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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/14characterised by the material or its electrical properties

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Patents Grantslast 30 patents

Information Patent Grant
Method and device for providing through-openings in a substrate and...
- Patent number 12,365,051
- Issue date Jul 22, 2025
- LPKF LASER & ELECTRONICS SE
- Robin Alexander Krueger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device, semiconductor device...
- Patent number 12,362,248
- Issue date Jul 15, 2025
- Goki Toshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic device
- Patent number 12,362,249
- Issue date Jul 15, 2025
- Japan Display Inc.
- Takumi Sano
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor devices with flexible spacer including a support stru...
- Patent number 12,362,247
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Faxing Che
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging apparatus and manufacturing method of the same
- Patent number 12,356,737
- Issue date Jul 8, 2025
- SONY SEMISCONDUCTOR SOLUTIONS CORPORATION
- Mutsuo Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
- Patent number 12,354,968
- Issue date Jul 8, 2025
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and semiconductor device
- Patent number 12,347,814
- Issue date Jul 1, 2025
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective use of different advanced interface bus with electronic c...
- Patent number 12,334,449
- Issue date Jun 17, 2025
- Altera Corporation
- Dheeraj Subbareddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D system integration
- Patent number 12,327,783
- Issue date Jun 10, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust mold integrated substrate
- Patent number 12,327,801
- Issue date Jun 10, 2025
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method of the same
- Patent number 12,322,668
- Issue date Jun 3, 2025
- Nippon Telegraph and Telephone Corporation
- Hiromasa Tanobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 12,322,706
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and semiconductor module
- Patent number 12,315,838
- Issue date May 27, 2025
- Fuji Electric Co., Ltd.
- Tadahiko Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,315,771
- Issue date May 27, 2025
- Fuji Electric Co., Ltd.
- Tomohiro Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power substrate assembly with reduced warpage
- Patent number 12,308,338
- Issue date May 20, 2025
- Littelfuse, Inc.
- Tiburcio A. Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,308,336
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Jungho Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming thereof
- Patent number 12,300,656
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device integration with an amorphous region
- Patent number 12,293,994
- Issue date May 6, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Vvss Satyasuresh Choppalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,283,555
- Issue date Apr 22, 2025
- Analog Devices International Unlimited Company
- Bilge Bayrakci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,272,568
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an integrated device positioned within...
- Patent number 12,272,629
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device including forming a first...
- Patent number 12,266,612
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite substrate and method of producing the composite substrate...
- Patent number 12,261,090
- Issue date Mar 25, 2025
- Nichia Corporation
- Masatsugu Ichikawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Secure semiconductor integration and method for making thereof
- Patent number 12,255,189
- Issue date Mar 18, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on standardized commodity programmable logic semi...
- Patent number 12,255,195
- Issue date Mar 18, 2025
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, RDL structure comprising redistribution layer ha...
- Patent number 12,249,564
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method
- Patent number 12,237,238
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including wiring substrate having multiple sig...
- Patent number 12,237,254
- Issue date Feb 25, 2025
- Renesas Electronics Corporation
- Keita Tsuchiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposers for microelectronic devices
- Patent number 12,230,583
- Issue date Feb 18, 2025
- Micron Technology, Inc.
- Owen Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH INTERPOSER DIES
- Publication number 20250239579
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tso-Jung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND A METHOD FOR FORMING THE SAME
- Publication number 20250239531
- Publication date Jul 24, 2025
- STATS ChipPAC Pte Ltd.
- TaeWoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTURING COMPON...
- Publication number 20250239535
- Publication date Jul 24, 2025
- IBIDEN CO., LTD.
- Yuichi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR ELECTRONIC DEVICE
- Publication number 20250233031
- Publication date Jul 17, 2025
- SOITEC
- Hugo Biard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BOND INTERCONNECT ARCHITECTURES FOR PACKAGING ASSEMBLIES
- Publication number 20250218988
- Publication date Jul 3, 2025
- Intel Corporation
- Yosuke KANAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure
- Publication number 20250219031
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Yi-Feng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIST TENTING AND PLATING IN CORE CAVITY FOR COMPONENT ATTACHMENT
- Publication number 20250218879
- Publication date Jul 3, 2025
- Intel Corporation
- Hiroki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250210424
- Publication date Jun 26, 2025
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CORE SUBSTRATE AND METHOD OF PRODUCING THE METAL CORE SUBSTRATE
- Publication number 20250210425
- Publication date Jun 26, 2025
- Nitto Denko Corporation
- Takahiro IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE WITH GRAPHITE SHEETS
- Publication number 20250201656
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Keiji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20250201583
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON SUBSTRATE SEMICONDUCTOR PACKAGE WITH INTEGRATED STACK CAPAC...
- Publication number 20250203889
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Yan LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, PREPREG, LAMINATED BOARD, RESIN FILM, PRINTED WI...
- Publication number 20250188263
- Publication date Jun 12, 2025
- Resonac Corporation
- Naoyoshi SATO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POWER MODULE HAVING INTERCONNECTED BASE PLATE WITH MOLDED METAL AND...
- Publication number 20250183123
- Publication date Jun 5, 2025
- Alpha and Omega Semiconductor International LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDIS...
- Publication number 20250183143
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION TH...
- Publication number 20250185156
- Publication date Jun 5, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL POWER ARCHITECTURE WITH DUAL CORE ADVANCE SUBSTRATE
- Publication number 20250183240
- Publication date Jun 5, 2025
- Applied Materials, Inc.
- Mudit Sunilkumar Khasgiwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183163
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Juyoun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRIC POWER CONVERSION DEVICE
- Publication number 20250174503
- Publication date May 29, 2025
- Minebea Power Semiconductor Device Inc.
- Norio NAKAZATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE...
- Publication number 20250174504
- Publication date May 29, 2025
- Resonac Corporation
- Goki TOSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layered Metal Frame Power Package
- Publication number 20250174543
- Publication date May 29, 2025
- Ferric Inc.
- Noah Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250174505
- Publication date May 29, 2025
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250174568
- Publication date May 29, 2025
- InnoLux Corporation
- Po-Yun HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20250174539
- Publication date May 29, 2025
- nD-HI Technologies Lab, Inc.
- HO-MING TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250174517
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20250167059
- Publication date May 22, 2025
- Hitachi Astemo, Ltd.
- Junpei KUSUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE STRUCTURE, PACKAGE STRUCTURE, AND METHOD FOR FORMIN...
- Publication number 20250164709
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUILD-UP FILM AND PRE-PREG SUBSTRATES IN ISOLATION PACKAGES
- Publication number 20250167125
- Publication date May 22, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Sylvester ANKAMAH-KUSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES
- Publication number 20250157870
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-ON-INSULATOR DEVICE INCLUDING CARRIER STRUCTURE
- Publication number 20250157866
- Publication date May 15, 2025
- Micron Technology, Inc.
- Kamal M. KARDA
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the material or its electrical properties

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and device for providing through-openings in a substrate and...

Method for manufacturing semiconductor device, semiconductor device...

Flexible electronic device

Semiconductor devices with flexible spacer including a support stru...

Imaging apparatus and manufacturing method of the same

Reconstituted substrate structure and fabrication methods for heter...

Semiconductor package and semiconductor device

Selective use of different advanced interface bus with electronic c...

3D system integration

Robust mold integrated substrate

Package and manufacturing method of the same

Chip package and method of forming the same

Wiring structure and semiconductor module

Semiconductor module

Power substrate assembly with reduced warpage

Semiconductor package

Semiconductor package and method of forming thereof

Semiconductor device integration with an amorphous region

Semiconductor packages

Semiconductor package and manufacturing method thereof

Semiconductor device having an integrated device positioned within...

Method for forming a semiconductor device including forming a first...

Composite substrate and method of producing the composite substrate...

Secure semiconductor integration and method for making thereof

Logic drive based on standardized commodity programmable logic semi...

Package structure, RDL structure comprising redistribution layer ha...

Package structure and method

Semiconductor device including wiring substrate having multiple sig...

Interposers for microelectronic devices

Semiconductor device and method of forming micro interconnect struc...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURE WITH INTERPOSER DIES

ELECTRONIC DEVICE AND A METHOD FOR FORMING THE SAME

COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTURING COMPON...

SUBSTRATE FOR ELECTRONIC DEVICE

DIRECT BOND INTERCONNECT ARCHITECTURES FOR PACKAGING ASSEMBLIES

Semiconductor structure

RESIST TENTING AND PLATING IN CORE CAVITY FOR COMPONENT ATTACHMENT

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METAL CORE SUBSTRATE AND METHOD OF PRODUCING THE METAL CORE SUBSTRATE

SEMICONDUCTOR PACKAGING STRUCTURE WITH GRAPHITE SHEETS

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SILICON SUBSTRATE SEMICONDUCTOR PACKAGE WITH INTEGRATED STACK CAPAC...

RESIN COMPOSITION, PREPREG, LAMINATED BOARD, RESIN FILM, PRINTED WI...

POWER MODULE HAVING INTERCONNECTED BASE PLATE WITH MOLDED METAL AND...

METHOD OF FORMING PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDIS...

METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION TH...

NOVEL POWER ARCHITECTURE WITH DUAL CORE ADVANCE SUBSTRATE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND ELECTRIC POWER CONVERSION DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE...

Multi-Layered Metal Frame Power Package

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE

3D INTEGRATED CIRCUIT PACKAGE AND SUBSTRATE STRUCTURE THEREOF

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

POWER CONVERSION DEVICE

OPTICAL PACKAGE STRUCTURE, PACKAGE STRUCTURE, AND METHOD FOR FORMIN...

BUILD-UP FILM AND PRE-PREG SUBSTRATES IN ISOLATION PACKAGES

PACKAGE STRUCTURES

SILICON-ON-INSULATOR DEVICE INCLUDING CARRIER STRUCTURE