characterised by the mechanical construction of the susceptor, stage or support

Industry

CPC
H01L21/68785

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/68785characterised by the mechanical construction of the susceptor, stage or support

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Substrate bonding apparatus and substrate bonding method
- Patent number 12,165,902
- Issue date Dec 10, 2024
- Nikon Corporation
- Hajime Mitsuishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for rotating substrates
- Patent number 12,165,907
- Issue date Dec 10, 2024
- Applied Materials, Inc.
- Giridhar Kamesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum processing apparatus and method of controlling vacuum proces...
- Patent number 12,165,908
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Kiyoshi Mori
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Multi zone spot heating in EPI
- Patent number 12,163,229
- Issue date Dec 10, 2024
- Applied Materials, Inc.
- Shu-Kwan Lau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Screwless semiconductor processing chambers
- Patent number 12,165,909
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Ru Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Susceptor for high-temperature use having shaft with low thermal co...
- Patent number 12,154,799
- Issue date Nov 26, 2024
- MiCo Ceramics Ltd.
- Jung Chul Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for etching the periphery edge of a substrate comprising sub...
- Patent number 12,148,634
- Issue date Nov 19, 2024
- DEVICEENG CO., LTD
- Taek Youb Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing equipment with high temperature resistant...
- Patent number 12,128,494
- Issue date Oct 29, 2024
- Watlow Electric Manufacturing Company
- Brent Elliot
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier device
- Patent number 12,131,941
- Issue date Oct 29, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Lei Zhao
- B08 - CLEANING
Information Patent Grant
Substrate drying device and method of drying substrate using the sa...
- Patent number 12,119,240
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Ansook Sul
- B08 - CLEANING
Information Patent Grant
Rotating biasable pedestal and electrostatic chuck in semiconductor...
- Patent number 12,112,972
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Qiwei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Susceptor arrangement of a CVD reactor
- Patent number 12,110,591
- Issue date Oct 8, 2024
- Aixtron SE
- Francisco Ruda Y Witt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-zone semiconductor substrate supports
- Patent number 12,112,971
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Ian Bensco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, substrate processing method, non-tr...
- Patent number 12,106,998
- Issue date Oct 1, 2024
- Kokusai Electric Corporation
- Naofumi Ohashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck
- Patent number 12,106,994
- Issue date Oct 1, 2024
- NGK Insulators, Ltd.
- Tatsuya Kuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and method for dechucking wafer in the...
- Patent number 12,106,942
- Issue date Oct 1, 2024
- Samsung Electronics Co., Ltd.
- Yi Rop Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Turbomolecular pump and cathode assembly for etching reactor
- Patent number 12,106,946
- Issue date Oct 1, 2024
- Lam Research Corporation
- Thorsten Lill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-zone azimuthal heater
- Patent number 12,100,603
- Issue date Sep 24, 2024
- Watlow Electric Manufacturing Company
- Kevin Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection mechanism and method for protecting wafer and pin
- Patent number 12,094,755
- Issue date Sep 17, 2024
- PIOTECH INC.
- Huaqiang Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer placement table
- Patent number 12,087,609
- Issue date Sep 10, 2024
- NGK Insulators, Ltd.
- Tatsuya Kuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Permanent secondary erosion containment for electrostatic chuck bonds
- Patent number 12,074,049
- Issue date Aug 27, 2024
- Lam Research Corporation
- Eric A. Pape
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Heat treatment method and heat treatment apparatus of light irradia...
- Patent number 12,057,352
- Issue date Aug 6, 2024
- SCREEN Holdings Co., Ltd.
- Takahiro Kitazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 12,042,813
- Issue date Jul 23, 2024
- SCREEN Holdings Co., Ltd.
- Hiroshi Abe
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Semiconductor manufacturing apparatus and wafer holding table for s...
- Patent number 12,046,488
- Issue date Jul 23, 2024
- Sumitomo Electric Industries, Ltd.
- Koichi Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and method for manufacturing mounting s...
- Patent number 12,033,886
- Issue date Jul 9, 2024
- Tokyo Electron Limited
- Yasuharu Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing holding device and holding device
- Patent number 12,027,406
- Issue date Jul 2, 2024
- NITERRA CO., LTD.
- Makoto Kuribayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detecting wafer status in a wafer chuck assembly
- Patent number 12,027,409
- Issue date Jul 2, 2024
- Lam Research Corporation
- Aaron Louis LaBrie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for joining quartz pieces and quartz electrodes and other de...
- Patent number 12,020,971
- Issue date Jun 25, 2024
- Watlow Electric Manufacturing Company
- Brent Elliot
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lift pin assembly
- Patent number 12,020,977
- Issue date Jun 25, 2024
- Applied Materials, Inc.
- Alexander Sulyman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for thermal control of devices in an electronics...
- Patent number 12,007,451
- Issue date Jun 11, 2024
- AEHR Test Systems
- Jovan Jovanovic
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
VERTICLE FURNACE FOR PROCESSING A PLURALITY OF SUBSTRATES AND METHO...
- Publication number 20240420971
- Publication date Dec 19, 2024
- ASM IP HOLDING B.V.
- Subir Parui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUSCEPTOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240412999
- Publication date Dec 12, 2024
- MICO CERAMICS LTD.
- Junghyun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DRYING DEVICE AND METHOD OF DRYING SUBSTRATE USING THE SAME
- Publication number 20240412984
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Ansook Sul
- B08 - CLEANING
Information Patent Application
MULTI-ZONE AZIMUTHAL HEATER
- Publication number 20240412988
- Publication date Dec 12, 2024
- WATLOW ELECTRIC MANUFACTURING COMPANY
- Kevin SMITH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR ALIGNING A WAFER TO A CHUCK
- Publication number 20240412992
- Publication date Dec 12, 2024
- KLA Corporation
- Jaime Poris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR CLAMPING A SUBSTRATE ON A MONO-POLAR ELECTROSTATIC CH...
- Publication number 20240404861
- Publication date Dec 5, 2024
- Applied Materials, Inc.
- SUSHIM KOSHTI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SOLID-STATE BONDING METHOD FOR THE MANUFACTURE OF SEMICONDUCTOR CHU...
- Publication number 20240404869
- Publication date Dec 5, 2024
- WATLOW ELECTRIC MANUFACTURING COMPANY
- Jason STEPHENS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDING WAFER HOLDER
- Publication number 20240404868
- Publication date Dec 5, 2024
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- Zhengting ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-LED DISPLAY MANUFACTURING APPARATUS
- Publication number 20240395577
- Publication date Nov 28, 2024
- LG ELECTRONICS INC.
- Junghun RHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF SUBSTRATE SUPPORT DEVICES USING INORGANIC DIELECTRIC...
- Publication number 20240395591
- Publication date Nov 28, 2024
- Applied Materials, Inc.
- Vijay D. Parkhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE GRAVITY COMPENSATOR FOR SEMICONDUCTOR EQUIPMENT
- Publication number 20240395596
- Publication date Nov 28, 2024
- ETEL S.A.
- Manish MITTAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCKS WITH HYBRID PUCKS TO IMPROVE THERMAL PERFORMAN...
- Publication number 20240387224
- Publication date Nov 21, 2024
- Applied Materials, Inc.
- Yogananda Sarode
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT APPARATUS AND SUBSTRATE PROCESSING APPARATUS HAVI...
- Publication number 20240387234
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- JUNHYUNG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CARRIER BORE HOLE PLUG
- Publication number 20240387236
- Publication date Nov 21, 2024
- SCHUNK XYCARB TECHNOLOGY B.V.
- Moritz WIPPERLING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLLET FOR PICKUP A SEMICONDUCTOR CHIP
- Publication number 20240387231
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Jungho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING CHAMBER FOR METAL OXIDE REMOVAL
- Publication number 20240371685
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLOCKABLE SUBSTRATE PROCESSING PEDESTAL FOR USE IN SEMICONDUCTOR FA...
- Publication number 20240371679
- Publication date Nov 7, 2024
- LAM RESEARCH CORPORATION
- Sky MULLENAUX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TURBOMOLECULAR PUMP AND CATHODE ASSEMBLY FOR ETCHING REACTOR
- Publication number 20240355596
- Publication date Oct 24, 2024
- LAM RESEARCH CORPORATION
- Thorsten Lill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIPPING APPARATUS
- Publication number 20240347361
- Publication date Oct 17, 2024
- ACM RESEARCH (SHANGHAI), INC.
- He Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSCEPTOR
- Publication number 20240347372
- Publication date Oct 17, 2024
- Applied Materials, Inc.
- Balakrishnam R. JAMPANA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESS SHUTTER ARRANGEMENT
- Publication number 20240347326
- Publication date Oct 17, 2024
- Evatec AG
- JÖRG KERSCHBAUMER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR CHANGING THE TEMPERATURE OF A WAFER
- Publication number 20240347352
- Publication date Oct 17, 2024
- METRYX LTD.
- Gregor Robert ELLIOTT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR HOLDING A PACKAGE SUBSTRATE WITH REDUCED WARPAGE
- Publication number 20240347373
- Publication date Oct 17, 2024
- STATS ChipPAC Pte Ltd.
- JongChan PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSCEPTOR FOR PROCESS CHAMBER
- Publication number 20240339352
- Publication date Oct 10, 2024
- Applied Materials, Inc.
- Zhepeng CONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATIC CONTROL OF SUBSTRATES
- Publication number 20240339341
- Publication date Oct 10, 2024
- Applied Materials, Inc.
- Mauro Cimino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER DEVICE FOR A HEATING SYSTEM FOR HEATING LARGE-AREA SUBSTRATE...
- Publication number 20240339354
- Publication date Oct 10, 2024
- SINGULUS TECHNOLOGIES AG
- Sergiy BORODIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING DEVICE, AND SEPARATING MEMBER
- Publication number 20240321604
- Publication date Sep 26, 2024
- KIOXIA Corporation
- Sho KAWADAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SHOWERHEAD WITH THERMAL CONTROL FOR DELIVERING RADICAL A...
- Publication number 20240318312
- Publication date Sep 26, 2024
- LAM RESEARCH CORPORATION
- Rachel E. BATZER
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
ADSORPTION MEMBER AND METHOD FOR PRODUCING SAME
- Publication number 20240321625
- Publication date Sep 26, 2024
- KYOCERA CORPORATION
- Masahiro HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING TOOL AND MOUNTING APPARATUS
- Publication number 20240321623
- Publication date Sep 26, 2024
- SHIBAURA MECHATRONICS CORPORATION
- Yoshihiro KUSUBE
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the mechanical construction of the susceptor, stage or support

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate bonding apparatus and substrate bonding method

Apparatus for rotating substrates

Vacuum processing apparatus and method of controlling vacuum proces...

Multi zone spot heating in EPI

Screwless semiconductor processing chambers

Susceptor for high-temperature use having shaft with low thermal co...

Device for etching the periphery edge of a substrate comprising sub...

Semiconductor processing equipment with high temperature resistant...

Carrier device

Substrate drying device and method of drying substrate using the sa...

Rotating biasable pedestal and electrostatic chuck in semiconductor...

Susceptor arrangement of a CVD reactor

Multi-zone semiconductor substrate supports

Substrate processing apparatus, substrate processing method, non-tr...

Electrostatic chuck

Plasma processing apparatus and method for dechucking wafer in the...

Turbomolecular pump and cathode assembly for etching reactor

Multi-zone azimuthal heater

Protection mechanism and method for protecting wafer and pin

Wafer placement table

Permanent secondary erosion containment for electrostatic chuck bonds

Heat treatment method and heat treatment apparatus of light irradia...

Substrate processing method and substrate processing apparatus

Semiconductor manufacturing apparatus and wafer holding table for s...

Plasma processing apparatus and method for manufacturing mounting s...

Method for manufacturing holding device and holding device

Detecting wafer status in a wafer chuck assembly

Method for joining quartz pieces and quartz electrodes and other de...

Lift pin assembly

Method and system for thermal control of devices in an electronics...

Patents Applicationslast 30 patents

VERTICLE FURNACE FOR PROCESSING A PLURALITY OF SUBSTRATES AND METHO...

CERAMIC SUSCEPTOR AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE DRYING DEVICE AND METHOD OF DRYING SUBSTRATE USING THE SAME

MULTI-ZONE AZIMUTHAL HEATER

SYSTEM AND METHOD FOR ALIGNING A WAFER TO A CHUCK

APPARATUS FOR CLAMPING A SUBSTRATE ON A MONO-POLAR ELECTROSTATIC CH...

SOLID-STATE BONDING METHOD FOR THE MANUFACTURE OF SEMICONDUCTOR CHU...

STANDING WAFER HOLDER

MICRO-LED DISPLAY MANUFACTURING APPARATUS

FABRICATION OF SUBSTRATE SUPPORT DEVICES USING INORGANIC DIELECTRIC...

PASSIVE GRAVITY COMPENSATOR FOR SEMICONDUCTOR EQUIPMENT

ELECTROSTATIC CHUCKS WITH HYBRID PUCKS TO IMPROVE THERMAL PERFORMAN...

SUBSTRATE SUPPORT APPARATUS AND SUBSTRATE PROCESSING APPARATUS HAVI...

SUBSTRATE CARRIER BORE HOLE PLUG

COLLET FOR PICKUP A SEMICONDUCTOR CHIP

CLEANING CHAMBER FOR METAL OXIDE REMOVAL

CLOCKABLE SUBSTRATE PROCESSING PEDESTAL FOR USE IN SEMICONDUCTOR FA...

TURBOMOLECULAR PUMP AND CATHODE ASSEMBLY FOR ETCHING REACTOR

FLIPPING APPARATUS

SUSCEPTOR

PROCESS SHUTTER ARRANGEMENT

DEVICE FOR CHANGING THE TEMPERATURE OF A WAFER

DEVICE FOR HOLDING A PACKAGE SUBSTRATE WITH REDUCED WARPAGE

SUSCEPTOR FOR PROCESS CHAMBER

AUTOMATIC CONTROL OF SUBSTRATES

SPACER DEVICE FOR A HEATING SYSTEM FOR HEATING LARGE-AREA SUBSTRATE...

SEMICONDUCTOR MANUFACTURING DEVICE, AND SEPARATING MEMBER

INTEGRATED SHOWERHEAD WITH THERMAL CONTROL FOR DELIVERING RADICAL A...

ADSORPTION MEMBER AND METHOD FOR PRODUCING SAME

MOUNTING TOOL AND MOUNTING APPARATUS