Claims
- 1. A semiconductor device, comprising:a package base; a semiconductor die having a backside and a face side; an electrically conductive adhesive attaching the backside to the package base; a package lid sealed to the face side of the semiconductor die with a non-electrical conductive adhesive; and a plurality of leads interconnect with the face of the semiconductor die.
- 2. The package according to claim 1, wherein the electrically conductive adhesive is one of a silver filled epoxy and a silver filled glass adhesive.
- 3. The package according to claim 1, including a heat spreader attached to, but insulated from, the face of the semiconductor die.
- 4. A semiconductor device, comprising:a package base; a semiconductor die having a backside and a face side; an electrically conductive adhesive attaching the backside to the package base; a heat spreader lid sealed to the face side of the semiconductor die with a non-electrical conductive adhesive; and a plurality of leads interconnecting with the face side of the semiconductor die.
- 5. The package according to claim 6, wherein the electrically conductive adhesive is one of a silver filled epoxy and a silver filled glass adhesive.
Parent Case Info
This application claims priority under 35 USC § 119(e)(1) of provisional application No. 60/065,330 filed Nov. 13, 1997.
US Referenced Citations (9)
Provisional Applications (1)
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Number |
Date |
Country |
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60/065330 |
Nov 1997 |
US |