Ceramics

Industry

CPC
H01L2924/16787

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/16787Ceramics

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Stacked semiconductor die assemblies with partitioned logic and ass...
- Patent number 11,562,986
- Issue date Jan 24, 2023
- Micron Technology, Inc.
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting an electrical component in which a hood is used...
- Patent number 11,424,170
- Issue date Aug 23, 2022
- Siemens Aktiengesellschaft
- Nora Busche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with partitioned logic and ass...
- Patent number 10,978,427
- Issue date Apr 13, 2021
- Micron Technology, Inc.
- Jian Li
- G11 - INFORMATION STORAGE
Information Patent Grant
Microelectronic assemblies with cavities, and methods of fabrication
- Patent number 9,812,406
- Issue date Nov 7, 2017
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 9,693,462
- Issue date Jun 27, 2017
- Mitsubishi Electric Corporation
- Takeshi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a baseplate with a die attach region a...
- Patent number 9,293,407
- Issue date Mar 22, 2016
- Infineon Technologies AG
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale semiconductor die packaging method
- Patent number 8,703,540
- Issue date Apr 22, 2014
- Semtech Corporation
- Andrew J. Bonthron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency circuit package and high-frequency circuit device
- Patent number 8,552,304
- Issue date Oct 8, 2013
- Fujitsu Limited
- Satoshi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale semiconductor die packaging method
- Patent number 8,367,469
- Issue date Feb 5, 2013
- Semtech Corporation
- Andrew J. Bonthron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly with chip-scale packaging
- Patent number 8,093,714
- Issue date Jan 10, 2012
- Semtech Corporation
- Andrew J. Bonthron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiofrequency power semiconductor module with cavity housing, and...
- Patent number 7,417,198
- Issue date Aug 26, 2008
- Infineon Technologies AG
- Bernd Betz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency power device with a plastic molded package and direc...
- Patent number 6,731,002
- Issue date May 4, 2004
- IXYS Corporation
- Kang Rim Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter wave semiconductor device
- Patent number 6,333,552
- Issue date Dec 25, 2001
- Sharp Kabushiki Kaisha
- Noriko Kakimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided chip mount package
- Patent number 6,265,769
- Issue date Jul 24, 2001
- Texas Instruments Incorporated
- Jimmy Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package
- Patent number 5,753,972
- Issue date May 19, 1998
- StratEdge Corporation
- Deborah S. Wein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer substrate structure
- Patent number 5,689,091
- Issue date Nov 18, 1997
- VLSI Technology, Inc.
- Ahmad Hamzehdoost
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphite composites for electronic packaging
- Patent number 5,650,592
- Issue date Jul 22, 1997
- Olin Corporation
- Harvey Cheskis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid for semiconductor package and package having the lid
- Patent number 5,414,300
- Issue date May 9, 1995
- Sumitomo Metal Ceramics Inc.
- Yoji Tozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a ceramic package
- Patent number 5,091,770
- Issue date Feb 25, 1992
- Fujitsu Limited
- Ichiro Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of making a ceramic lid for use in a hermetic seal package
- Patent number 4,833,102
- Issue date May 23, 1989
- National Semiconductor Corporation
- Robert C. Byrne
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having soldered bond between base and cap thereof
- Patent number 4,626,960
- Issue date Dec 2, 1986
- Fujitsu Limited
- Toshio Hamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device encapsulating a multi-chip array
- Patent number 4,578,697
- Issue date Mar 25, 1986
- Fujitsu Limited
- Yoshihiro Takemae
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096179
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Wooyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCED STRUCTURE WITH CAPPING LAYER AND METHODS OF FORMING THE...
- Publication number 20230395450
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jing-Ye Juang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH PARTITIONED LOGIC AND ASS...
- Publication number 20210217734
- Publication date Jul 15, 2021
- Micron Technology, Inc.
- Jian Li
- G11 - INFORMATION STORAGE
Information Patent Application
PCB Based RF-Power Package Window Frame
- Publication number 20130256858
- Publication date Oct 3, 2013
- INFINEON TECHNOLOGIES NORTH AMERICA CORP.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING ELECTRICAL, ELECTRONIC, ELECTROMECHANICAL OR ELECT...
- Publication number 20130207248
- Publication date Aug 15, 2013
- THALES
- Alain Bensoussan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP-SCALE SEMICONDUCTOR DIE PACKAGING METHOD
- Publication number 20130130441
- Publication date May 23, 2013
- SEMTECH CORPORATION
- Andrew J. BONTHRON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE SEMICONDUCTOR DIE PACKAGING METHOD
- Publication number 20120115279
- Publication date May 10, 2012
- SEMTECH CORPORATION
- Andrew J. BONTHRON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY CIRCUIT PACKAGE AND HIGH-FREQUENCY CIRCUIT DEVICE
- Publication number 20120061133
- Publication date Mar 15, 2012
- FUJITSU LIMITED
- Satoshi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLY WITH CHIP-SCALE PACKAGING
- Publication number 20110140260
- Publication date Jun 16, 2011
- Sierra Monolithics, Inc.
- Andrew J. Bonthron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for adhesive bonding in electronic packaging
- Publication number 20060243384
- Publication date Nov 2, 2006
- TEXAS INSTRUMENTS INCORPORATED
- John Charles Ehmke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-frequency power semiconductor module with a hollow housing and...
- Publication number 20060012016
- Publication date Jan 19, 2006
- Bernd Betz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for fabricating a power hybrid module
- Publication number 20040212081
- Publication date Oct 28, 2004
- Patrick J. Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High frequency power device with a plastic molded package and direc...
- Publication number 20020163070
- Publication date Nov 7, 2002
- IXYS CORPORATION
- Kang Rim Choi
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stacked semiconductor die assemblies with partitioned logic and ass...

Method for mounting an electrical component in which a hood is used...

Stacked semiconductor die assemblies with partitioned logic and ass...

Microelectronic assemblies with cavities, and methods of fabrication

Printed circuit board

Semiconductor package having a baseplate with a die attach region a...

Chip-scale semiconductor die packaging method

High-frequency circuit package and high-frequency circuit device

Chip-scale semiconductor die packaging method

Chip assembly with chip-scale packaging

Radiofrequency power semiconductor module with cavity housing, and...

High frequency power device with a plastic molded package and direc...

Millimeter wave semiconductor device

Double-sided chip mount package

Microelectronics package

Multi-layer substrate structure

Graphite composites for electronic packaging

Lid for semiconductor package and package having the lid

Semiconductor device having a ceramic package

Process of making a ceramic lid for use in a hermetic seal package

Semiconductor device having soldered bond between base and cap thereof

Semiconductor device encapsulating a multi-chip array

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

REINFORCED STRUCTURE WITH CAPPING LAYER AND METHODS OF FORMING THE...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH PARTITIONED LOGIC AND ASS...

PCB Based RF-Power Package Window Frame

DEVICE INCLUDING ELECTRICAL, ELECTRONIC, ELECTROMECHANICAL OR ELECT...

CHIP-SCALE SEMICONDUCTOR DIE PACKAGING METHOD

CHIP-SCALE SEMICONDUCTOR DIE PACKAGING METHOD

HIGH-FREQUENCY CIRCUIT PACKAGE AND HIGH-FREQUENCY CIRCUIT DEVICE

CHIP ASSEMBLY WITH CHIP-SCALE PACKAGING

Method for adhesive bonding in electronic packaging

High-frequency power semiconductor module with a hollow housing and...

Process for fabricating a power hybrid module

High frequency power device with a plastic molded package and direc...