characterised by the formation of thin functional dielectric layers

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H01L21/76829

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/76829characterised by the formation of thin functional dielectric layers

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,315,792
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Jongmin Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and manufacturing method thereof
- Patent number 12,315,761
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for removing etch stop layers
- Patent number 12,315,735
- Issue date May 27, 2025
- Applied Materials, Inc.
- Suketu Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,308,288
- Issue date May 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Tzu-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated metal-insulator-metal capacitors
- Patent number 12,308,309
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Zhong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with fluorine-catching layer
- Patent number 12,308,319
- Issue date May 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal low temperature hermetic dielectric diffusion barriers
- Patent number 12,300,537
- Issue date May 13, 2025
- Intel Corporation
- Sean King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect conductive structure comprising two conductive materials
- Patent number 12,300,611
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Teng Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure including SiOCN layer and method of forming same
- Patent number 12,293,911
- Issue date May 6, 2025
- ASM IP Holding B.V.
- YoungChol Byun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reworking process of a failed hard mask for fabricating a semicondu...
- Patent number 12,293,922
- Issue date May 6, 2025
- NANYA TECHNOLOGY CORPORATION
- Wei-Chen Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of providing a workpiece including low resistance interconne...
- Patent number 12,278,143
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising carbon-doped silicon nitride and r...
- Patent number 12,279,423
- Issue date Apr 15, 2025
- Micron Technology, Inc.
- Jun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,278,140
- Issue date Apr 15, 2025
- NANYA TECHNOLOGY CORPORATION
- Tzu-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method for forming the same
- Patent number 12,278,176
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuitry, a memory array comprising strings of memory c...
- Patent number 12,266,569
- Issue date Apr 1, 2025
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial capping layer for contact etch
- Patent number 12,266,533
- Issue date Apr 1, 2025
- Tokyo Electron Limited
- Yun Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Textile patterning for subtractively-patterned self-aligned interco...
- Patent number 12,261,057
- Issue date Mar 25, 2025
- Tahoe Research, LTD.
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,255,094
- Issue date Mar 18, 2025
- Samsung Electronics Co., Ltd.
- Jun Hyuk Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and methods of forming the same
- Patent number 12,249,650
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-mask alternating line deposition
- Patent number 12,243,819
- Issue date Mar 4, 2025
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits with capacitors
- Patent number 12,243,871
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiao-Han Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures including middle-of-line (MOL) capacitance...
- Patent number 12,237,368
- Issue date Feb 25, 2025
- Adeia Semiconductor Solutions LLC
- Injo Ok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including insulation patterns with different...
- Patent number 12,237,385
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Bongkwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner for a bi-layer gate helmet and the fabrication thereof
- Patent number 12,237,418
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with damascene structure
- Patent number 12,230,535
- Issue date Feb 18, 2025
- NANYA TECHNOLOGY CORPORATION
- Wei-Chen Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure having air gap and methods of formin...
- Patent number 12,230,537
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated circuit device having an etch-stop...
- Patent number 12,218,054
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Taeyong Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with etch stop layer for reducing RC...
- Patent number 12,218,241
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ting Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with finned support pillar structur...
- Patent number 12,213,320
- Issue date Jan 28, 2025
- SanDisk Technologies LLC
- Seiji Shimabukuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate, display panel and manufacturing method of displa...
- Patent number 12,205,961
- Issue date Jan 21, 2025
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Chunge Yuan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
INTERLAYER DIELECTRIC LAYER
- Publication number 20250174493
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING...
- Publication number 20250167078
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH CAPACITORS
- Publication number 20250169163
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao-Han Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING CARBON-DOPED SILICON NITRIDE
- Publication number 20250159877
- Publication date May 15, 2025
- Micron Technology, Inc.
- Jun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICES COMPRISING CARBON-DOPED SI...
- Publication number 20250159878
- Publication date May 15, 2025
- Micron Technology, Inc.
- Jun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH LOW RC DELAY AND METHOD FOR MANUFACTURI...
- Publication number 20250149436
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gary LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION BY NANO PIPES
- Publication number 20250140644
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTODETECTOR WITH DISTRIBUTED BRAGG REFLECTOR AND METHODS OF FORMI...
- Publication number 20250143011
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hao Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE COMPOSITE AS ETCH STOP LAYER
- Publication number 20250132197
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Feng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250133790
- Publication date Apr 24, 2025
- United Semiconductor (Xiamen) Co., Ltd.
- Yong XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE WITH ETCH STOP LAYER
- Publication number 20250132252
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-En CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250132210
- Publication date Apr 24, 2025
- UNITED MICROELECTRONICS CORP.
- Yao-Hsien Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250132237
- Publication date Apr 24, 2025
- Sony Semiconductor Solutions Corporation
- NOBUTOSHI FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250133755
- Publication date Apr 24, 2025
- United Microelectronics Corp.
- Shin-Hung LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVED SURFACE PRE-TREATMENT FOR SEMICONDUCTOR DEVICE BONDING STR...
- Publication number 20250125194
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Amram Eitan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION STRUCTURE AND THE METHODS OF FORMING THE SAME
- Publication number 20250125223
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250118671
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Su Hyun Bark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING INTERCONNECT STRUCTURE AND METHOD FO...
- Publication number 20250105140
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Kang FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20250105057
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM LATERAL EXPANSION OF CONTACT PLUGS THROUGH IMPLANTATION
- Publication number 20250096041
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250096140
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Chang WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT RESISTANCE REDUCTION FOR TRANSISTORS
- Publication number 20250087491
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Ping Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250087482
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yi CHOU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE PASSIVATION AND SELECTIVE DEPOSITION
- Publication number 20250069885
- Publication date Feb 27, 2025
- ASM IP HOLDING B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Fabricating Method Thereof
- Publication number 20250062222
- Publication date Feb 20, 2025
- UNITED MICROELECTRONICS CORP.
- Tai-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING GATE STRUCTURE
- Publication number 20250063759
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME
- Publication number 20250056851
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jen-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING LINES OF DIFFERENT HEIGHT
- Publication number 20250054811
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chen CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING BOTTOM DIELECTRIC ISOLATION LAYERS
- Publication number 20250056871
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- San-Kuei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY SELF-ALIGNED VIA WITH GRAPHENE CAP
- Publication number 20250054809
- Publication date Feb 13, 2025
- TOKYO ELECTRON LIMITED
- Kandabara Tapily
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the formation of thin functional dielectric layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Interconnection structure and manufacturing method thereof

Methods for removing etch stop layers

Semiconductor device with composite conductive features and method...

Semiconductor device with integrated metal-insulator-metal capacitors

Semiconductor device structure with fluorine-catching layer

Conformal low temperature hermetic dielectric diffusion barriers

Interconnect conductive structure comprising two conductive materials

Structure including SiOCN layer and method of forming same

Reworking process of a failed hard mask for fabricating a semicondu...

Method of providing a workpiece including low resistance interconne...

Semiconductor devices comprising carbon-doped silicon nitride and r...

Semiconductor device with composite conductive features and method...

Integrated circuit structure and method for forming the same

Integrated circuitry, a memory array comprising strings of memory c...

Sacrificial capping layer for contact etch

Textile patterning for subtractively-patterned self-aligned interco...

Semiconductor device

FinFET device and methods of forming the same

Single-mask alternating line deposition

Integrated circuits with capacitors

Semiconductor structures including middle-of-line (MOL) capacitance...

Semiconductor devices including insulation patterns with different...

Liner for a bi-layer gate helmet and the fabrication thereof

Method for fabricating semiconductor device with damascene structure

Semiconductor device structure having air gap and methods of formin...

Method of forming an integrated circuit device having an etch-stop...

Semiconductor device structure with etch stop layer for reducing RC...

Three-dimensional memory device with finned support pillar structur...

Display substrate, display panel and manufacturing method of displa...

Patents Applicationslast 30 patents

INTERLAYER DIELECTRIC LAYER

SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING...

INTEGRATED CIRCUITS WITH CAPACITORS

SEMICONDUCTOR DEVICES COMPRISING CARBON-DOPED SILICON NITRIDE

METHODS OF FORMING SEMICONDUCTOR DEVICES COMPRISING CARBON-DOPED SI...

INTERCONNECT STRUCTURE WITH LOW RC DELAY AND METHOD FOR MANUFACTURI...

HEAT DISSIPATION BY NANO PIPES

PHOTODETECTOR WITH DISTRIBUTED BRAGG REFLECTOR AND METHODS OF FORMI...

METAL OXIDE COMPOSITE AS ETCH STOP LAYER

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

CHIP STRUCTURE WITH ETCH STOP LAYER

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

CAPACITOR DEVICE AND MANUFACTURING METHOD THEREOF

IMPROVED SURFACE PRE-TREATMENT FOR SEMICONDUCTOR DEVICE BONDING STR...

PASSIVATION STRUCTURE AND THE METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING INTERCONNECT STRUCTURE AND METHOD FO...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

BOTTOM LATERAL EXPANSION OF CONTACT PLUGS THROUGH IMPLANTATION

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

CONTACT RESISTANCE REDUCTION FOR TRANSISTORS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SELECTIVE PASSIVATION AND SELECTIVE DEPOSITION

Semiconductor Device and Fabricating Method Thereof

METHOD OF FORMING GATE STRUCTURE

SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE INCLUDING LINES OF DIFFERENT HEIGHT

METHODS OF FORMING BOTTOM DIELECTRIC ISOLATION LAYERS

FULLY SELF-ALIGNED VIA WITH GRAPHENE CAP