Ceramics

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CPC
H01L2224/05687

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05687Ceramics

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, semiconductor package and method of manufactu...
- Patent number 12,199,056
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Jumyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,170,259
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Ju Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming semiconductor struct...
- Patent number 12,100,677
- Issue date Sep 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package
- Patent number 12,040,288
- Issue date Jul 16, 2024
- Infineon Technologies AG
- Harry Walter Sax
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having pixels with the same active layer and method...
- Patent number 11,942,025
- Issue date Mar 26, 2024
- Samsung Display Co., Ltd.
- Jin Wan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package
- Patent number 11,735,534
- Issue date Aug 22, 2023
- Infineon Technologies AG
- Harry Walter Sax
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an aluminum oxide layer, metal surface with alumi...
- Patent number 11,424,201
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic interference shield created on package using high t...
- Patent number 11,380,624
- Issue date Jul 5, 2022
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,233,023
- Issue date Jan 25, 2022
- Kabushiki Kaisha Toshiba
- Hiroaki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball protection in packages
- Patent number 10,985,117
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and method for preparing the same
- Patent number 10,923,455
- Issue date Feb 16, 2021
- Nanya Technology Corporation
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment, before the bonding of a mixed Cu-oxide surface, by a pla...
- Patent number 10,910,782
- Issue date Feb 2, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Laurent Vandroux
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Collars for under-bump metal structures and associated systems and...
- Patent number 10,886,244
- Issue date Jan 5, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing a semiconductor apparatus
- Patent number 10,825,794
- Issue date Nov 3, 2020
- Nanya Technology Corporation
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a silver sintering agent having silver oxide s...
- Patent number 10,785,877
- Issue date Sep 22, 2020
- Heraeus Deutschland GmbH & Co. KG
- Michael Schäfer
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Die encapsulation in oxide bonded wafer stack
- Patent number 10,784,234
- Issue date Sep 22, 2020
- Raytheon Company
- John J. Drab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor devices including a redistr...
- Patent number 10,777,523
- Issue date Sep 15, 2020
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate, production method thereof, and display apparatus
- Patent number 10,756,034
- Issue date Aug 25, 2020
- BOE Technology Group Co., Ltd.
- Weiyun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making fully molded peripheral package on package device
- Patent number 10,672,624
- Issue date Jun 2, 2020
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a buffer layer structure for reducin...
- Patent number 10,658,325
- Issue date May 19, 2020
- Seiko Epson Corporation
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Final passivation for wafer level warpage and ULK stress reduction
- Patent number 10,622,319
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Ekta Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including built-in crack-arresting film structure
- Patent number 10,615,139
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond structures and the methods of forming the same
- Patent number 10,510,699
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball protection in packages
- Patent number 10,510,689
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach methods and semiconductor devices manufactured based on...
- Patent number 10,396,015
- Issue date Aug 27, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced through substrate via metallization in three dimensional s...
- Patent number 10,396,013
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced through substrate via metallization in three dimensional s...
- Patent number 10,396,012
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of packaging
- Patent number 10,373,870
- Issue date Aug 6, 2019
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Methods of Manufacture
- Publication number 20250022763
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional Stack Package Structure And Method Making The Same
- Publication number 20250006702
- Publication date Jan 2, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Hongkai JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240413125
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Seho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL
- Publication number 20240387419
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Pawel Mrozek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20240371796
- Publication date Nov 7, 2024
- INFINEON TECHNOLOGIES AG
- Harry Walter SAX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH HYBRID BONDING LAYERS AND PROCESS OF MAK...
- Publication number 20240363564
- Publication date Oct 31, 2024
- TOKYO ELECTRON LIMITED
- Soo Doo CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240304579
- Publication date Sep 12, 2024
- Macronix International Co., Ltd.
- Dai-Ying LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240282713
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240265854
- Publication date Aug 8, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jin Wan KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240222331
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- JIN-WOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR THERMAL MANAGEMENT IN HYBRID BONDING
- Publication number 20240153894
- Publication date May 9, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
- Publication number 20240105644
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Hao YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE FOR QUASI-MONOLITHIC CHIP WITH BACKSIDE POWER
- Publication number 20240063120
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE OF LARGE DIES USING QUASI-MONOLITHIC CHIP LAYERS
- Publication number 20240063132
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20240063152
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Jyun Yang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20240055379
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- HASEOB SEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240055401
- Publication date Feb 15, 2024
- United Microelectronics Corp.
- Kun-Ju LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240047395
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Sheng-Fu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR DEVICE
- Publication number 20240047396
- Publication date Feb 8, 2024
- Micron Technology, Inc.
- Thiagarajan Raman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
- Publication number 20240047389
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Hyeonmin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER
- Publication number 20240047297
- Publication date Feb 8, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20230395532
- Publication date Dec 7, 2023
- INFINEON TECHNOLOGIES AG
- Harry Walter SAX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230378110
- Publication date Nov 23, 2023
- Samsung Electronics Co., Ltd.
- MINKI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACKING STRUCTURE AND PREPARATION METHOD THEREOF, CHIP STACKI...
- Publication number 20230369292
- Publication date Nov 16, 2023
- Huawei Technologies Co., Ltd
- Shan GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ATOMIC DIFFUSION HYBRID BONDING AND APPARATUS MADE FROM SAME
- Publication number 20230299040
- Publication date Sep 21, 2023
- Intel Corporation
- Jay Prakash Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20230178511
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Young Chul SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230163087
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Minki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCT...
- Publication number 20230145031
- Publication date May 11, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230141447
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Wonil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIERS AND METHOD OF FORMING SAME
- Publication number 20230132632
- Publication date May 4, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device, semiconductor package and method of manufactu...

Semiconductor package and method of fabricating the same

Semiconductor structure and method for forming semiconductor struct...

Chip package and method of forming a chip package

Display device having pixels with the same active layer and method...

Chip package and method of forming a chip package

Chip assembly

Method of forming an aluminum oxide layer, metal surface with alumi...

Electromagnetic interference shield created on package using high t...

Semiconductor device and method of manufacturing semiconductor device

Solder ball protection in packages

Semiconductor apparatus and method for preparing the same

Treatment, before the bonding of a mixed Cu-oxide surface, by a pla...

Collars for under-bump metal structures and associated systems and...

Method for preparing a semiconductor apparatus

Method for producing a silver sintering agent having silver oxide s...

Die encapsulation in oxide bonded wafer stack

Semiconductor devices and semiconductor devices including a redistr...

Display substrate, production method thereof, and display apparatus

Method of making fully molded peripheral package on package device

Semiconductor device including a buffer layer structure for reducin...

Chip assembly

Final passivation for wafer level warpage and ULK stress reduction

Semiconductor device including built-in crack-arresting film structure

Bond structures and the methods of forming the same

Solder ball protection in packages

Die attach methods and semiconductor devices manufactured based on...

Advanced through substrate via metallization in three dimensional s...

Advanced through substrate via metallization in three dimensional s...

Semiconductor device and method of packaging

Patents Applicationslast 30 patents

Semiconductor Device and Methods of Manufacture

Three-dimensional Stack Package Structure And Method Making The Same

SEMICONDUCTOR PACKAGE

DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

SEMICONDUCTOR DEVICES WITH HYBRID BONDING LAYERS AND PROCESS OF MAK...

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

STRUCTURE FOR THERMAL MANAGEMENT IN HYBRID BONDING

SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION

PACKAGE ARCHITECTURE FOR QUASI-MONOLITHIC CHIP WITH BACKSIDE POWER

PACKAGE ARCHITECTURE OF LARGE DIES USING QUASI-MONOLITHIC CHIP LAYERS

HYBRID BONDING FOR SEMICONDUCTOR DEVICE ASSEMBLIES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE

BONDED SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE

MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

CHIP STACKING STRUCTURE AND PREPARATION METHOD THEREOF, CHIP STACKI...

METHOD OF ATOMIC DIFFUSION HYBRID BONDING AND APPARATUS MADE FROM SAME

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCT...

SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME

DIFFUSION BARRIERS AND METHOD OF FORMING SAME