characterised by the formation and the after-treatment of the conductors

Industry

CPC
H01L21/76838

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76838characterised by the formation and the after-treatment of the conductors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Metal-insulator-metal capacitor with top contact
- Patent number 11,973,020
- Issue date Apr 30, 2024
- QUALCOMM Incorporated
- John Jianhong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package including correctin...
- Patent number 11,972,966
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Gyujin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mitigating pattern collapse
- Patent number 11,961,761
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Yuan Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays comprising strings of memory cells and methods used i...
- Patent number 11,956,950
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- John D. Hopkins
- G11 - INFORMATION STORAGE
Information Patent Grant
Interconnect structure for logic circuit
- Patent number 11,955,425
- Issue date Apr 9, 2024
- Taiwan Semiconducotr Manufacturing Co., Ltd.
- Fang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with connecting structure and method for fabri...
- Patent number 11,935,831
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal gate structure and method of fabricating the same
- Patent number 11,929,418
- Issue date Mar 12, 2024
- United Microelectronics Corp.
- Jie-Ning Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays comprising strings of memory cells and methods used i...
- Patent number 11,925,016
- Issue date Mar 5, 2024
- Micron Technology, Inc.
- John D. Hopkins
- G11 - INFORMATION STORAGE
Information Patent Grant
Forming self-aligned multi-metal interconnects
- Patent number 11,923,311
- Issue date Mar 5, 2024
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including support pillar structures, and re...
- Patent number 11,910,598
- Issue date Feb 20, 2024
- Shuangqiang Luo
- G11 - INFORMATION STORAGE
Information Patent Grant
Stress analysis method and semiconductor device manufacturing method
- Patent number 11,901,223
- Issue date Feb 13, 2024
- Kioxia Corporation
- Hiroshi Yoshimura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,887,967
- Issue date Jan 30, 2024
- Advanced Semiconductor Engineering, Inc.
- Shang-Ruei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with interconnect part and method for preparin...
- Patent number 11,881,451
- Issue date Jan 23, 2024
- NANYA TECHNOLOGY CORPORATION
- Ching-Cheng Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 11,881,432
- Issue date Jan 23, 2024
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal gate structure and method of fabricating the same
- Patent number 11,881,518
- Issue date Jan 23, 2024
- United Microelectronics Corp.
- Jie-Ning Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,864,469
- Issue date Jan 2, 2024
- United Microelectronics Corp.
- Ching-Wen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide nanoparticles as fillable hardmask materials
- Patent number 11,862,463
- Issue date Jan 2, 2024
- Intel Corporation
- Marie Krysak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitors and methods of forming the same
- Patent number 11,848,352
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with uneven electrode surface and method for f...
- Patent number 11,823,992
- Issue date Nov 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Tsu-Chieh Ai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages, packaging methods, and packaged semi...
- Patent number 11,817,445
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures having conductive portions in substrate in three...
- Patent number 11,792,980
- Issue date Oct 17, 2023
- Yangtze Memory Technologies Co., Ltd.
- Ji Xia
- G11 - INFORMATION STORAGE
Information Patent Grant
SRAM cell word line structure with reduced RC effects
- Patent number 11,778,802
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hidehiro Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,769,689
- Issue date Sep 26, 2023
- SK hynix Inc.
- Dong Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of providing high density component...
- Patent number 11,769,730
- Issue date Sep 26, 2023
- STATS ChipPAC Pte. Ltd.
- WoonJae Beak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,765,982
- Issue date Sep 19, 2023
- United Microelectronics Corp.
- Ching-Wen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure same
- Patent number 11,721,610
- Issue date Aug 8, 2023
- NANYA TECHNOLOGY CORPORATION
- Liang-Pin Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection for memory electrodes
- Patent number 11,715,500
- Issue date Aug 1, 2023
- Micron Technology, Inc.
- Hernan A. Castro
- G11 - INFORMATION STORAGE
Information Patent Grant
Three dimensional memory and methods of forming the same
- Patent number 11,700,730
- Issue date Jul 11, 2023
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,695,080
- Issue date Jul 4, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages without debris
- Patent number 11,670,549
- Issue date Jun 6, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Dzafir Bin Mohd Shariff
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20240112952
- Publication date Apr 4, 2024
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240090341
- Publication date Mar 14, 2024
- UNITED MICROELECTRONICS CORP.
- Ching-Wen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240090342
- Publication date Mar 14, 2024
- UNITED MICROELECTRONICS CORP.
- Ching-Wen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITORS AND METHODS OF FORMING THE SAME
- Publication number 20240063253
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240047307
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- LIANG-PIN CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240021470
- Publication date Jan 18, 2024
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tianjian LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MEMORY AND METHODS OF FORMING THE SAME
- Publication number 20230413559
- Publication date Dec 21, 2023
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE CRITICAL DIMENSION POWER RAIL
- Publication number 20230411292
- Publication date Dec 21, 2023
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE HAVING DIFFERENT DIMENSIONS FOR CONNECTED CI...
- Publication number 20230402375
- Publication date Dec 14, 2023
- Samsung Electronics Co., Ltd.
- Eun Sung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Providing High Density Component...
- Publication number 20230402383
- Publication date Dec 14, 2023
- STATS ChipPAC Pte Ltd.
- WoonJae Beak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230394216
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei PENG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Device Packages, Packaging Methods, and Packaged Semi...
- Publication number 20230395588
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230395424
- Publication date Dec 7, 2023
- SK HYNIX INC.
- Dong Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20230386906
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Chen Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SRAM CELL WORD LINE STRUCTURE WITH REDUCED RC EFFECTS
- Publication number 20230380129
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hidehiro FUJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230380295
- Publication date Nov 23, 2023
- UNITED MICROELECTRONICS CORP.
- Ching-Wen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230343678
- Publication date Oct 26, 2023
- NANYA TECHNOLOGY CORPORATION
- LIANG-PIN CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20230317456
- Publication date Oct 5, 2023
- INFINEON TECHNOLOGIES AG
- Moriz Jelinek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE SIGNAL INTERCONNECTION
- Publication number 20230307365
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Xuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECONDARY ELECTRON GENERATING COMPOSITION
- Publication number 20230266665
- Publication date Aug 24, 2023
- The University of Manchester
- Scott LEWIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMING SEMICONDUCTOR DEVICES
- Publication number 20230225114
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL (MIM) CAPACITOR MODULE INCLUDING A CUP-SHAPED...
- Publication number 20230207615
- Publication date Jun 29, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure for Logic Circuit
- Publication number 20230197605
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Fang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LEADED SEMICONDUCTOR PACKAGE FORMATION USING LEAD FRAME WITH STRUCT...
- Publication number 20230178428
- Publication date Jun 8, 2023
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND METHOD OF FABRICATING THE SAME
- Publication number 20230178484
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Donghwa LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20230130273
- Publication date Apr 27, 2023
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20230114572
- Publication date Apr 13, 2023
- Micron Technology, Inc.
- John D. Hopkins
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE WITH UNEVEN ELECTRODE SURFACE AND METHOD FOR F...
- Publication number 20230105066
- Publication date Apr 6, 2023
- NANYA TECHNOLOGY CORPORATION
- Tsu-Chieh AI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRE-DEPOSITION TREATMENT OF A WORK-FUNCTION METAL LAYER
- Publication number 20230106314
- Publication date Apr 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Yen TSAI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STANDARD CELL DESIGN ARCHITECTURE FOR REDUCED VOLTAGE DROOP UTILIZI...
- Publication number 20230092184
- Publication date Mar 23, 2023
- ADVANCED MICRO DEVICES, INC.
- Richard T. Schultz
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the formation and the after-treatment of the conductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal-insulator-metal capacitor with top contact

Method of manufacturing a semiconductor package including correctin...

Mitigating pattern collapse

Memory arrays comprising strings of memory cells and methods used i...

Interconnect structure for logic circuit

Semiconductor device with connecting structure and method for fabri...

Metal gate structure and method of fabricating the same

Memory arrays comprising strings of memory cells and methods used i...

Forming self-aligned multi-metal interconnects

Microelectronic devices including support pillar structures, and re...

Stress analysis method and semiconductor device manufacturing method

Semiconductor device package and method of manufacturing the same

Semiconductor device with interconnect part and method for preparin...

Interconnect wires including relatively low resistivity cores

Metal gate structure and method of fabricating the same

Semiconductor device and method for fabricating the same

Metal oxide nanoparticles as fillable hardmask materials

Metal-insulator-metal capacitors and methods of forming the same

Semiconductor device with uneven electrode surface and method for f...

Semiconductor device packages, packaging methods, and packaged semi...

Contact structures having conductive portions in substrate in three...

SRAM cell word line structure with reduced RC effects

Method of manufacturing semiconductor device

Semiconductor device and method of providing high density component...

Semiconductor device and method for fabricating the same

Method for manufacturing semiconductor structure same

Interconnection for memory electrodes

Three dimensional memory and methods of forming the same

Semiconductor device and method for manufacturing the same

Semiconductor packages without debris

Patents Applicationslast 30 patents

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METAL-INSULATOR-METAL CAPACITORS AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

THREE DIMENSIONAL MEMORY AND METHODS OF FORMING THE SAME

MULTIPLE CRITICAL DIMENSION POWER RAIL

INTERCONNECT STRUCTURE HAVING DIFFERENT DIMENSIONS FOR CONNECTED CI...

Semiconductor Device and Method of Providing High Density Component...

INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor Device Packages, Packaging Methods, and Packaged Semi...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Integrated Circuit Package and Method

SRAM CELL WORD LINE STRUCTURE WITH REDUCED RC EFFECTS

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

BACKSIDE SIGNAL INTERCONNECTION

SECONDARY ELECTRON GENERATING COMPOSITION

SEMICONDUCTOR DEVICES AND METHODS OF FORMING SEMICONDUCTOR DEVICES

METAL-INSULATOR-METAL (MIM) CAPACITOR MODULE INCLUDING A CUP-SHAPED...

Interconnect Structure for Logic Circuit

LEADED SEMICONDUCTOR PACKAGE FORMATION USING LEAD FRAME WITH STRUCT...

SEMICONDUCTOR CHIP AND METHOD OF FABRICATING THE SAME

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

SEMICONDUCTOR DEVICE WITH UNEVEN ELECTRODE SURFACE AND METHOD FOR F...

METHODS FOR PRE-DEPOSITION TREATMENT OF A WORK-FUNCTION METAL LAYER

STANDARD CELL DESIGN ARCHITECTURE FOR REDUCED VOLTAGE DROOP UTILIZI...