characterised by the formation and the after-treatment of the conductors

Industry

CPC
H01L21/76838

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76838characterised by the formation and the after-treatment of the conductors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with uneven electrode surface and method for f...
- Patent number 12,176,281
- Issue date Dec 24, 2024
- NANYA TECHNOLOGY CORPORATION
- Tsu-Chieh Ai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,176,267
- Issue date Dec 24, 2024
- NANYA TECHNOLOGY CORPORATION
- Liang-Pin Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing conductive lines in a circuit
- Patent number 12,165,972
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hui Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Vertical metal splitting using helmets and wrap-around dielectric s...
- Patent number 12,131,989
- Issue date Oct 29, 2024
- Intel Corporation
- Leonard P. Guler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device packages, packaging methods, and packaged semi...
- Patent number 12,119,338
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field effect transistor (FinFET) device structure with isolatio...
- Patent number 12,107,166
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Huai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitors with thick intermediate electrode...
- Patent number 12,100,730
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,094,762
- Issue date Sep 17, 2024
- SK hynix Inc.
- Dong Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,094,765
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Chen Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of forming semiconductor devices
- Patent number 12,069,849
- Issue date Aug 20, 2024
- Samsung Electronics Co., Ltd.
- Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for graphene film, porous silica powder and tr...
- Patent number 12,049,692
- Issue date Jul 30, 2024
- BEIHAI HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yuming Xia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device protection using an anti-reflective layer
- Patent number 12,046,509
- Issue date Jul 23, 2024
- Infineon Technologies AG
- Stephan Voss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale package architectures containing a die back side metal a...
- Patent number 12,040,246
- Issue date Jul 16, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and preparation methods thereof
- Patent number 12,027,418
- Issue date Jul 2, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Pingheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive route patterning for electronic substrates
- Patent number 12,027,466
- Issue date Jul 2, 2024
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal (MIM) capacitor module including a cup-shaped...
- Patent number 12,015,052
- Issue date Jun 18, 2024
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,009,223
- Issue date Jun 11, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zhongming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,009,388
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zheng-Long Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 11,996,335
- Issue date May 28, 2024
- Kioxia Corporation
- Masaya Shima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor with top contact
- Patent number 11,973,020
- Issue date Apr 30, 2024
- QUALCOMM Incorporated
- John Jianhong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package including correctin...
- Patent number 11,972,966
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Gyujin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mitigating pattern collapse
- Patent number 11,961,761
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Yuan Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays comprising strings of memory cells and methods used i...
- Patent number 11,956,950
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- John D. Hopkins
- G11 - INFORMATION STORAGE
Information Patent Grant
Interconnect structure for logic circuit
- Patent number 11,955,425
- Issue date Apr 9, 2024
- Taiwan Semiconducotr Manufacturing Co., Ltd.
- Fang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with connecting structure and method for fabri...
- Patent number 11,935,831
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal gate structure and method of fabricating the same
- Patent number 11,929,418
- Issue date Mar 12, 2024
- United Microelectronics Corp.
- Jie-Ning Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays comprising strings of memory cells and methods used i...
- Patent number 11,925,016
- Issue date Mar 5, 2024
- Micron Technology, Inc.
- John D. Hopkins
- G11 - INFORMATION STORAGE
Information Patent Grant
Forming self-aligned multi-metal interconnects
- Patent number 11,923,311
- Issue date Mar 5, 2024
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including support pillar structures, and re...
- Patent number 11,910,598
- Issue date Feb 20, 2024
- Shuangqiang Luo
- G11 - INFORMATION STORAGE
Information Patent Grant
Stress analysis method and semiconductor device manufacturing method
- Patent number 11,901,223
- Issue date Feb 13, 2024
- Kioxia Corporation
- Hiroshi Yoshimura
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240404874
- Publication date Dec 5, 2024
- SK HYNIX INC.
- Dong Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...
- Publication number 20240395792
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITORS WITH THICK INTERMEDIATE ELECTRODE...
- Publication number 20240387609
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE SAME
- Publication number 20240363494
- Publication date Oct 31, 2024
- NANYA TECHNOLOGY CORPORATION
- LIANG-PIN CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...
- Publication number 20240332112
- Publication date Oct 3, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR EMBEDDING FOR FLIP CHIP PACKAGES
- Publication number 20240332433
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING METHOD AND PLATING APPARATUS
- Publication number 20240309511
- Publication date Sep 19, 2024
- TOKYO ELECTRON LIMITED
- Takeshi Nagao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240290824
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng-Long CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATING PATTERN COLLAPSE
- Publication number 20240258163
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Yuan Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240213222
- Publication date Jun 27, 2024
- Advanced Semiconductor Engineering, Inc.
- Shang-Ruei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES AND MEMORY DEVICES INCLUDING SUPPORT PILLARS
- Publication number 20240188288
- Publication date Jun 6, 2024
- Lodestar Licensing Group LLC
- Shuangqiang Luo
- G11 - INFORMATION STORAGE
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20240112952
- Publication date Apr 4, 2024
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240090341
- Publication date Mar 14, 2024
- UNITED MICROELECTRONICS CORP.
- Ching-Wen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240090342
- Publication date Mar 14, 2024
- UNITED MICROELECTRONICS CORP.
- Ching-Wen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITORS AND METHODS OF FORMING THE SAME
- Publication number 20240063253
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240047307
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- LIANG-PIN CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240021470
- Publication date Jan 18, 2024
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tianjian LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MEMORY AND METHODS OF FORMING THE SAME
- Publication number 20230413559
- Publication date Dec 21, 2023
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE CRITICAL DIMENSION POWER RAIL
- Publication number 20230411292
- Publication date Dec 21, 2023
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE HAVING DIFFERENT DIMENSIONS FOR CONNECTED CI...
- Publication number 20230402375
- Publication date Dec 14, 2023
- Samsung Electronics Co., Ltd.
- Eun Sung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Providing High Density Component...
- Publication number 20230402383
- Publication date Dec 14, 2023
- STATS ChipPAC Pte Ltd.
- WoonJae Beak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230394216
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei PENG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Device Packages, Packaging Methods, and Packaged Semi...
- Publication number 20230395588
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230395424
- Publication date Dec 7, 2023
- SK HYNIX INC.
- Dong Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20230386906
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Chen Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SRAM CELL WORD LINE STRUCTURE WITH REDUCED RC EFFECTS
- Publication number 20230380129
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hidehiro FUJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230380295
- Publication date Nov 23, 2023
- UNITED MICROELECTRONICS CORP.
- Ching-Wen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230343678
- Publication date Oct 26, 2023
- NANYA TECHNOLOGY CORPORATION
- LIANG-PIN CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20230317456
- Publication date Oct 5, 2023
- INFINEON TECHNOLOGIES AG
- Moriz Jelinek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE SIGNAL INTERCONNECTION
- Publication number 20230307365
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Xuan Huang
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the formation and the after-treatment of the conductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with uneven electrode surface and method for f...

Semiconductor device and method for manufacturing the same

Method of manufacturing conductive lines in a circuit

Vertical metal splitting using helmets and wrap-around dielectric s...

Semiconductor device packages, packaging methods, and packaged semi...

Fin field effect transistor (FinFET) device structure with isolatio...

Metal-insulator-metal capacitors with thick intermediate electrode...

Method of manufacturing semiconductor device

Integrated circuit package and method

Semiconductor devices and methods of forming semiconductor devices

Manufacturing method for graphene film, porous silica powder and tr...

Semiconductor device protection using an anti-reflective layer

Chip-scale package architectures containing a die back side metal a...

Semiconductor devices and preparation methods thereof

Conductive route patterning for electronic substrates

Metal-insulator-metal (MIM) capacitor module including a cup-shaped...

Semiconductor structure and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Manufacturing method of semiconductor device

Metal-insulator-metal capacitor with top contact

Method of manufacturing a semiconductor package including correctin...

Mitigating pattern collapse

Memory arrays comprising strings of memory cells and methods used i...

Interconnect structure for logic circuit

Semiconductor device with connecting structure and method for fabri...

Metal gate structure and method of fabricating the same

Memory arrays comprising strings of memory cells and methods used i...

Forming self-aligned multi-metal interconnects

Microelectronic devices including support pillar structures, and re...

Stress analysis method and semiconductor device manufacturing method

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...

METAL-INSULATOR-METAL CAPACITORS WITH THICK INTERMEDIATE ELECTRODE...

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE SAME

CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...

CAPACITOR EMBEDDING FOR FLIP CHIP PACKAGES

PLATING METHOD AND PLATING APPARATUS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MITIGATING PATTERN COLLAPSE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

MICROELECTRONIC DEVICES AND MEMORY DEVICES INCLUDING SUPPORT PILLARS

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METAL-INSULATOR-METAL CAPACITORS AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

THREE DIMENSIONAL MEMORY AND METHODS OF FORMING THE SAME

MULTIPLE CRITICAL DIMENSION POWER RAIL

INTERCONNECT STRUCTURE HAVING DIFFERENT DIMENSIONS FOR CONNECTED CI...

Semiconductor Device and Method of Providing High Density Component...

INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor Device Packages, Packaging Methods, and Packaged Semi...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Integrated Circuit Package and Method

SRAM CELL WORD LINE STRUCTURE WITH REDUCED RC EFFECTS

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

BACKSIDE SIGNAL INTERCONNECTION