characterised by the mechanical construction of the susceptor, stage or support

Industry

CPC
H01L21/68785

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/68785characterised by the mechanical construction of the susceptor, stage or support

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Substrate support and substrate processing apparatus
- Patent number 12,300,475
- Issue date May 13, 2025
- Tokyo Electron Limited
- Michishige Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for thermal control of devices in an electronics...
- Patent number 12,292,484
- Issue date May 6, 2025
- AEHR Test Systems
- Jovan Jovanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holder
- Patent number 12,288,707
- Issue date Apr 29, 2025
- Ebara Corporation
- Matsutaro Miyamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Coater cup deformation testing device and method of coater cup defo...
- Patent number 12,287,195
- Issue date Apr 29, 2025
- NANYA TECHNOLOGY CORPORATION
- Li-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sample holder
- Patent number 12,288,714
- Issue date Apr 29, 2025
- Kyocera Corporation
- Seiya Saisho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ejector pin device for chip packaging
- Patent number 12,272,589
- Issue date Apr 8, 2025
- CHIPMORE TECHNOLOGY CORPORATION LIMITED
- Chaochao Jin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate processing apparatus
- Patent number 12,272,590
- Issue date Apr 8, 2025
- Tokyo Electron Limited
- Junnosuke Taguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Friction stir welding in semiconductor manufacturing applications
- Patent number 12,272,591
- Issue date Apr 8, 2025
- Lam Research Corporation
- Nick Ray Linebarger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for treating substrate and method of coupling support unit
- Patent number 12,266,561
- Issue date Apr 1, 2025
- Semes Co., Ltd.
- Sang Min Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for thermal control of devices in electronics tester
- Patent number 12,265,136
- Issue date Apr 1, 2025
- AEHR Test Systems
- Jovan Jovanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method and processing apparatus
- Patent number 12,261,078
- Issue date Mar 25, 2025
- Tokyo Electron Limited
- Takuya Umise
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 12,249,533
- Issue date Mar 11, 2025
- Tokyo Electron Limited
- Yoshinori Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection and analysis of substrate support and pre-heat ring in a...
- Patent number 12,243,761
- Issue date Mar 4, 2025
- Applied Materials, Inc.
- Martin Jeffrey Salinas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate fixing device and electrostatic chuck
- Patent number 12,243,763
- Issue date Mar 4, 2025
- Shinko Electric Industries Co., Ltd.
- Masakuni Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for etching the periphery edge of a substrate
- Patent number 12,237,206
- Issue date Feb 25, 2025
- DEVICEENG CO., LTD
- Taek Youb Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate treating apparatus and filler member provided therein
- Patent number 12,234,555
- Issue date Feb 25, 2025
- Semes Co., Ltd.
- Jin Mo Jae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Level monitoring and active adjustment of a substrate support assembly
- Patent number 12,227,847
- Issue date Feb 18, 2025
- Applied Materials, Inc.
- James V. Santiago
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate heating apparatus and method for processing a substrate
- Patent number 12,225,634
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Taehong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,211,716
- Issue date Jan 28, 2025
- Semes Co., Ltd.
- Jaeseong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning chamber for metal oxide removal
- Patent number 12,211,737
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Load lock device
- Patent number 12,211,735
- Issue date Jan 28, 2025
- Canon Anelva Corporation
- Jun Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing chamber to accommodate parasitic plasma fo...
- Patent number 12,205,845
- Issue date Jan 21, 2025
- Applied Materials, Inc.
- Khokan Chandra Paul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate cleaning apparatus, substrate cleaning method, and non-tr...
- Patent number 12,202,016
- Issue date Jan 21, 2025
- Tokyo Electron Limited
- Yuki Ito
- B08 - CLEANING
Information Patent Grant
Vision-based wafer pre-alignment platform and alignment method
- Patent number 12,205,325
- Issue date Jan 21, 2025
- WUXI XIVI SCIENCE AND TECHNOLOGY CO., LTD.
- Minjie Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Batch curing chamber with gas distribution and individual pumping
- Patent number 12,203,171
- Issue date Jan 21, 2025
- Applied Materials, Inc.
- Adib Khan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process chamber
- Patent number 12,198,972
- Issue date Jan 14, 2025
- BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Yancheng Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing chamber, substrate processing system including...
- Patent number 12,191,190
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Yongmyung Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cover plate for covering the susceptor side facing the process cham...
- Patent number 12,180,590
- Issue date Dec 31, 2024
- Aixtron SE
- Benjamin David Wright
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Rotatable thermal processing chamber
- Patent number 12,176,242
- Issue date Dec 24, 2024
- Applied Materials, Inc.
- Wolfgang R. Aderhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and substrate bonding method
- Patent number 12,165,902
- Issue date Dec 10, 2024
- Nikon Corporation
- Hajime Mitsuishi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEATING APPARATUS AND PRETREMENT METHOD FOR WAFER
- Publication number 20250157835
- Publication date May 15, 2025
- HERMES-EPITEK CORPORATION
- Shang-Jr Gwo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-CARRIER STRUCTURE
- Publication number 20250154653
- Publication date May 15, 2025
- SGL CARBON SE
- Shane BRAUN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VACUUM HOLE CONNECTOR, SUBSTRATE SUPPORT, SUBSTRATE TREATMENT APPAR...
- Publication number 20250149374
- Publication date May 8, 2025
- Jae Oh BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORTING UNIT, APPARATUS FOR TREATING SUBSTRATE, AND ME...
- Publication number 20250146133
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Yeontae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND MANUFACTURING METHOD OF WAFER STAGE...
- Publication number 20250140532
- Publication date May 1, 2025
- Hitachi High-Tech Corporation
- Shintaro NAKATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT DEVICE FOR A REACTION CHAMBER OF AN EPITAXIAL REA...
- Publication number 20250140597
- Publication date May 1, 2025
- LPE S.P.A.
- Silvio Preti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVELY CONTROLLED WINDOW FOR EPITAXIAL DEPOSITION PROCESS TEMPERA...
- Publication number 20250132175
- Publication date Apr 24, 2025
- Applied Materials, Inc.
- Tetsuya ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20250132188
- Publication date Apr 24, 2025
- Hitachi High-Tech Corporation
- Ryota ISHIBASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES FOR RADIATIVE HEATING OF AN EDGE REGION OF A SEMICONDUC...
- Publication number 20250125165
- Publication date Apr 17, 2025
- LAM RESEARCH CORPORATION
- Sivananda Krishnan Kanakasabapathy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUSCEPTOR AND METHOD OF MANUFACTURING SAME
- Publication number 20250125184
- Publication date Apr 17, 2025
- MiCo Ceramics Ltd.
- Min-Ho JI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUSCEPTOR ASSEMBLY THERMAL BREAK AND METHODS FOR COOLING A SUSCEPTO...
- Publication number 20250125183
- Publication date Apr 17, 2025
- Applied Materials, Inc.
- Vijayabhaskara Venkatagiriyappa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING CHAMBER WITH RF RETURN PATH
- Publication number 20250118593
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Vellaichamy NAGAPPAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROSTATICALLY SECURED SUBSTRATE SUPPORT ASSEMBLY
- Publication number 20250118586
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Arvinder Manmohan Singh Chadha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPACT DYNAMIC LEVELING LIFT MECHANISM
- Publication number 20250115999
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Tuan Anh Nguyen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ANNEAL CHAMBER
- Publication number 20250118572
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Paul R. McHugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISM FOR FINE ADJUSTING AN ANGLE OF A SEMICONDUCTOR WAFER FIXTURE
- Publication number 20250112084
- Publication date Apr 3, 2025
- CHENG MEI INSTRUMENT TECHNOLOGY CO., LTD.
- Te-Chun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDED ESC WITH OUTER CERAMIC VACUUM ISOLATION RING FOR CRYOG...
- Publication number 20250112075
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- Alexander SULYMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR SUBSTRATE SUPPORT ASSEMBLY
- Publication number 20250105051
- Publication date Mar 27, 2025
- Applied Materials, Inc.
- Arvinder Manmohan Singh Chadha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING T...
- Publication number 20250105052
- Publication date Mar 27, 2025
- SEMES CO., LTD.
- Yong Jun BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHUCK PIN AND SUBSTRATE HOLDING DEVICE
- Publication number 20250105050
- Publication date Mar 27, 2025
- SCREEN Holdings Co., Ltd.
- Kazuma FUNAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL TERMINAL CONNECTOR, SUBSTRATE SUPPORT, SUBSTRATE TREATIN...
- Publication number 20250096496
- Publication date Mar 20, 2025
- Jae Oh BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POSITIONING DEVICE AND MOUNTING DEVICE USING SAME
- Publication number 20250096016
- Publication date Mar 20, 2025
- TORAY ENGINEERING CO., LTD.
- Kenji HAMAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20250087526
- Publication date Mar 13, 2025
- Kabushiki Kaisha Toshiba
- Shun HASEBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SWITCH FOR WAFER TEMPERATURE MODULATION
- Publication number 20250079234
- Publication date Mar 6, 2025
- ASM IP HOLDING B.V.
- Hang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE BONDING TOOL AND SEMICONDUCTOR PACKAGE FABRIC...
- Publication number 20250079232
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- TAEJAE PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUSCEPTOR
- Publication number 20250079233
- Publication date Mar 6, 2025
- MICO CERAMICS LTD.
- Mina CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SUPPORT TABLE AND RF ROD
- Publication number 20250079235
- Publication date Mar 6, 2025
- NGK Insulators, Ltd.
- Tomohiro HARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vacuum Wafer Chuck With Solid Diamond Pins
- Publication number 20250079226
- Publication date Mar 6, 2025
- II-VI Delaware, Inc.
- Jonathan Coppola
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI ZONE SPOT HEATING IN EPI
- Publication number 20250066918
- Publication date Feb 27, 2025
- Applied Materials, Inc.
- Shu-Kwan LAU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SCREWLESS SEMICONDUCTOR PROCESSING CHAMBERS
- Publication number 20250069944
- Publication date Feb 27, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Bo-Ru CHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

characterised by the mechanical construction of the susceptor, stage or support

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate support and substrate processing apparatus

Method and system for thermal control of devices in an electronics...

Substrate holder

Coater cup deformation testing device and method of coater cup defo...

Sample holder

Ejector pin device for chip packaging

Substrate processing apparatus

Friction stir welding in semiconductor manufacturing applications

Apparatus for treating substrate and method of coupling support unit

Method and system for thermal control of devices in electronics tester

Processing method and processing apparatus

Substrate processing apparatus

Detection and analysis of substrate support and pre-heat ring in a...

Substrate fixing device and electrostatic chuck

Device for etching the periphery edge of a substrate

Substrate treating apparatus and filler member provided therein

Level monitoring and active adjustment of a substrate support assembly

Substrate heating apparatus and method for processing a substrate

Substrate processing apparatus and substrate processing method

Cleaning chamber for metal oxide removal

Load lock device

Semiconductor processing chamber to accommodate parasitic plasma fo...

Substrate cleaning apparatus, substrate cleaning method, and non-tr...

Vision-based wafer pre-alignment platform and alignment method

Batch curing chamber with gas distribution and individual pumping

Process chamber

Substrate processing chamber, substrate processing system including...

Cover plate for covering the susceptor side facing the process cham...

Rotatable thermal processing chamber

Substrate bonding apparatus and substrate bonding method

Patents Applicationslast 30 patents

HEATING APPARATUS AND PRETREMENT METHOD FOR WAFER

SUBSTRATE-CARRIER STRUCTURE

VACUUM HOLE CONNECTOR, SUBSTRATE SUPPORT, SUBSTRATE TREATMENT APPAR...

SUBSTRATE SUPPORTING UNIT, APPARATUS FOR TREATING SUBSTRATE, AND ME...

PLASMA PROCESSING APPARATUS AND MANUFACTURING METHOD OF WAFER STAGE...

SUBSTRATE SUPPORT DEVICE FOR A REACTION CHAMBER OF AN EPITAXIAL REA...

ACTIVELY CONTROLLED WINDOW FOR EPITAXIAL DEPOSITION PROCESS TEMPERA...

PLASMA PROCESSING APPARATUS

APPARATUSES FOR RADIATIVE HEATING OF AN EDGE REGION OF A SEMICONDUC...

CERAMIC SUSCEPTOR AND METHOD OF MANUFACTURING SAME

SUSCEPTOR ASSEMBLY THERMAL BREAK AND METHODS FOR COOLING A SUSCEPTO...

PROCESSING CHAMBER WITH RF RETURN PATH

ELECTROSTATICALLY SECURED SUBSTRATE SUPPORT ASSEMBLY

COMPACT DYNAMIC LEVELING LIFT MECHANISM

ANNEAL CHAMBER

MECHANISM FOR FINE ADJUSTING AN ANGLE OF A SEMICONDUCTOR WAFER FIXTURE

METAL BONDED ESC WITH OUTER CERAMIC VACUUM ISOLATION RING FOR CRYOG...

MODULAR SUBSTRATE SUPPORT ASSEMBLY

SUBSTRATE SUPPORT UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING T...

CHUCK PIN AND SUBSTRATE HOLDING DEVICE

ELECTRICAL TERMINAL CONNECTOR, SUBSTRATE SUPPORT, SUBSTRATE TREATIN...

POSITIONING DEVICE AND MOUNTING DEVICE USING SAME

SEMICONDUCTOR MANUFACTURING APPARATUS

THERMAL SWITCH FOR WAFER TEMPERATURE MODULATION

SEMICONDUCTOR PACKAGE BONDING TOOL AND SEMICONDUCTOR PACKAGE FABRIC...

CERAMIC SUSCEPTOR

WAFER SUPPORT TABLE AND RF ROD

Vacuum Wafer Chuck With Solid Diamond Pins

MULTI ZONE SPOT HEATING IN EPI

SCREWLESS SEMICONDUCTOR PROCESSING CHAMBERS