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Semiconductor Package Assembly
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Publication number 20240145529
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Publication date May 2, 2024
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KYOCERA AVX Components Corporation
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Laurent Desclos
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H01 - BASIC ELECTRIC ELEMENTS
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POWER ELECTRONICS MODULE
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Publication number 20240136248
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Publication date Apr 25, 2024
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SAFRAN ELECTRICAL & POWER
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Benoit Michaud
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H01 - BASIC ELECTRIC ELEMENTS
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ELECTRONIC APPARATUS
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Publication number 20240120264
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Publication date Apr 11, 2024
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DENSO CORPORATION
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Kenichiro TAKAGI
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H01 - BASIC ELECTRIC ELEMENTS
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POROUS POLYMER DIELECTRIC LAYER ON CORE
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Publication number 20240113009
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Publication date Apr 4, 2024
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Intel Corporation
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Whitney Bryks
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B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
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ELECTRONIC DEVICE
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Publication number 20240112967
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Publication date Apr 4, 2024
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DENSO CORPORATION
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Kenichiro TAKAGI
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H01 - BASIC ELECTRIC ELEMENTS
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IN-MOLD ELECTRONICS DEVICE
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Publication number 20240112969
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Publication date Apr 4, 2024
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Industrial Technology Research Institute
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Yu-Ming Peng
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H01 - BASIC ELECTRIC ELEMENTS
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WIRING SUBSTRATE
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Publication number 20240113008
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Publication date Apr 4, 2024
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Niterra Co., Ltd.
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Kensuke MATSUHASHI
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240105662
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Publication date Mar 28, 2024
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Samsung Electronics Co., Ltd.
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Jungho SHIM
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H01 - BASIC ELECTRIC ELEMENTS
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