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H01L21/02112

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02112characterised by the material of the layer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus, reaction container, method of manuf...
- Patent number 12,163,226
- Issue date Dec 10, 2024
- Kokusai Electric Corporation
- Kazuki Nonomura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,159,786
- Issue date Dec 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Kai Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for sealing a seam, semiconductor structure, and method for...
- Patent number 12,094,768
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuitry, memory arrays comprising strings of memory ce...
- Patent number 12,087,632
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Corey Staller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate
- Patent number 12,068,166
- Issue date Aug 20, 2024
- FILNEX INC.
- Mitsuhiko Ogihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate spacer structure and method of forming same
- Patent number 12,062,709
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ting Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-κ ALD gap-fill methods and material
- Patent number 12,020,923
- Issue date Jun 25, 2024
- Lam Research Corporation
- Joseph R. Abel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,009,427
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kun-Mu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cryogenic atomic layer etch with noble gases
- Patent number 11,996,294
- Issue date May 28, 2024
- Applied Materials, Inc.
- Alvaro Garcia De Gorordo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Film forming method and film forming apparatus
- Patent number 11,915,914
- Issue date Feb 27, 2024
- Tokyo Electron Limited
- Sena Fujita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low-k boron carbonitride films
- Patent number 11,830,729
- Issue date Nov 28, 2023
- Applied Materials, Inc.
- Zeqing Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core-shell particles for magnetic packaging
- Patent number 11,804,420
- Issue date Oct 31, 2023
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming SOI substrates
- Patent number 11,764,054
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Alex Usenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabricating method thereof
- Patent number 11,764,267
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Chieh Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,764,074
- Issue date Sep 19, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-high modulus and etch selectivity boron-carbon hardmask films
- Patent number 11,728,168
- Issue date Aug 15, 2023
- Applied Materials, Inc.
- Prashant Kumar Kulshreshtha
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Germanium nitride layers on semiconductor structures, and methods f...
- Patent number 11,721,721
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Martin Christopher Holland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate spacer structure and method of forming same
- Patent number 11,705,505
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ting Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and semiconductor sub...
- Patent number 11,670,514
- Issue date Jun 6, 2023
- FILNEX INC.
- Mitsuhiko Ogihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,631,756
- Issue date Apr 18, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Yuta Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and planarization method thereof
- Patent number 11,626,315
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Jung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Catalytic formation of boron and carbon films
- Patent number 11,626,278
- Issue date Apr 11, 2023
- Applied Materials, Inc.
- Bo Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D NAND etch
- Patent number 11,515,170
- Issue date Nov 29, 2022
- Applied Materials, Inc.
- Shishi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cryogenic atomic layer etch with noble gases
- Patent number 11,515,166
- Issue date Nov 29, 2022
- Applied Materials, Inc.
- Alvaro Garcia De Gorordo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Deposition of low-stress boron-containing layers
- Patent number 11,495,454
- Issue date Nov 8, 2022
- Applied Materials, Inc.
- Huiyuan Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,489,074
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kun-Mu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating film, method for manufacturing semiconductor device, and...
- Patent number 11,437,523
- Issue date Sep 6, 2022
- Semiconductor Energy Laboratory Co., Ltd.
- Kenichi Okazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming spacers of a transistor
- Patent number 11,393,689
- Issue date Jul 19, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Nicolas Posseme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure formation
- Patent number 11,387,369
- Issue date Jul 12, 2022
- Micron Technology, Inc.
- Shen Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film forming and process container cleaning method
- Patent number 11,367,610
- Issue date Jun 21, 2022
- Tokyo Electron Limited
- Yoshihide Kihara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240387255
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING SEAM SEALED
- Publication number 20240379419
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-K ALD GAP-FILL METHODS AND MATERIAL
- Publication number 20240347337
- Publication date Oct 17, 2024
- LAM RESEARCH CORPORATION
- Joseph R. Abel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240312829
- Publication date Sep 19, 2024
- DB HiTek Co., Ltd.
- Sang Il HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240297252
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kun-Mu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE REDISTRIBUTION STRUCTURE AND FABRICATION METH...
- Publication number 20240282628
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dian-Hau CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING FILM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND...
- Publication number 20240178323
- Publication date May 30, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Kenichi OKAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE
- Publication number 20240079244
- Publication date Mar 7, 2024
- FILNEX INC.
- Mitsuhiko OGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING MECHANISM HAVING NANOCAPILLARY STRUCTURE, SEMICONDUCTOR DEV...
- Publication number 20240030102
- Publication date Jan 25, 2024
- SONY GROUP CORPORATION
- Hikaru OHIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240021427
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Jungmin Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20230411163
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Georgios Vellianitis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230402277
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Ta CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF
- Publication number 20230395379
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Che CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SOI SUBSTRATES
- Publication number 20230369038
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alex Usenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230343579
- Publication date Oct 26, 2023
- National Tsing-Hua University
- Po-Wen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230335395
- Publication date Oct 19, 2023
- NANYA TECHNOLOGY CORPORATION
- Kai Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR...
- Publication number 20230335390
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING KANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-HIGH MODULUS AND ETCH SELECTIVITY BORON-CARBON HARDMASK FILMS
- Publication number 20230317455
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Prashant Kumar KULSHRESHTHA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Gate Spacer Structure and Method of Forming Same
- Publication number 20230307525
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ting Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20230268225
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING PHOTORESIST LAYER, AND PHOTORESIST LAYER
- Publication number 20230187207
- Publication date Jun 15, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Kanyu CAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH MODULUS BORON-BASED CERAMICS FOR SEMICONDUCTOR APPLICATIONS
- Publication number 20230112746
- Publication date Apr 13, 2023
- LAM RESEARCH CORPORATION
- Ananda K. BANERJI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HALOGENATION-BASED GAPFILL METHOD AND SYSTEM
- Publication number 20230115806
- Publication date Apr 13, 2023
- ASM IP HOLDING B.V.
- Timothee Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ITO THIN FILM BASED ON SOLUTION METHOD
- Publication number 20230094245
- Publication date Mar 30, 2023
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Jia LI
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20230085456
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Kyo-Suk Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYOGENIC ATOMIC LAYER ETCH WITH NOBLE GASES
- Publication number 20230071505
- Publication date Mar 9, 2023
- Applied Materials, Inc.
- Alvaro GARCIA DE GORORDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230049249
- Publication date Feb 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kun-Mu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20230044856
- Publication date Feb 9, 2023
- Samsung Electronics Co., Ltd.
- Taejin PARK
- G11 - INFORMATION STORAGE
Information Patent Application
INSULATING FILM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND...
- Publication number 20230006064
- Publication date Jan 5, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Kenichi OKAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220416070
- Publication date Dec 29, 2022
- Samsung Electronics Co., Ltd.
- Junhyuk PARK
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the material of the layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate processing apparatus, reaction container, method of manuf...

Semiconductor device and method of manufacturing the same

Method for sealing a seam, semiconductor structure, and method for...

Integrated circuitry, memory arrays comprising strings of memory ce...

Semiconductor substrate

Gate spacer structure and method of forming same

Low-κ ALD gap-fill methods and material

Semiconductor device and manufacturing method thereof

Cryogenic atomic layer etch with noble gases

Film forming method and film forming apparatus

Low-k boron carbonitride films

Core-shell particles for magnetic packaging

Methods of forming SOI substrates

Semiconductor device and fabricating method thereof

Semiconductor device

Ultra-high modulus and etch selectivity boron-carbon hardmask films

Germanium nitride layers on semiconductor structures, and methods f...

Gate spacer structure and method of forming same

Method for manufacturing semiconductor device and semiconductor sub...

Semiconductor device and method for manufacturing the same

Semiconductor structure and planarization method thereof

Catalytic formation of boron and carbon films

3D NAND etch

Cryogenic atomic layer etch with noble gases

Deposition of low-stress boron-containing layers

Semiconductor device and manufacturing method thereof

Insulating film, method for manufacturing semiconductor device, and...

Method for forming spacers of a transistor

Semiconductor structure formation

Film forming and process container cleaning method

Patents Applicationslast 30 patents

DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE HAVING SEAM SEALED

LOW-K ALD GAP-FILL METHODS AND MATERIAL

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE REDISTRIBUTION STRUCTURE AND FABRICATION METH...

INSULATING FILM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND...

SEMICONDUCTOR SUBSTRATE

COOLING MECHANISM HAVING NANOCAPILLARY STRUCTURE, SEMICONDUCTOR DEV...

METHOD OF FORMING FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF

METHODS OF FORMING SOI SUBSTRATES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR...

ULTRA-HIGH MODULUS AND ETCH SELECTIVITY BORON-CARBON HARDMASK FILMS

Gate Spacer Structure and Method of Forming Same

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

METHOD OF PROCESSING PHOTORESIST LAYER, AND PHOTORESIST LAYER

HIGH MODULUS BORON-BASED CERAMICS FOR SEMICONDUCTOR APPLICATIONS

HALOGENATION-BASED GAPFILL METHOD AND SYSTEM

MANUFACTURING METHOD OF ITO THIN FILM BASED ON SOLUTION METHOD

SEMICONDUCTOR DEVICES

CRYOGENIC ATOMIC LAYER ETCH WITH NOBLE GASES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MEMORY DEVICE

INSULATING FILM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND...

HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF MANUFACTURING THE SAME