characterised by the material or arrangement of seals between parts

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B81C2203/019

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2203/00Forming micro-structural systems

Current Industry

B81C2203/019characterised by the material or arrangement of seals between parts

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wafer level package for device
- Patent number 12,209,012
- Issue date Jan 28, 2025
- Teknologian tutkimuskeskus VTT Oy
- Jae-Wung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for fabricating a MEMS device
- Patent number 12,180,069
- Issue date Dec 31, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Conductive bond structure to increase membrane sensitivity in MEMS...
- Patent number 12,139,399
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed MEMS mirror and method of manufacture
- Patent number 12,078,799
- Issue date Sep 3, 2024
- STMicroelectron S.r.l.
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging of microfluidic devices and microfluidic integrated syste...
- Patent number 11,926,522
- Issue date Mar 12, 2024
- Corporation for National Research Initiatives
- Michael A. Huff
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS encapsulation employing lower pressure and higher pressure dep...
- Patent number 11,834,331
- Issue date Dec 5, 2023
- Texas Instruments Incorporated
- Scott Robert Summerfelt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and method for manufacturing thereof
- Patent number 11,807,520
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi-Chuan Teng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulant barrier
- Patent number 11,807,522
- Issue date Nov 7, 2023
- Texas Instruments Incorporated
- Jane Qian Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 11,760,059
- Issue date Sep 19, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Eutectic bonding with AlGe
- Patent number 11,724,933
- Issue date Aug 15, 2023
- Rohm Co., Ltd.
- Martin Heller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensing implant
- Patent number 11,707,230
- Issue date Jul 25, 2023
- ENDOTRONIX, INC.
- Harry Rowland
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capping plate for panel scale packaging of MEMS products
- Patent number 11,685,649
- Issue date Jun 27, 2023
- OBSIDIAN SENSORS, INC.
- John Hong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed MEMS mirror and method of manufacture
- Patent number 11,675,186
- Issue date Jun 13, 2023
- STMicroelectronics S.r.l.
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged die and assembling method
- Patent number 11,597,647
- Issue date Mar 7, 2023
- TDK Corporation
- Andreas Barbul
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus having a bondline structure and a diffusion barrier with...
- Patent number 11,505,451
- Issue date Nov 22, 2022
- Texas Instruments Incorporated
- Ganapathy Subramaniam Sivakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 11,505,452
- Issue date Nov 22, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Lawrence Prestousa Natan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and method for fabricating the same
- Patent number 11,434,129
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Conductive bond structure to increase membrane sensitivity in MEMS...
- Patent number 11,292,715
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for encapsulating a microelectronic device, comprising a ste...
- Patent number 11,254,567
- Issue date Feb 22, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Messaoud Bedjaoui
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package with roughend interface
- Patent number 11,192,778
- Issue date Dec 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jui Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor system, sensor arrangement, and assembly method using solder...
- Patent number 11,146,893
- Issue date Oct 12, 2021
- TE CONNECTIVITY SOLUTIONS GmbH
- Predrag Drljaca
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and fabrication method thereof
- Patent number 11,130,671
- Issue date Sep 28, 2021
- WUHAN YANXI MICRO COMPONENTS CO., LTD.
- Wei Dong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical device and corresponding production method
- Patent number 11,130,672
- Issue date Sep 28, 2021
- Robert Bosch GmbH
- Johannes Baader
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Physical quantity sensor, complex sensor, inertial measurement unit...
- Patent number 11,112,424
- Issue date Sep 7, 2021
- Seiko Epson Corporation
- Juichiro Matsuzawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stress reduction during laser resealing through a temperature increase
- Patent number 11,084,716
- Issue date Aug 10, 2021
- Robert Bosch GmbH
- Julia Amthor
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for setting a pressure in a cavity formed with the aid of a...
- Patent number 11,084,714
- Issue date Aug 10, 2021
- Robert Bosch GmbH
- Peter Borwin Staffeld
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with discharge path, and method for producing...
- Patent number 11,027,968
- Issue date Jun 8, 2021
- Denso Corporation
- Megumi Suzuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stabilized transient liquid phase metal bonding material for hermet...
- Patent number 11,000,915
- Issue date May 11, 2021
- Texas Instruments Incorporated
- John Charles Ehmke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package moisture control and leak mitigation for high vacuum sealed...
- Patent number 10,968,099
- Issue date Apr 6, 2021
- Texas Instruments Incorporated
- Kathryn Anne Schuck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device formed by at least two bonded structural layers and man...
- Patent number 10,954,121
- Issue date Mar 23, 2021
- STMicroelectronics S.r.l.
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
ENCLOSURE
- Publication number 20240417244
- Publication date Dec 19, 2024
- SCHOTT AG
- Jens Ulrich Thomas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...
- Publication number 20240367965
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND APPARATUS FOR SEMICONDUCTOR PACKAGES WITH WINDOW ASSEMB...
- Publication number 20240228265
- Publication date Jul 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jane Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240092631
- Publication date Mar 21, 2024
- Rohm Co., Ltd.
- Yoshiyuki INUI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO ELECTRO-MECHANICAL SYSTEMS PACKAGE AND MANUFACTURING METHOD
- Publication number 20240076181
- Publication date Mar 7, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook PARK
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20230382718
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-CHUAN TENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSING IMPLANT
- Publication number 20230380764
- Publication date Nov 30, 2023
- ENDOTRONIX, INC.
- Harry ROWLAND
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED MEMS MIRROR AND METHOD OF MANUFACTURE
- Publication number 20230324678
- Publication date Oct 12, 2023
- STMicroelectronics S.r.l
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
- Publication number 20230314197
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Arvinder Manmohan Singh Chadha
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INERTIAL SENSOR, METHOD FOR MANUFACTURING INERTIAL SENSOR, AND INER...
- Publication number 20230221346
- Publication date Jul 13, 2023
- SEIKO EPSON CORPORATION
- Teruo TAKIZAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEALED CAVITY STRUCTURE AND METHOD FOR MANUFACTURING SEALED CAVITY...
- Publication number 20230174373
- Publication date Jun 8, 2023
- AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD
- Wooicheang Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Fabrication Method of MEMS Transducer Element
- Publication number 20230146234
- Publication date May 11, 2023
- TE Connectivity Solutions GMBH
- Jean-Francois Le Neal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PROCESSING FOR MICROELECTRONIC DEVICE PACKAGE WITH CAVITY
- Publication number 20230092132
- Publication date Mar 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Hau Nguyen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROTECTIVE BONDLINE CONTROL STRUCTURE
- Publication number 20230064645
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Ganapathy Subramaniam Sivakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer level package for device
- Publication number 20230050181
- Publication date Feb 16, 2023
- Teknologian Tutkimuskeskus VTT Oy
- Jae-Wung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP
- Publication number 20230045563
- Publication date Feb 9, 2023
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20220411260
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-CHUAN TENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ENCAPSULATION EMPLOYING LOWER PRESSURE AND HIGHER PRESSURE DEP...
- Publication number 20220324702
- Publication date Oct 13, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Scott Robert SUMMERFELT
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220315414
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEN CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...
- Publication number 20220219973
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
RESONANCE DEVICE AND RESONANCE DEVICE MANUFACTURING METHOD
- Publication number 20210403316
- Publication date Dec 30, 2021
- Murata Manufacturing Co., Ltd.
- Masakazu Fukumitsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR ENCAPSULATING A MICROELECTRONIC DEVICE, COMPRISING A STE...
- Publication number 20210047177
- Publication date Feb 18, 2021
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Messaoud BEDJAOUI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210047173
- Publication date Feb 18, 2021
- Amkor Technology Singapore Holding Pte. Ltd
- Lawrence Prestousa Natan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...
- Publication number 20200407220
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL DEVICE AND CORRESPONDING PRODUCTION METHOD
- Publication number 20200361765
- Publication date Nov 19, 2020
- ROBERT BOSCH GmbH
- Johannes Baader
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PACKAGE WITH ROUGHEND INTERFACE
- Publication number 20200339413
- Publication date Oct 29, 2020
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Yu-Jui Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20200331749
- Publication date Oct 22, 2020
- WUHAN YANXI MICRO COMPONENTS CO., LTD.
- Wei DONG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE WITH DISCHARGE PATH, AND METHOD FOR PRODUCING...
- Publication number 20200299128
- Publication date Sep 24, 2020
- DENSO CORPORATION
- Megumi SUZUKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS REDUCTION DURING LASER RESEALING THROUGH A TEMPERATURE INCREASE
- Publication number 20200270124
- Publication date Aug 27, 2020
- ROBERT BOSCH GmbH
- Julia AMTHOR
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROTECTIVE BONDLINE CONTROL STRUCTURE
- Publication number 20200216306
- Publication date Jul 9, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Ganapathy Subramaniam Sivakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY

characterised by the material or arrangement of seals between parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer level package for device

Method and system for fabricating a MEMS device

Conductive bond structure to increase membrane sensitivity in MEMS...

Hermetically sealed MEMS mirror and method of manufacture

Packaging of microfluidic devices and microfluidic integrated syste...

MEMS encapsulation employing lower pressure and higher pressure dep...

Semiconductor structure and method for manufacturing thereof

Encapsulant barrier

Method of room temperature covalent bonding

Eutectic bonding with AlGe

Pressure sensing implant

Capping plate for panel scale packaging of MEMS products

Hermetically sealed MEMS mirror and method of manufacture

Packaged die and assembling method

Apparatus having a bondline structure and a diffusion barrier with...

Semiconductor device

Semiconductor structure and method for fabricating the same

Conductive bond structure to increase membrane sensitivity in MEMS...

Method for encapsulating a microelectronic device, comprising a ste...

MEMS package with roughend interface

Sensor system, sensor arrangement, and assembly method using solder...

MEMS device and fabrication method thereof

Micromechanical device and corresponding production method

Physical quantity sensor, complex sensor, inertial measurement unit...

Stress reduction during laser resealing through a temperature increase

Method for setting a pressure in a cavity formed with the aid of a...

Semiconductor device with discharge path, and method for producing...

Stabilized transient liquid phase metal bonding material for hermet...

Package moisture control and leak mitigation for high vacuum sealed...

MEMS device formed by at least two bonded structural layers and man...

Patents Applicationslast 30 patents

ENCLOSURE

CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...

METHODS AND APPARATUS FOR SEMICONDUCTOR PACKAGES WITH WINDOW ASSEMB...

MEMS SENSOR AND MANUFACTURING METHOD THEREOF

MICRO ELECTRO-MECHANICAL SYSTEMS PACKAGE AND MANUFACTURING METHOD

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE

PRESSURE SENSING IMPLANT

HERMETICALLY SEALED MEMS MIRROR AND METHOD OF MANUFACTURE

PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF

INERTIAL SENSOR, METHOD FOR MANUFACTURING INERTIAL SENSOR, AND INER...

SEALED CAVITY STRUCTURE AND METHOD FOR MANUFACTURING SEALED CAVITY...

Fabrication Method of MEMS Transducer Element

WAFER LEVEL PROCESSING FOR MICROELECTRONIC DEVICE PACKAGE WITH CAVITY

PROTECTIVE BONDLINE CONTROL STRUCTURE

Wafer level package for device

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THEREOF

MEMS ENCAPSULATION EMPLOYING LOWER PRESSURE AND HIGHER PRESSURE DEP...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...

RESONANCE DEVICE AND RESONANCE DEVICE MANUFACTURING METHOD

METHOD FOR ENCAPSULATING A MICROELECTRONIC DEVICE, COMPRISING A STE...

SEMICONDUCTOR DEVICE

CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...

MICROMECHANICAL DEVICE AND CORRESPONDING PRODUCTION METHOD

MEMS PACKAGE WITH ROUGHEND INTERFACE

MEMS DEVICE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE WITH DISCHARGE PATH, AND METHOD FOR PRODUCING...

STRESS REDUCTION DURING LASER RESEALING THROUGH A TEMPERATURE INCREASE

PROTECTIVE BONDLINE CONTROL STRUCTURE