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H01L23/4924

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/4924characterised by the materials

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power module package baseplate with step recess design
- Patent number 12,131,981
- Issue date Oct 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yushuang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device
- Patent number 12,100,688
- Issue date Sep 24, 2024
- Rohm Co., Ltd.
- Kaito Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal substrates with structures formed therein and methods of maki...
- Patent number 12,087,670
- Issue date Sep 10, 2024
- LUX SEMICONDUCTORS, INC.
- Chad B. Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,375
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a chip carrier with a pad offset feature
- Patent number 11,984,392
- Issue date May 14, 2024
- Infineon Technologies AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in package with flip chip die over multi-layer heatsink stan...
- Patent number 11,942,391
- Issue date Mar 26, 2024
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with reinforced isolation
- Patent number 11,908,834
- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Vivek Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and production method thereof, and semiconduc...
- Patent number 11,901,341
- Issue date Feb 13, 2024
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering structure with groove portion and power module comprising...
- Patent number 11,862,537
- Issue date Jan 2, 2024
- Hyundai Motor Company
- Jun Hee Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor apparatus
- Patent number 11,848,245
- Issue date Dec 19, 2023
- Hitachi Astemo, Ltd.
- Hironori Nagasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core-shell particles for magnetic packaging
- Patent number 11,804,420
- Issue date Oct 31, 2023
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses exhibiting enhanced stress resistance and planarity, an...
- Patent number 11,769,738
- Issue date Sep 26, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package baseplate with step recess design
- Patent number 11,735,504
- Issue date Aug 22, 2023
- Semiconductor Components Industries, LLC
- Yushuang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with connecting member for electrode and metho...
- Patent number 11,721,612
- Issue date Aug 8, 2023
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing the same, and power...
- Patent number 11,587,797
- Issue date Feb 21, 2023
- Mitsubishi Electric Corporation
- Masayuki Mafune
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor sub-assembly and semiconductor power module
- Patent number 11,538,765
- Issue date Dec 27, 2022
- Hyundai Motor Company
- Hiyoshi Michiaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 11,410,895
- Issue date Aug 9, 2022
- NGK Spark Plug Co., Ltd.
- Yosuke Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including resin-insulated copper base plate an...
- Patent number 11,410,903
- Issue date Aug 9, 2022
- Mitsubishi Electric Corporation
- Shotaro Sakumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete power transistor package having solderless DBC to leadfram...
- Patent number 11,387,162
- Issue date Jul 12, 2022
- Littelfuse, Inc.
- Gi-Young Jeun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,380,610
- Issue date Jul 5, 2022
- MICRO MODULE TECHNOLOGY CO., LTD.
- Fumikazu Harazono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with reinforced isolation
- Patent number 11,329,025
- Issue date May 10, 2022
- Texas Instruments Incorporated
- Vivek Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,201,109
- Issue date Dec 14, 2021
- Corning Incorporated
- Mandakini Kanungo
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Semiconductor device
- Patent number 11,164,841
- Issue date Nov 2, 2021
- Denso Corporation
- Shingo Iwasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,152,294
- Issue date Oct 19, 2021
- Corning Incorporated
- Tian Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Package with component connected with carrier via spacer particles
- Patent number 11,094,619
- Issue date Aug 17, 2021
- Infineon Technologies AG
- Manfred Schindler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,081,412
- Issue date Aug 3, 2021
- Kabushiki Kaisha Toshiba
- Takenori Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses exhibiting enhanced stress resistance and planarity, an...
- Patent number 11,056,443
- Issue date Jul 6, 2021
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,043,465
- Issue date Jun 22, 2021
- Sumitomo Electric Industries, Ltd.
- Hiroshi Notsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting apparatus including sacrificial pattern and manufact...
- Patent number 11,037,902
- Issue date Jun 15, 2021
- Au Optronics Corporation
- Tsung-Tien Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING METAL SUBSTRATES WITH STRUCTURES FORMED THEREIN
- Publication number 20240404922
- Publication date Dec 5, 2024
- LUX SEMICONDUCTORS, INC.
- Chad B. MOORE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT (3DIC) SYSTEMS WITH A HEAT SPR...
- Publication number 20240387459
- Publication date Nov 21, 2024
- Microsoft Technology Licensing, LLC
- Haohua ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE
- Publication number 20240363575
- Publication date Oct 31, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jihwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240228264
- Publication date Jul 11, 2024
- STMicroelectronics International N.V.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
POWER MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240194581
- Publication date Jun 13, 2024
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN PACKAGE WITH FLIP CHIP DIE OVER MULTI-LAYER HEATSINK STAN...
- Publication number 20240178096
- Publication date May 30, 2024
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240178100
- Publication date May 30, 2024
- Mitsubishi Electric Corporation
- Naoki YOSHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240132340
- Publication date Apr 25, 2024
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF ASSEMBLING A SEMICONDUCTOR DEVICE
- Publication number 20240079283
- Publication date Mar 7, 2024
- NEXPERIA B.V.
- Vegneswary Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20240079384
- Publication date Mar 7, 2024
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240006256
- Publication date Jan 4, 2024
- Hitachi Power Semiconductor Device, Ltd.
- Kisho Ashida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE BASEPLATE WITH STEP RECESS DESIGN
- Publication number 20230369176
- Publication date Nov 16, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yushuang YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUSBAR WITH DIELECTRIC COATING
- Publication number 20230326834
- Publication date Oct 12, 2023
- Microchip Technology Caldicot Limited
- Piers Tremlett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230298974
- Publication date Sep 21, 2023
- ROHM CO., LTD.
- Maiko HATANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDED CAPACITORS
- Publication number 20230197767
- Publication date Jun 22, 2023
- Intel Corporation
- Changyok Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20230187404
- Publication date Jun 15, 2023
- WUXI LEAPERS SEMICONDUCTOR CO., LTD.
- Xiaoguang LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN PACKAGE WITH FLIP CHIP DIE OVER MULTI-LAYER HEATSINK STAN...
- Publication number 20230170275
- Publication date Jun 1, 2023
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230051389
- Publication date Feb 16, 2023
- Fuji Electric Co., Ltd.
- Naoki TAKIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CIRCUIT MODULE
- Publication number 20230052830
- Publication date Feb 16, 2023
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230032035
- Publication date Feb 2, 2023
- Mitsubishi Electric Corporation
- Hideyuki HATTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL MEMBER AND SEMICONDUCTOR DEVICE
- Publication number 20230007986
- Publication date Jan 12, 2023
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH REINFORCED ISOLATION
- Publication number 20220271008
- Publication date Aug 25, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220223568
- Publication date Jul 14, 2022
- Rohm Co., Ltd.
- Kaito INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE BASEPLATE WITH STEP RECESS DESIGN
- Publication number 20220157696
- Publication date May 19, 2022
- Semiconductor Components Industries, LLC
- Yushuang YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING STRUCTURE AND POWER MODULE COMPRISING THE SAME
- Publication number 20220044988
- Publication date Feb 10, 2022
- Hyundai Motor Company
- Jun Hee PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND PRODUCTION METHOD THEREOF, AND SEMICONDUC...
- Publication number 20210398950
- Publication date Dec 23, 2021
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210398881
- Publication date Dec 23, 2021
- Rohm Co., Ltd.
- Maiko HATANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20210327779
- Publication date Oct 21, 2021
- Mitsubishi Electric Corporation
- Shotaro SAKUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH REINFORCED ISOLATION
- Publication number 20210305207
- Publication date Sep 30, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR APPARATUS
- Publication number 20210280483
- Publication date Sep 9, 2021
- Hitachi Automotive Systems, Ltd.
- Hironori NAGASAKI
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power module package baseplate with step recess design

Hermetic metallized via with improved reliability

Semiconductor device

Metal substrates with structures formed therein and methods of maki...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor package having a chip carrier with a pad offset feature

System in package with flip chip die over multi-layer heatsink stan...

Multi-chip package with reinforced isolation

Semiconductor package and production method thereof, and semiconduc...

Soldering structure with groove portion and power module comprising...

Power semiconductor apparatus

Core-shell particles for magnetic packaging

Apparatuses exhibiting enhanced stress resistance and planarity, an...

Power module package baseplate with step recess design

Semiconductor device with connecting member for electrode and metho...

Semiconductor device, method for manufacturing the same, and power...

Semiconductor sub-assembly and semiconductor power module

Wiring board

Semiconductor device including resin-insulated copper base plate an...

Discrete power transistor package having solderless DBC to leadfram...

Semiconductor device and method of manufacturing semiconductor device

Multi-chip package with reinforced isolation

Hermetic metallized via with improved reliability

Semiconductor device

Hermetic metallized via with improved reliability

Package with component connected with carrier via spacer particles

Semiconductor device

Apparatuses exhibiting enhanced stress resistance and planarity, an...

Semiconductor device

Light-emitting apparatus including sacrificial pattern and manufact...

Patents Applicationslast 30 patents

METHOD OF MAKING METAL SUBSTRATES WITH STRUCTURES FORMED THEREIN

THREE-DIMENSIONAL INTEGRATED CIRCUIT (3DIC) SYSTEMS WITH A HEAT SPR...

FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

POWER MODULE AND MANUFACTURING METHOD THEREFOR

SYSTEM IN PACKAGE WITH FLIP CHIP DIE OVER MULTI-LAYER HEATSINK STAN...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF ASSEMBLING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

POWER MODULE PACKAGE BASEPLATE WITH STEP RECESS DESIGN

BUSBAR WITH DIELECTRIC COATING

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

HYBRID BONDED CAPACITORS

POWER SEMICONDUCTOR MODULE

SYSTEM IN PACKAGE WITH FLIP CHIP DIE OVER MULTI-LAYER HEATSINK STAN...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

POWER CIRCUIT MODULE

SEMICONDUCTOR MODULE

TERMINAL MEMBER AND SEMICONDUCTOR DEVICE

MULTI-CHIP PACKAGE WITH REINFORCED ISOLATION

SEMICONDUCTOR DEVICE

POWER MODULE PACKAGE BASEPLATE WITH STEP RECESS DESIGN

SOLDERING STRUCTURE AND POWER MODULE COMPRISING THE SAME

SEMICONDUCTOR PACKAGE AND PRODUCTION METHOD THEREOF, AND SEMICONDUC...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

MULTI-CHIP PACKAGE WITH REINFORCED ISOLATION

POWER SEMICONDUCTOR APPARATUS