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  • H01L2924/01055
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/01055Cesium [Cs]
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Multi-die memory device
    • Patent number 11,990,177
    • Issue date May 21, 2024
    • RAMBUS INC.
    • Scott C. Best
    • G11 - INFORMATION STORAGE
  • Information Patent Grant

    Multi-die memory device
    • Patent number 11,657,868
    • Issue date May 23, 2023
    • RAMBUS INC.
    • Scott C. Best
    • G11 - INFORMATION STORAGE
  • Information Patent Grant

    3D IC method and device
    • Patent number 11,515,202
    • Issue date Nov 29, 2022
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3D IC method and device
    • Patent number 11,289,372
    • Issue date Mar 29, 2022
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multi-die memory device
    • Patent number 11,195,572
    • Issue date Dec 7, 2021
    • RAMBUS INC.
    • Scott C. Best
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic module
    • Patent number 11,071,207
    • Issue date Jul 20, 2021
    • IMBERATEK, LLC
    • Risto Tuominen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3D IC method and device
    • Patent number 11,011,418
    • Issue date May 18, 2021
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multi-die memory device
    • Patent number 10,885,971
    • Issue date Jan 5, 2021
    • RAMBUS INC.
    • Scott C. Best
    • G11 - INFORMATION STORAGE
  • Information Patent Grant

    Electronic module
    • Patent number 10,765,006
    • Issue date Sep 1, 2020
    • IMBERATEK, LLC
    • Risto Tuominen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multi-die memory device
    • Patent number 10,607,691
    • Issue date Mar 31, 2020
    • Rambus Inc.
    • Scott C. Best
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 10,461,053
    • Issue date Oct 29, 2019
    • Renesas Electronics Corporation
    • Shinya Suzuki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for applying a bonding layer
    • Patent number 10,438,925
    • Issue date Oct 8, 2019
    • EV Group E. Thallner GmbH
    • Markus Wimplinger
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Multi-die memory device
    • Patent number 10,157,660
    • Issue date Dec 18, 2018
    • Rambus Inc.
    • Scott C. Best
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3D IC method and device
    • Patent number 10,147,641
    • Issue date Dec 4, 2018
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic module
    • Patent number 10,085,345
    • Issue date Sep 25, 2018
    • GE Embedded Electronics Oy
    • Risto Tuominen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multi-die memory device
    • Patent number 9,818,470
    • Issue date Nov 14, 2017
    • Rambus Inc.
    • Scott C. Best
    • G11 - INFORMATION STORAGE
  • Information Patent Grant

    Using interrupted through-silicon-vias in integrated circuits adapt...
    • Patent number 9,780,073
    • Issue date Oct 3, 2017
    • Conversant Intellectual Property Management Inc.
    • Peter B. Gillingham
    • H03 - BASIC ELECTRONIC CIRCUITRY
  • Information Patent Grant

    Epoxy resin composition for encapsulating semiconductor device and...
    • Patent number 9,735,076
    • Issue date Aug 15, 2017
    • Samsung SDI Co., Ltd.
    • Yoon Man Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3D IC method and device
    • Patent number 9,716,033
    • Issue date Jul 25, 2017
    • ZIPTRONIX, INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 9,659,926
    • Issue date May 23, 2017
    • Renesas Electronics Corporation
    • Shinya Suzuki
    • G02 - OPTICS
  • Information Patent Grant

    Method for applying a bonding layer
    • Patent number 9,627,349
    • Issue date Apr 18, 2017
    • EV Group E. Thallner GmbH
    • Markus Wimplinger
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Alkali silicate glass based coating and method for applying
    • Patent number 9,565,758
    • Issue date Feb 7, 2017
    • Rockwell Collins, Inc.
    • Nathan P. Lower
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Solderable top metal for silicon carbide semiconductor devices
    • Patent number 9,496,421
    • Issue date Nov 15, 2016
    • Siliconix Technology C.V.
    • Rossano Carta
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 9,429,800
    • Issue date Aug 30, 2016
    • Semiconductor Energy Laboratory Co., Ltd.
    • Shunpei Yamazaki
    • G02 - OPTICS
  • Information Patent Grant

    Semiconductor device
    • Patent number 9,391,066
    • Issue date Jul 12, 2016
    • Renesas Electronics Corporation
    • Shinya Suzuki
    • G02 - OPTICS
  • Information Patent Grant

    Multi-die memory device
    • Patent number 9,324,411
    • Issue date Apr 26, 2016
    • Rambus Inc.
    • Scott C. Best
    • G11 - INFORMATION STORAGE
  • Information Patent Grant

    Semiconductor device
    • Patent number 9,324,653
    • Issue date Apr 26, 2016
    • Kabushiki Kaisha Toshiba
    • Shigehiro Asano
    • G11 - INFORMATION STORAGE
  • Information Patent Grant

    Semiconductor device
    • Patent number 9,312,209
    • Issue date Apr 12, 2016
    • PS4 Luxco S.A.R.L.
    • Kayoko Shibata
    • G11 - INFORMATION STORAGE
  • Information Patent Grant

    Methods and materials useful for chip stacking, chip and wafer bonding
    • Patent number 9,263,416
    • Issue date Feb 16, 2016
    • Sumitomo Bakelite Co., Ltd.
    • Christopher Apanius
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3D semiconductor device
    • Patent number 9,245,827
    • Issue date Jan 26, 2016
    • Samsung Electronics Co., Ltd.
    • Uk-song Kang
    • G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

  • Information Patent Application

    MULTI-DIE MEMORY DEVICE
    • Publication number 20240404580
    • Publication date Dec 5, 2024
    • Rambus Inc.
    • Scott C. Best
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
    • Publication number 20240145420
    • Publication date May 2, 2024
    • Intel Corporation
    • Bok Eng CHEAH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-DIE MEMORY DEVICE
    • Publication number 20230360694
    • Publication date Nov 9, 2023
    • Rambus Inc.
    • Scott C. Best
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    MULTI-DIE MEMORY DEVICE
    • Publication number 20220139446
    • Publication date May 5, 2022
    • Rambus Inc.
    • Scott C. Best
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    ELECTRONIC MODULE
    • Publication number 20210321520
    • Publication date Oct 14, 2021
    • IMBERATEK, LLC
    • Risto Tuominen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    3D IC METHOD AND DEVICE
    • Publication number 20210313225
    • Publication date Oct 7, 2021
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    3D IC METHOD AND DEVICE
    • Publication number 20210280461
    • Publication date Sep 9, 2021
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-DIE MEMORY DEVICE
    • Publication number 20210193215
    • Publication date Jun 24, 2021
    • Rambus Inc.
    • Scott C. Best
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    MULTI-DIE MEMORY DEVICE
    • Publication number 20200321047
    • Publication date Oct 8, 2020
    • RAMBUS INC.
    • Scott C. Best
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    MULTI-DIE MEMORY DEVICE
    • Publication number 20190221249
    • Publication date Jul 18, 2019
    • RAMBUS INC.
    • Scott C. Best
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    3D IC METHOD AND DEVICE
    • Publication number 20190148222
    • Publication date May 16, 2019
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20190027455
    • Publication date Jan 24, 2019
    • RENESAS ELECTRONICS CORPORATION
    • SHINYA SUZUKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Electronic module
    • Publication number 20180376597
    • Publication date Dec 27, 2018
    • GE EMBEDDED ELECTRONICS OY
    • Risto Tuominen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-DIE MEMORY DEVICE
    • Publication number 20180166121
    • Publication date Jun 14, 2018
    • RAMBUS INC.
    • Scott C. Best
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    3D IC METHOD AND DEVICE
    • Publication number 20170316971
    • Publication date Nov 2, 2017
    • ZIPTRONIX, INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...
    • Publication number 20160351461
    • Publication date Dec 1, 2016
    • Samsung SDI Co., Ltd.
    • Yoon Man LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR APPLYING A BONDING LAYER
    • Publication number 20160190092
    • Publication date Jun 30, 2016
    • EV GROUP E. THALLNER GMBH
    • Markus WIMPLINGER
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    METHODS AND MATERIALS USEFUL FOR CHIP STACKING, CHIP AND WAFER BONDING
    • Publication number 20140349446
    • Publication date Nov 27, 2014
    • PROMERUS, LLC
    • CHRISTOPHER APANIUS
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20140321223
    • Publication date Oct 30, 2014
    • Yoshiro RIHO
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20140320203
    • Publication date Oct 30, 2014
    • Kayoko Shibata
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    DISTRIBUTED SEMICONDUCTOR DEVICE METHODS, APPARATUS, AND SYSTEMS
    • Publication number 20140247638
    • Publication date Sep 4, 2014
    • Micron Technology, Inc.
    • Paul A. Farrar
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    MULTI-DIE MEMORY DEVICE
    • Publication number 20140247637
    • Publication date Sep 4, 2014
    • RAMBUS INC.
    • Scott C. Best
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    3D SEMICONDUCTOR DEVICE
    • Publication number 20140233292
    • Publication date Aug 21, 2014
    • Samsung Electronics Co., Ltd.
    • Uk-song Kang
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    USING INTERRUPTED THROUGH-SILICON-VIAS IN INTEGRATED CIRCUITS ADAPT...
    • Publication number 20140227829
    • Publication date Aug 14, 2014
    • Conversant Intellectual Property Management Inc.
    • Peter GILLINGHAM
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    PRINTED WIRING BOARD HAVING METAL LAYERS PRODUCING EUTECTIC REACTION
    • Publication number 20140202739
    • Publication date Jul 24, 2014
    • Fujitsu Limited
    • Taiji Sakai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    3D IC METHOD AND DEVICE
    • Publication number 20140187040
    • Publication date Jul 3, 2014
    • Ziptronix, Inc.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20140151703
    • Publication date Jun 5, 2014
    • Takahiro Koyama
    • G01 - MEASURING TESTING
  • Information Patent Application

    ALKALI SILICATE GLASS BASED COATING AND METHOD FOR APPLYING
    • Publication number 20140102776
    • Publication date Apr 17, 2014
    • Rockwell Collins, Inc.
    • Nathan P. Lower
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20140082345
    • Publication date Mar 20, 2014
    • KABUSHIKI KAISHA TOSHIBA
    • Shigehiro Asano
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND INFORMATION PROCESSING SYSTEM INCLUDING TH...
    • Publication number 20140073127
    • Publication date Mar 13, 2014
    • Elpida Memory, Inc.
    • Satoshi Itaya
    • H01 - BASIC ELECTRIC ELEMENTS