characterised by special arrangements of the devices, allowing an easier separation

Industry

CPC
B81C1/00873

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

Current Industry

B81C1/00873characterised by special arrangements of the devices, allowing an easier separation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Through-substrate conductor support
- Patent number 11,084,717
- Issue date Aug 10, 2021
- Texas Instruments Incorporated
- Virgil Cotoco Ararao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and method of manufacturing a MEMS device
- Patent number 10,829,368
- Issue date Nov 10, 2020
- Infineon Technologies AG
- Alfons Dehe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package
- Patent number 10,745,269
- Issue date Aug 18, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Nick Renaud-Bezot
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Through-substrate conductor support
- Patent number 10,392,246
- Issue date Aug 27, 2019
- Texas Instruments Incorporated
- Virgil Cotoco Ararao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and method of manufacturing a MEMS device
- Patent number 10,384,934
- Issue date Aug 20, 2019
- Infineon Technologies AG
- Alfons Dehe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone modules and wafer-level techniques for fabricating...
- Patent number 10,171,918
- Issue date Jan 1, 2019
- Heptagon Micro Optics Pte. Ltd.
- Jens Geiger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and method of manufacturing a MEMS device
- Patent number 9,938,140
- Issue date Apr 10, 2018
- Infineon Technologies AG
- Alfons Dehe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone modules and wafer-level techniques for fabricating...
- Patent number 9,826,316
- Issue date Nov 21, 2017
- Heptagon Micro Optics Pte. Ltd.
- Jens Geiger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Physical quantity sensor, method for manufacturing physical quantit...
- Patent number 9,695,041
- Issue date Jul 4, 2017
- Seiko Epson Corporation
- Shinichi Kamisuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Open cavity package using chip-embedding technology
- Patent number 9,663,357
- Issue date May 30, 2017
- Texas Instruments Incorporated
- Jie Mao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive sensor
- Patent number 9,599,648
- Issue date Mar 21, 2017
- Omron Corporation
- Takashi Kasai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS micro-mirror assembly
- Patent number 9,405,116
- Issue date Aug 2, 2016
- Intel Corporation
- Faouzi Khechana
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and method of manufacturing a MEMS device
- Patent number 9,402,138
- Issue date Jul 26, 2016
- Infineon Technologies AG
- Alfons Dehe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 9,343,382
- Issue date May 17, 2016
- Fujitsu Limited
- Takeaki Shimanouchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a MEMS micro-mirror assembly
- Patent number 9,323,047
- Issue date Apr 26, 2016
- Intel Corporation
- Faouzi Khechana
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vertical mount package and wafer level packaging therefor
- Patent number 9,278,851
- Issue date Mar 8, 2016
- Analog Devices, Inc.
- Xiaojie Xue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and device for wafer scale packaging of optical devices usin...
- Patent number 9,006,878
- Issue date Apr 14, 2015
- Miradia Inc.
- Xiao “Charles” Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package, chip size package device and method of manufac...
- Patent number 8,975,736
- Issue date Mar 10, 2015
- Omron Corporation
- Toshiaki Okuno
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vertical mount package and wafer level packaging therefor
- Patent number 8,836,132
- Issue date Sep 16, 2014
- Analog Devices, Inc.
- Xiaojie Xue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thin semiconductor device having embedded die support and methods o...
- Patent number 8,791,540
- Issue date Jul 29, 2014
- Continental Automotive Systems, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thin semiconductor device having embedded die support and methods o...
- Patent number 8,791,539
- Issue date Jul 29, 2014
- Continental Automotive Systems, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing optical deflector for forming dicing stree...
- Patent number 8,790,936
- Issue date Jul 29, 2014
- Stanley Electric Co., Ltd.
- Yoshiaki Yasuda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 8,772,136
- Issue date Jul 8, 2014
- United Microelectronics Corporation
- Chine-Li Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for detethering mesoscale, microscale, and nan...
- Patent number 8,739,398
- Issue date Jun 3, 2014
- Board of Regents, The University of Texas System
- Mohammad A. Mayyas
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for production of packaged electronic components, and a pack...
- Patent number 8,324,024
- Issue date Dec 4, 2012
- Schott AG
- Juergen Leib
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thin semiconductor device having embedded die support and methods o...
- Patent number 8,164,153
- Issue date Apr 24, 2012
- Continental Automotive Systems, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fabricating microelectromechanical systems devices
- Patent number 8,070,969
- Issue date Dec 6, 2011
- Silverbrook Research Pty Ltd
- Kia Silverbrook
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 8,030,180
- Issue date Oct 4, 2011
- Oki Semiconductor Co., Ltd.
- Kazumori Yoshino
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor sensor device and method for manufacturing same
- Patent number 8,022,433
- Issue date Sep 20, 2011
- Hitachi Metals, Ltd.
- Takanori Aono
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming semiconductor devices in wafer assembly
- Patent number 8,003,534
- Issue date Aug 23, 2011
- Applied Nanostructures, Inc.
- Ami Chand
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
THROUGH-SUBSTRATE CONDUCTOR SUPPORT
- Publication number 20210323816
- Publication date Oct 21, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Virgil Cotoco Ararao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THROUGH-SUBSTRATE CONDUCTOR SUPPORT
- Publication number 20190382262
- Publication date Dec 19, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Virgil Cotoco Ararao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Device and Method of Manufacturing a MEMS Device
- Publication number 20190330057
- Publication date Oct 31, 2019
- INFINEON TECHNOLOGIES AG
- Alfons Dehe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Package
- Publication number 20180297834
- Publication date Oct 18, 2018
- AT&S Austria Technologies & Systemtechnik Aktiengesellschaft
- Nick Renaud-Bezot
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MICROPHONE MODULES AND WAFER-LEVEL TECHNIQUES FOR FABRICATING...
- Publication number 20180295453
- Publication date Oct 11, 2018
- HEPTAGON MICRO OPTICS PTE. LTD.
- Jens GEIGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Device and Method of Manufacturing a MEMS Device
- Publication number 20180201504
- Publication date Jul 19, 2018
- INFINEON TECHNOLOGIES AG
- Alfons Dehe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THROUGH-SUBSTRATE CONDUCTOR SUPPORT
- Publication number 20180186629
- Publication date Jul 5, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Virgil Cotoco Ararao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPEN CAVITY PACKAGE USING CHIP-EMBEDDING TECHNOLOGY
- Publication number 20170015548
- Publication date Jan 19, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Jie Mao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Packages and Methods of Manufacture Thereof
- Publication number 20160347609
- Publication date Dec 1, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PHYSICAL QUANTITY SENSOR, METHOD FOR MANUFACTURING PHYSICAL QUANTIT...
- Publication number 20160130135
- Publication date May 12, 2016
- SEIKO EPSON CORPORATION
- Shinichi KAMISUKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MICROPHONE MODULES AND WAFER-LEVEL TECHNIQUES FOR FABRICATING...
- Publication number 20160112808
- Publication date Apr 21, 2016
- HEPTAGON MICRO OPTICS PTE. LTD.
- Jens GEIGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICES AND METHOD OF MANUFACTURING
- Publication number 20160052784
- Publication date Feb 25, 2016
- Rosemount Aerospace Inc.
- David P. Potasek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VERTICAL MOUNT PACKAGE AND WAFER LEVEL PACKAGING THEREFOR
- Publication number 20140374854
- Publication date Dec 25, 2014
- Xiaojie Xue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140203424
- Publication date Jul 24, 2014
- Fujitsu Limited
- Takeaki Shimanouchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Device and Method of Manufacturing a MEMS Device
- Publication number 20140103460
- Publication date Apr 17, 2014
- INFINEON TECHNOLOGIES AG
- Alfons Dehe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC PACKAGING
- Publication number 20140007425
- Publication date Jan 9, 2014
- MERRY ELECTRONICS CO., LD
- Ju-Mei LU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PACKAGE, CHIP SIZE PACKAGE DEVICE AND METHOD OF MANUFAC...
- Publication number 20140008779
- Publication date Jan 9, 2014
- Omron Corporation
- Toshiaki Okuno
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20130323908
- Publication date Dec 5, 2013
- UNITED MICROELECTRONICS CORPORATION
- Chine-Li WANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VERTICAL MOUNT PACKAGE AND WAFER LEVEL PACKAGING THEREFOR
- Publication number 20130256896
- Publication date Oct 3, 2013
- Analog Devices, Inc.
- Xiaojie Xue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING OPTICAL DEFLECTOR FOR FORMING DICING STREE...
- Publication number 20130084661
- Publication date Apr 4, 2013
- Stanley Electric Co., Ltd
- Yoshiaki YASUDA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Thin Semiconductor Device Having Embedded Die Support and Methods o...
- Publication number 20120153409
- Publication date Jun 21, 2012
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Thin Semiconductor Device Having Embedded Die Support and Methods o...
- Publication number 20120149153
- Publication date Jun 14, 2012
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FABRICATING MICROELECTROMECHANICAL SYSTEMS DEVICES
- Publication number 20120064647
- Publication date Mar 15, 2012
- SILVERBROOK RESEARCH PTY LTD
- Kia Silverbrook
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of forming semiconductor devices in wafer assembly
- Publication number 20110092046
- Publication date Apr 21, 2011
- Applied NanoStructures, Inc.
- Ami Chand
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND DEVICE FOR WAFER SCALE PACKAGING OF OPTICAL DEVICES USIN...
- Publication number 20110012166
- Publication date Jan 20, 2011
- Miradia Inc.
- Xiao "Charles" Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and Apparatus for Detethering Mesoscale, Microscale, and Nan...
- Publication number 20100306993
- Publication date Dec 9, 2010
- Board of Regents, The University of Texas System
- Mohammad A. Mayyas
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THIN SEMICONDUCTOR DEVICE HAVING EMBEDDED DIE SUPPORT AND METHODS O...
- Publication number 20100301431
- Publication date Dec 2, 2010
- TEMIC AUTOMOTIVE OF NORTH AMERICA, INC.
- XIAOYI DING
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Capped Wafer Method and Apparatus
- Publication number 20100117221
- Publication date May 13, 2010
- Analog Devices, Inc.
- Xue'en Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPONENT AND METHOD FOR ITS MANUFACTURE
- Publication number 20100109105
- Publication date May 6, 2010
- Stefan PINTER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR SUBSTRATE, AND SEMICONDUCTOR DEVICE AND METHOD OF MAN...
- Publication number 20100015781
- Publication date Jan 21, 2010
- Panasonic Corporation
- Takahiro Kumakawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

characterised by special arrangements of the devices, allowing an easier separation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Through-substrate conductor support

MEMS device and method of manufacturing a MEMS device

MEMS package

Through-substrate conductor support

MEMS device and method of manufacturing a MEMS device

MEMS microphone modules and wafer-level techniques for fabricating...

MEMS device and method of manufacturing a MEMS device

MEMS microphone modules and wafer-level techniques for fabricating...

Physical quantity sensor, method for manufacturing physical quantit...

Open cavity package using chip-embedding technology

Capacitive sensor

MEMS micro-mirror assembly

MEMS device and method of manufacturing a MEMS device

Electronic device and manufacturing method thereof

Method of manufacturing a MEMS micro-mirror assembly

Vertical mount package and wafer level packaging therefor

Method and device for wafer scale packaging of optical devices usin...

Wafer level package, chip size package device and method of manufac...

Vertical mount package and wafer level packaging therefor

Thin semiconductor device having embedded die support and methods o...

Thin semiconductor device having embedded die support and methods o...

Method for manufacturing optical deflector for forming dicing stree...

Method for fabricating semiconductor device

Method and apparatus for detethering mesoscale, microscale, and nan...

Method for production of packaged electronic components, and a pack...

Thin semiconductor device having embedded die support and methods o...

Method of fabricating microelectromechanical systems devices

Method of manufacturing a semiconductor device

Semiconductor sensor device and method for manufacturing same

Method of forming semiconductor devices in wafer assembly

Patents Applicationslast 30 patents

THROUGH-SUBSTRATE CONDUCTOR SUPPORT

THROUGH-SUBSTRATE CONDUCTOR SUPPORT

MEMS Device and Method of Manufacturing a MEMS Device

MEMS Package

MEMS MICROPHONE MODULES AND WAFER-LEVEL TECHNIQUES FOR FABRICATING...

MEMS Device and Method of Manufacturing a MEMS Device

THROUGH-SUBSTRATE CONDUCTOR SUPPORT

OPEN CAVITY PACKAGE USING CHIP-EMBEDDING TECHNOLOGY

MEMS Packages and Methods of Manufacture Thereof

PHYSICAL QUANTITY SENSOR, METHOD FOR MANUFACTURING PHYSICAL QUANTIT...

MEMS MICROPHONE MODULES AND WAFER-LEVEL TECHNIQUES FOR FABRICATING...

MEMS DEVICES AND METHOD OF MANUFACTURING

VERTICAL MOUNT PACKAGE AND WAFER LEVEL PACKAGING THEREFOR

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

MEMS Device and Method of Manufacturing a MEMS Device

MANUFACTURING METHOD OF ELECTRONIC PACKAGING

WAFER LEVEL PACKAGE, CHIP SIZE PACKAGE DEVICE AND METHOD OF MANUFAC...

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

VERTICAL MOUNT PACKAGE AND WAFER LEVEL PACKAGING THEREFOR

METHOD FOR MANUFACTURING OPTICAL DEFLECTOR FOR FORMING DICING STREE...

Thin Semiconductor Device Having Embedded Die Support and Methods o...

Thin Semiconductor Device Having Embedded Die Support and Methods o...

METHOD OF FABRICATING MICROELECTROMECHANICAL SYSTEMS DEVICES

Method of forming semiconductor devices in wafer assembly

METHOD AND DEVICE FOR WAFER SCALE PACKAGING OF OPTICAL DEVICES USIN...

Method and Apparatus for Detethering Mesoscale, Microscale, and Nan...

THIN SEMICONDUCTOR DEVICE HAVING EMBEDDED DIE SUPPORT AND METHODS O...

Capped Wafer Method and Apparatus

COMPONENT AND METHOD FOR ITS MANUFACTURE

SEMICONDUCTOR SUBSTRATE, AND SEMICONDUCTOR DEVICE AND METHOD OF MAN...