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H01L2224/75101

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/75101Chamber

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 12,142,603
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,776,932
- Issue date Oct 3, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 11,735,575
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 11,651,983
- Issue date May 16, 2023
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,626,383
- Issue date Apr 11, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Methods of bonding of semiconductor elements to substrates, and rel...
- Patent number 11,515,286
- Issue date Nov 29, 2022
- Kulicke and Soffa Industries, Inc.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for processing semiconductor devices
- Patent number 11,355,471
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing a semiconductor device
- Patent number 11,227,779
- Issue date Jan 18, 2022
- ASM Technology Singapore Pte. Ltd.
- Jiapei Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and related techniques for handling aligned substrate pairs
- Patent number 11,183,401
- Issue date Nov 23, 2021
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 11,166,351
- Issue date Nov 2, 2021
- Samsung Electronics Co., Ltd.
- Sin-Yeob Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positioning device
- Patent number 11,075,102
- Issue date Jul 27, 2021
- Suss MicroTec Lithography GmbH
- Sven Hansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 10,825,705
- Issue date Nov 3, 2020
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for mass arrangement of micro-component devices
- Patent number 10,748,792
- Issue date Aug 18, 2020
- MAVEN OPTRONICS CO., LTD.
- Chieh Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-selective sintering laser systems and methods thereof
- Patent number 10,722,947
- Issue date Jul 28, 2020
- Board of Regents, The University of Texas System
- Michael A. Cullinan
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Heating and cooling device
- Patent number 10,583,510
- Issue date Mar 10, 2020
- Fuji Electric Co., Ltd.
- Shoji Yokoyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die bonding apparatus comprising an inert gas environment
- Patent number 10,475,763
- Issue date Nov 12, 2019
- ASM Technology Singapore Pte. Ltd.
- Siu Wing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,354,972
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Systems for adhesive bonding of electronic devices
- Patent number 10,319,890
- Issue date Jun 11, 2019
- COOLEDGE LIGHTING INC.
- Michael A. Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 10,109,612
- Issue date Oct 23, 2018
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,103,122
- Issue date Oct 16, 2018
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device, heat insulating load...
- Patent number 10,020,282
- Issue date Jul 10, 2018
- Nissan Motor Co., Ltd.
- Satoshi Tanimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrostatic discharge protection apparatus and process
- Patent number 9,941,239
- Issue date Apr 10, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chien Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermo-compression bonding system, subsystems, and methods of use
- Patent number 9,911,710
- Issue date Mar 6, 2018
- MRSI Systems, LLC
- Nicholas Samuel Celia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 9,748,198
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 9,673,167
- Issue date Jun 6, 2017
- EV Group E. Thallner GmbH
- Markus Wimplinger
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and device for electrically contacting terminal faces of two...
- Patent number 9,649,711
- Issue date May 16, 2017
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow process and tool
- Patent number 9,373,603
- Issue date Jun 21, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ai-Tee Ang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive adhesive with reduced migration
- Patent number 9,365,749
- Issue date Jun 14, 2016
- Sunray Scientific, LLC
- S. Kumar Khanna
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Focal plane array packaging using isostatic pressure processing
- Patent number 9,142,694
- Issue date Sep 22, 2015
- Raytheon Company
- Kenneth Allen Gerber
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING DEVICE AND BONDING METHOD
- Publication number 20250015039
- Publication date Jan 9, 2025
- TORAY ENGINEERING CO., LTD.
- Tatsuya OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...
- Publication number 20240395767
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR FLUXLESS THERMOCOMPRESSION BONDING
- Publication number 20240339430
- Publication date Oct 10, 2024
- ASMPT SINGAPORE PTE. LTD
- Zetao MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME
- Publication number 20240120310
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B08 - CLEANING
Information Patent Application
INERT GAS CHAMBER
- Publication number 20240047412
- Publication date Feb 8, 2024
- MRSI Systems LLC
- Dennis Carew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20230299067
- Publication date Sep 21, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20220384412
- Publication date Dec 1, 2022
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20220302079
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND REL...
- Publication number 20210265303
- Publication date Aug 26, 2021
- KULICKE AND SOFFA INDUSTRIES, INC.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING
- Publication number 20210104488
- Publication date Apr 8, 2021
- DANFOSS SILICON POWER GMBH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS
- Publication number 20210013079
- Publication date Jan 14, 2021
- SUSS MICROTEC LITHOGRAPHY GMBH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PROCESSING A SEMICONDUCTOR DEVICE
- Publication number 20190080939
- Publication date Mar 14, 2019
- ASM Technology Singapore Pte Ltd
- Jiapei DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20190051628
- Publication date Feb 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20180358325
- Publication date Dec 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
POSITIONING DEVICE
- Publication number 20180138070
- Publication date May 17, 2018
- SUSS MICROTEC LITHOGRAPHY GMBH
- Sven Hansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-SELECTIVE SINTERING LASER SYSTEMS AND METHODS THEREOF
- Publication number 20180065186
- Publication date Mar 8, 2018
- Board of Regents, The University of Texas System
- Michael A. Cullinan
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20170358551
- Publication date Dec 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING
- Publication number 20170229424
- Publication date Aug 10, 2017
- DANFOSS SILICON POWER GMBH
- Ronald Eisele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE PROTECTION APPARATUS AND PROCESS
- Publication number 20170053890
- Publication date Feb 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chien CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS COMPRISING AN INERT GAS ENVIRONMENT
- Publication number 20160351527
- Publication date Dec 1, 2016
- ASM Technology Singapore Pte Ltd
- Siu Wing LAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMO-COMPRESSION BONDING SYSTEM, SUBSYSTEMS, AND METHODS OF USE
- Publication number 20160126213
- Publication date May 5, 2016
- MRSI SYSTEMS LLC
- Nicholas Samuel Celia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reflow Process and Tool
- Publication number 20150249062
- Publication date Sep 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ai-Tee Ang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Anisotropic Conductive Adhesive with Reduced Migration
- Publication number 20140353540
- Publication date Dec 4, 2014
- SUNRAY SCIENTIFIC, LLC
- S. Kumar Khanna
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BONDING STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATME...
- Publication number 20140246481
- Publication date Sep 4, 2014
- Hideyuki ABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20140224862
- Publication date Aug 14, 2014
- Fuji Electric Co., Ltd.
- Takeshi MATSUSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Metal Bump Die Assembly
- Publication number 20140193952
- Publication date Jul 10, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and device for electrically contacting terminal faces of two...
- Publication number 20140027418
- Publication date Jan 30, 2014
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20140011324
- Publication date Jan 9, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...
- Publication number 20130292168
- Publication date Nov 7, 2013
- ROBERT BOSCH GmbH
- Daniel Wolde-Giorgis
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CHIP BONDING APPARATUS
- Publication number 20130248114
- Publication date Sep 26, 2013
- Samsung Electronics Co., Ltd.
- Seung Dae SEOK
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding of bridge to multiple semiconductor chips

Tools and systems for processing semiconductor devices, and methods...

Process and device for low-temperature pressure sintering

Bonding of bridge to multiple semiconductor chips

Apparatus, system, and method for handling aligned wafer pairs

Process and device for low-temperature pressure sintering

Methods of bonding of semiconductor elements to substrates, and rel...

System for processing semiconductor devices

Apparatus and method for processing a semiconductor device

System and related techniques for handling aligned substrate pairs

Solder reflow apparatus and method of manufacturing an electronic d...

Positioning device

Apparatus, system, and method for handling aligned wafer pairs

Method and system for mass arrangement of micro-component devices

Micro-selective sintering laser systems and methods thereof

Heating and cooling device

Die bonding apparatus comprising an inert gas environment

Hybrid bonding systems and methods for semiconductor wafers

Systems for adhesive bonding of electronic devices

Tools and systems for processing semiconductor devices, and methods...

Hybrid bonding systems and methods for semiconductor wafers

Method for manufacturing semiconductor device, heat insulating load...

Electrostatic discharge protection apparatus and process

Thermo-compression bonding system, subsystems, and methods of use

Hybrid bonding systems and methods for semiconductor wafers

Method for bonding substrates

Method and device for electrically contacting terminal faces of two...

Reflow process and tool

Anisotropic conductive adhesive with reduced migration

Focal plane array packaging using isostatic pressure processing

Patents Applicationslast 30 patents

BONDING DEVICE AND BONDING METHOD

TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...

SYSTEM AND METHOD FOR FLUXLESS THERMOCOMPRESSION BONDING

SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME

INERT GAS CHAMBER

BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS

BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS

Tools and Systems for Processing Semiconductor Devices, and Methods...

METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND REL...

PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING

APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS

APPARATUS AND METHOD FOR PROCESSING A SEMICONDUCTOR DEVICE

Hybrid Bonding Systems and Methods for Semiconductor Wafers

Tools and Systems for Processing Semiconductor Devices, and Methods...

POSITIONING DEVICE

MICRO-SELECTIVE SINTERING LASER SYSTEMS AND METHODS THEREOF

Hybrid Bonding Systems and Methods for Semiconductor Wafers

PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING

ELECTROSTATIC DISCHARGE PROTECTION APPARATUS AND PROCESS

DIE BONDING APPARATUS COMPRISING AN INERT GAS ENVIRONMENT

THERMO-COMPRESSION BONDING SYSTEM, SUBSYSTEMS, AND METHODS OF USE

Reflow Process and Tool

Anisotropic Conductive Adhesive with Reduced Migration

BONDING STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATME...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Methods for Metal Bump Die Assembly

Method and device for electrically contacting terminal faces of two...

Hybrid Bonding Systems and Methods for Semiconductor Wafers

STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...

CHIP BONDING APPARATUS