characterised by the mechanical construction of the susceptor, stage or support

Industry

CPC
H01L21/68785

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/68785characterised by the mechanical construction of the susceptor, stage or support

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wafer lift pin system
- Patent number 11,972,971
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support for chucking of mask for deposition processes
- Patent number 11,967,516
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Jrjyan Jerry Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing apparatus
- Patent number 11,967,511
- Issue date Apr 23, 2024
- Tokyo Electron Limited
- Akira Ishikawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Vented susceptor
- Patent number 11,961,756
- Issue date Apr 16, 2024
- ASM IP Holding B.V.
- Uday Kiran Rokkam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holding apparatus and substrate processing apparatus
- Patent number 11,961,757
- Issue date Apr 16, 2024
- SCREEN Holdings Co., Ltd.
- Ryo Muramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer configured to recondition a support surface of a wafer holdin...
- Patent number 11,955,368
- Issue date Apr 9, 2024
- Imec VZW
- Thomas Hantschel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding fixture
- Patent number 11,955,363
- Issue date Apr 9, 2024
- Rockley Photonics Limited
- Moshe Amit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad raising mechanism in wafer positioning pedestal for semiconduct...
- Patent number 11,955,366
- Issue date Apr 9, 2024
- Lam Research Corporation
- Paul Konkola
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Heater support kit for bevel etch chamber
- Patent number 11,948,790
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Tuan Anh Nguyen
- B08 - CLEANING
Information Patent Grant
Apparatus for growing a semiconductor wafer and associated manufact...
- Patent number 11,946,158
- Issue date Apr 2, 2024
- STMicroelectronics S.r.l.
- Ruggero Anzalone
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Workpiece placement apparatus and processing apparatus
- Patent number 11,942,357
- Issue date Mar 26, 2024
- Tokyo Electron Limited
- Yohei Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature control device
- Patent number 11,935,767
- Issue date Mar 19, 2024
- Kelk Ltd.
- Atsushi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic heater
- Patent number 11,937,345
- Issue date Mar 19, 2024
- MiCo Ceramics Ltd.
- Jung Chul Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatically clamped edge ring
- Patent number 11,935,776
- Issue date Mar 19, 2024
- Lam Research Corporation
- Christopher Kimball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cryogenic wafer testing system
- Patent number 11,927,621
- Issue date Mar 12, 2024
- High Precision Devices, Inc.
- Michael Snow
- G01 - MEASURING TESTING
Information Patent Grant
Substrate processing apparatus and stage
- Patent number 11,915,964
- Issue date Feb 27, 2024
- Tokyo Electron Limited
- Yuichiro Wagatsuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Article including inorganic compound and method of manufacturing ar...
- Patent number 11,911,877
- Issue date Feb 27, 2024
- Canon Kabushiki Kaisha
- Kanako Oshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-zone semiconductor substrate supports
- Patent number 11,915,950
- Issue date Feb 27, 2024
- Applied Materials, Inc.
- Mehmet Tugrul Samir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus
- Patent number 11,908,664
- Issue date Feb 20, 2024
- Tokyo Electron Limited
- Naohiko Okunishi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Light irradiation type heat treatment method and heat treatment app...
- Patent number 11,901,200
- Issue date Feb 13, 2024
- SCREEN Holdings Co., Ltd.
- Akitsugu Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single wafer processing environments with spatial separation
- Patent number 11,894,257
- Issue date Feb 6, 2024
- Applied Materials, Inc.
- Michael Rice
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate holding mechanism, substrate mounting method, and substra...
- Patent number 11,894,256
- Issue date Feb 6, 2024
- Tokyo Electron Limited
- Toshiaki Takahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Object table, a stage apparatus and a lithographic apparatus
- Patent number 11,880,144
- Issue date Jan 23, 2024
- ASML Netherlands B.V.
- Sander Jeroen Hermanussen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck with metal bond
- Patent number 11,881,423
- Issue date Jan 23, 2024
- Applied Materials, Inc.
- Vijay D. Parkhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature adjustment system
- Patent number 11,869,799
- Issue date Jan 9, 2024
- Tokyo Electron Limited
- Shin Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition apparatus
- Patent number 11,869,798
- Issue date Jan 9, 2024
- Tokyo Electron Limited
- Manabu Honma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrostatic chuck and substrate fixing device
- Patent number 11,862,501
- Issue date Jan 2, 2024
- Shinko Electric Industries Co., Ltd.
- Norio Shiraiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus with electronic heater powered by po...
- Patent number 11,862,489
- Issue date Jan 2, 2024
- Tokyo Electron Limited
- Satoshi Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate heat treatment apparatus
- Patent number 11,854,842
- Issue date Dec 26, 2023
- ACM RESEARCH (SHANGHAI), INC.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate stage, substrate processing apparatus, and temperature co...
- Patent number 11,854,843
- Issue date Dec 26, 2023
- Tokyo Electron Limited
- Hajime Tamura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DETECTION AND ANALYSIS OF SUBSTRATE SUPPORT AND PRE-HEAT RING IN A...
- Publication number 20240145281
- Publication date May 2, 2024
- Applied Materials, Inc.
- Martin Jeffrey SALINAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20240145277
- Publication date May 2, 2024
- EBARA CORPORATION
- Yosuke NAGASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OBJECT TABLE, A STAGE APPARATUS AND A LITHOGRAPHIC APPARATUS
- Publication number 20240142885
- Publication date May 2, 2024
- ASML NETHERLANDS B.V.
- Sander Jeroen HERMANUSSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PLACEMENT TABLE
- Publication number 20240136219
- Publication date Apr 25, 2024
- NGK Insulators, Ltd.
- Tatsuya KUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HOLDING MEMBER
- Publication number 20240128117
- Publication date Apr 18, 2024
- Niterra Co., Ltd.
- Kazuaki OOYACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ADJUSTING HEAT UNIFORMITY ON WAFER MOUNT AND METHOD OF MA...
- Publication number 20240120216
- Publication date Apr 11, 2024
- NGK Insulators, Ltd.
- Hiroya SUGIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING DEVICE
- Publication number 20240112929
- Publication date Apr 4, 2024
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Yoshikuni SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PROCESSING SUSCEPTOR
- Publication number 20240112945
- Publication date Apr 4, 2024
- Applied Materials, Inc.
- Anhthu NGO
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
WAFER CARRIER ASSEMBLY WITH IMPROVED TEMPERATURE UNIFORMITY
- Publication number 20240102166
- Publication date Mar 28, 2024
- VEECO INSTRUMENTS INC.
- Aniruddha Bagchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS FOR PROCESSING SUBSTRATE
- Publication number 20240105498
- Publication date Mar 28, 2024
- SEMES CO., LTD.
- Kyung Taek IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE WAFER PROCESSING ENVIRONMENTS WITH SPATIAL SEPARATION
- Publication number 20240096688
- Publication date Mar 21, 2024
- Applied Materials, Inc.
- Michael Robert Rice
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USIN...
- Publication number 20240096637
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Hyungsik KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOCUS RING, APPARATUS AND METHOD FOR PROCESSING SEMICONDUCTOR WAFER
- Publication number 20240096686
- Publication date Mar 21, 2024
- Hon Young Semiconductor Corporation
- Chia-Jen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND LEAK DETERMINATION METHOD FOR US...
- Publication number 20240087920
- Publication date Mar 14, 2024
- SCREEN Holdings Co., Ltd.
- Mao OMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORTING APPARATUS
- Publication number 20240079264
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Jonggu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PLACEMENT TABLE
- Publication number 20240079218
- Publication date Mar 7, 2024
- NGK Insulators, Ltd.
- Tatsuya KUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHUCK APPARATUS WITH AIR MEMBER AND METHOD OF FABRICATING A S...
- Publication number 20240063044
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Dong Hoon KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER RING DESIGNS FOR CONTROLLING DEPOSITION ON WAFER BEVEL/EDGE
- Publication number 20240055293
- Publication date Feb 15, 2024
- LAM RESEARCH CORPORATION
- Michael John Janicki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI ZONE SPOT HEATING IN EPI
- Publication number 20240044004
- Publication date Feb 8, 2024
- Applied Materials, Inc.
- Shu-Kwan LAU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STAGE, SUBSTRATE PROCESSING APPARATUS, AND TEMPERATURE CO...
- Publication number 20240047241
- Publication date Feb 8, 2024
- TOKYO ELECTRON LIMITED
- Hajime TAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CLEANING APPARATUS, SUBSTRATE CLEANING METHOD, AND NON-TR...
- Publication number 20240033786
- Publication date Feb 1, 2024
- TOKYO ELECTRON LIMITED
- Yuki ITO
- B08 - CLEANING
Information Patent Application
ATOMIC LAYER ETCHING (ALE) APPARATUS AND ALE METHOD BASED ON THE AP...
- Publication number 20240030038
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Seungmin Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAGE APPARATUS, EXPOSURE APPARATUS, INSPECTION APPARATUS, AND DEVI...
- Publication number 20240021463
- Publication date Jan 18, 2024
- Sumitomo Heavy Industries, Ltd.
- Tatsuya YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROTARY ELECTRICAL FEEDTHROUGH INTEGRATION FOR PROCESS CHAMBER
- Publication number 20240018646
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- ANANTHA SUBRAMANI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FOCUS RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND...
- Publication number 20240021417
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Hyungsik KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER MANUFACTURING APPARATUS
- Publication number 20240021464
- Publication date Jan 18, 2024
- DENSO CORPORATION
- Hiroaki FUJIBAYASHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FLAT SUSCEPTOR WITH GRID PATTERN AND VENTING GROOVES ON SURFACE THE...
- Publication number 20240014065
- Publication date Jan 11, 2024
- Applied Materials, Inc.
- Zhepeng CONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20240006226
- Publication date Jan 4, 2024
- NGK Insulators, Ltd.
- Mitsuru KOJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20240006194
- Publication date Jan 4, 2024
- NGK Insulators, Ltd.
- Mitsuru KOJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FIXING DEVICE
- Publication number 20230411182
- Publication date Dec 21, 2023
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the mechanical construction of the susceptor, stage or support

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer lift pin system

Substrate support for chucking of mask for deposition processes

Plasma processing apparatus

Vented susceptor

Substrate holding apparatus and substrate processing apparatus

Wafer configured to recondition a support surface of a wafer holdin...

Bonding fixture

Pad raising mechanism in wafer positioning pedestal for semiconduct...

Heater support kit for bevel etch chamber

Apparatus for growing a semiconductor wafer and associated manufact...

Workpiece placement apparatus and processing apparatus

Temperature control device

Ceramic heater

Electrostatically clamped edge ring

Cryogenic wafer testing system

Substrate processing apparatus and stage

Article including inorganic compound and method of manufacturing ar...

Multi-zone semiconductor substrate supports

Plasma processing apparatus

Light irradiation type heat treatment method and heat treatment app...

Single wafer processing environments with spatial separation

Substrate holding mechanism, substrate mounting method, and substra...

Object table, a stage apparatus and a lithographic apparatus

Electrostatic chuck with metal bond

Temperature adjustment system

Deposition apparatus

Electrostatic chuck and substrate fixing device

Substrate processing apparatus with electronic heater powered by po...

Substrate heat treatment apparatus

Substrate stage, substrate processing apparatus, and temperature co...

Patents Applicationslast 30 patents

DETECTION AND ANALYSIS OF SUBSTRATE SUPPORT AND PRE-HEAT RING IN A...

SEMICONDUCTOR MANUFACTURING APPARATUS

OBJECT TABLE, A STAGE APPARATUS AND A LITHOGRAPHIC APPARATUS

WAFER PLACEMENT TABLE

SUBSTRATE HOLDING MEMBER

METHOD OF ADJUSTING HEAT UNIFORMITY ON WAFER MOUNT AND METHOD OF MA...

PROCESSING DEVICE

THERMAL PROCESSING SUSCEPTOR

WAFER CARRIER ASSEMBLY WITH IMPROVED TEMPERATURE UNIFORMITY

APPARATUS FOR PROCESSING SUBSTRATE

SINGLE WAFER PROCESSING ENVIRONMENTS WITH SPATIAL SEPARATION

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USIN...

FOCUS RING, APPARATUS AND METHOD FOR PROCESSING SEMICONDUCTOR WAFER

SUBSTRATE PROCESSING APPARATUS AND LEAK DETERMINATION METHOD FOR US...

SUBSTRATE SUPPORTING APPARATUS

WAFER PLACEMENT TABLE

WAFER CHUCK APPARATUS WITH AIR MEMBER AND METHOD OF FABRICATING A S...

CARRIER RING DESIGNS FOR CONTROLLING DEPOSITION ON WAFER BEVEL/EDGE

MULTI ZONE SPOT HEATING IN EPI

SUBSTRATE STAGE, SUBSTRATE PROCESSING APPARATUS, AND TEMPERATURE CO...

SUBSTRATE CLEANING APPARATUS, SUBSTRATE CLEANING METHOD, AND NON-TR...

ATOMIC LAYER ETCHING (ALE) APPARATUS AND ALE METHOD BASED ON THE AP...

STAGE APPARATUS, EXPOSURE APPARATUS, INSPECTION APPARATUS, AND DEVI...

ROTARY ELECTRICAL FEEDTHROUGH INTEGRATION FOR PROCESS CHAMBER

FOCUS RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND...

SEMICONDUCTOR WAFER MANUFACTURING APPARATUS

FLAT SUSCEPTOR WITH GRID PATTERN AND VENTING GROOVES ON SURFACE THE...

MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS

MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS

SUBSTRATE FIXING DEVICE