMENT MARK

Semiconductor Processing Using a Two-Dimensional Polymer

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

SEMICONDUCTOR APPARATUS, POWER CONVERTER AND MANUFACTURING METHOD F...

METHOD FOR SEPARATING DIES FROM A SEMICONDUCTOR SUBSTRATE

COMPOSITION AND METHODS USING SAME FOR CARBON DOPED SILICON CONTAIN...

DIELECTRIC LAYER, INTERCONNECTION STRUCTURE USING THE SAME, AND MAN...

SEMICONDUCTOR DEVICE AND VIBRATOR DEVICE

AREA SELECTIVE CARBON-BASED FILM DEPOSITION

PATTERNING BASED ON IN-SITU FORMATION OF BLOCK COPOYLMER THROUGH DE...

METHODS FOR SELECTIVELY FORMING A PASSIVATION LAYER ON A DIELECTRIC...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

METHOD OF FORMING AN ORGANIC POLYMER COMPRISING POLYIMIDE

Sidewall Inorganic Passivation for Dielectric Etching Via Surface M...

BENZYL COMPOUND PASSIVATION FOR SELECTIVE DEPOSITION AND SELECTIVE...

Method of Improving Package Creepage Distance

DIRECT-BONDED OPTOELECTRONIC DEVICES

SELECTIVE PASSIVATION AND SELECTIVE DEPOSITION