characterised by the movement of the work or lapping tool

Industry

CPC
B24B37/07

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/07characterised by the movement of the work or lapping tool

Industries

Patents Grantslast 30 patents

Information Patent Grant
Planarization methods for packaging substrates
- Patent number 11,931,855
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Han-Wen Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,850,697
- Issue date Dec 26, 2023
- Tokyo Electron Limited
- Osamu Miyahara
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus, polishing head, and substrate proce...
- Patent number 11,787,006
- Issue date Oct 17, 2023
- Tokyo Electron Limited
- Toshimitsu Igata
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing semiconductor package
- Patent number 11,749,574
- Issue date Sep 5, 2023
- Nippon Electric Glass Co., Ltd.
- Hiroki Katayama
- B24 - GRINDING POLISHING
Information Patent Grant
Offset head-spindle for chemical mechanical polishing
- Patent number 11,389,925
- Issue date Jul 19, 2022
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for manufacturing display device
- Patent number 11,311,979
- Issue date Apr 26, 2022
- Samsung Display Co., Ltd.
- Junggun Nam
- B24 - GRINDING POLISHING
Information Patent Grant
Method for removing contamination from a chuck surface
- Patent number 10,792,778
- Issue date Oct 6, 2020
- M Cubed Technologies, Inc.
- Edward J. Gratrix
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Planarization processing device
- Patent number 10,770,301
- Issue date Sep 8, 2020
- TOHO ENGINEERING CO., LTD.
- Tatsutoshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing apparatus and pressing pad for pressing polishing tool
- Patent number 10,632,588
- Issue date Apr 28, 2020
- Ebara Corporation
- Masayuki Nakanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic polishing systems and methods of polishing brittle compo...
- Patent number 10,144,107
- Issue date Dec 4, 2018
- Apple Inc.
- Srikanth Kamireddi
- B24 - GRINDING POLISHING
Information Patent Grant
Sizing device, polishing apparatus, and polishing method
- Patent number 10,147,656
- Issue date Dec 4, 2018
- Shin-Etsu Handotai Co., Ltd.
- Shigeru Oba
- B24 - GRINDING POLISHING
Information Patent Grant
Method of adjusting tilt using magnetic erase width feedback
- Patent number 9,870,788
- Issue date Jan 16, 2018
- Western Digital (Fremont), LLC
- Leo Michael C. Miranda
- B24 - GRINDING POLISHING
Information Patent Grant
Grinder for grinding end face of fiber
- Patent number 9,757,839
- Issue date Sep 12, 2017
- Sunsea Telecommunications Co., Ltd.
- Qiyue Wang
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 9,403,255
- Issue date Aug 2, 2016
- Ebara Corporation
- Makoto Fukushima
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing workpieces and apparatus therefor
- Patent number 5,989,107
- Issue date Nov 23, 1999
- Ebara Corporation
- Noburu Shimizu
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
CONTROL OF CARRIER HEAD SWEEP AND PLATEN SHAPE
- Publication number 20240139906
- Publication date May 2, 2024
- Applied Materials, Inc.
- Jeonghoon Oh
- B24 - GRINDING POLISHING
Information Patent Application
SUPPORTING GLASS SUBSTRATE, LAMINATE, SEMICONDUCTOR PACKAGE, ELECTR...
- Publication number 20230352355
- Publication date Nov 2, 2023
- Nippon Electric Glass Co., Ltd.
- Hiroki KATAYAMA
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISHING APPARATUS, SUBSTRATE POLISHING SYSTEM INCLUDING...
- Publication number 20230131040
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Jaehyug LEE
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20220219284
- Publication date Jul 14, 2022
- SAMSUNG DISPLAY CO., LTD.
- Junggun NAM
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR POLISHING A SEMICONDUCTIOR WAFER
- Publication number 20220080549
- Publication date Mar 17, 2022
- Siltronic AG
- Alexander HEILMAIER
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, POLISHING HEAD, AND SUBSTRATE PROCE...
- Publication number 20210362285
- Publication date Nov 25, 2021
- TOKYO ELECTRON LIMITED
- Toshimitsu IGATA
- B24 - GRINDING POLISHING
Information Patent Application
SUPPORTING GLASS SUBSTRATE, LAMINATE, SEMICONDUCTOR PACKAGE, ELECTR...
- Publication number 20210358822
- Publication date Nov 18, 2021
- Nippon Electric Glass Co., Ltd.
- Hiroki KATAYAMA
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20210229236
- Publication date Jul 29, 2021
- SAMSUNG DISPLAY CO., LTD.
- Junggun NAM
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20210187691
- Publication date Jun 24, 2021
- TOKYO ELECTRON LIMITED
- Osamu Miyahara
- B24 - GRINDING POLISHING
Information Patent Application
PLANARIZATION METHODS FOR PACKAGING SUBSTRATES
- Publication number 20200391343
- Publication date Dec 17, 2020
- Applied Materials, Inc.
- Han-Wen CHEN
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20200298365
- Publication date Sep 24, 2020
- Kabushiki Kaisha Toshiba
- Ken Inazumi
- B24 - GRINDING POLISHING
Information Patent Application
SPIRAL AND CONCENTRIC MOVEMENT DESIGNED FOR CMP LOCATION SPECIFIC P...
- Publication number 20200282506
- Publication date Sep 10, 2020
- Applied Materials, Inc.
- Eric LAU
- B24 - GRINDING POLISHING
Information Patent Application
PLANARIZATION PROCESSING DEVICE
- Publication number 20180277380
- Publication date Sep 27, 2018
- Tatsutoshi SUZUKI
- B24 - GRINDING POLISHING
Information Patent Application
SPIRAL AND CONCENTRIC MOVEMENT DESIGNED FOR CMP LOCATION SPECIFIC P...
- Publication number 20180250788
- Publication date Sep 6, 2018
- Applied Materials, Inc.
- Eric LAU
- B24 - GRINDING POLISHING
Information Patent Application
SUPPORTING GLASS SUBSTRATE, LAMINATE, SEMICONDUCTOR PACKAGE, ELECTR...
- Publication number 20180226311
- Publication date Aug 9, 2018
- Nippon Electric Glass Co., Ltd.
- Hiroki KATAYAMA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND PRESSING PAD FOR PRESSING POLISHING TOOL
- Publication number 20180169820
- Publication date Jun 21, 2018
- EBARA CORPORATION
- Masayuki NAKANISHI
- B24 - GRINDING POLISHING
Information Patent Application
GRINDER FOR GRINDING END FACE OF FIBER
- Publication number 20170100816
- Publication date Apr 13, 2017
- SUNSEA TELECOMMUNICATIONS CO., LTD.
- Qiyue WANG
- B24 - GRINDING POLISHING
Information Patent Application
ULTRASONIC POLISHING SYSTEMS AND METHODS OF POLISHING BRITTLE COMPO...
- Publication number 20170087687
- Publication date Mar 30, 2017
- Apple Inc.
- Srikanth Kamireddi
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20130324012
- Publication date Dec 5, 2013
- Makoto FUKUSHIMA
- B24 - GRINDING POLISHING

characterised by the movement of the work or lapping tool

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Planarization methods for packaging substrates

Substrate processing apparatus and substrate processing method

Substrate processing apparatus, polishing head, and substrate proce...

Method of manufacturing semiconductor package

Offset head-spindle for chemical mechanical polishing

Apparatus and method for manufacturing display device

Method for removing contamination from a chuck surface

Planarization processing device

Polishing apparatus and pressing pad for pressing polishing tool

Ultrasonic polishing systems and methods of polishing brittle compo...

Sizing device, polishing apparatus, and polishing method

Method of adjusting tilt using magnetic erase width feedback

Grinder for grinding end face of fiber

Polishing apparatus and polishing method

Method for polishing workpieces and apparatus therefor

Patents Applicationslast 30 patents

CONTROL OF CARRIER HEAD SWEEP AND PLATEN SHAPE

SUPPORTING GLASS SUBSTRATE, LAMINATE, SEMICONDUCTOR PACKAGE, ELECTR...

SUBSTRATE POLISHING APPARATUS, SUBSTRATE POLISHING SYSTEM INCLUDING...

APPARATUS AND METHOD FOR MANUFACTURING DISPLAY DEVICE

METHOD FOR POLISHING A SEMICONDUCTIOR WAFER

SUBSTRATE PROCESSING APPARATUS, POLISHING HEAD, AND SUBSTRATE PROCE...

SUPPORTING GLASS SUBSTRATE, LAMINATE, SEMICONDUCTOR PACKAGE, ELECTR...

APPARATUS AND METHOD FOR MANUFACTURING DISPLAY DEVICE

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

PLANARIZATION METHODS FOR PACKAGING SUBSTRATES

POLISHING APPARATUS AND POLISHING METHOD

SPIRAL AND CONCENTRIC MOVEMENT DESIGNED FOR CMP LOCATION SPECIFIC P...

PLANARIZATION PROCESSING DEVICE

SPIRAL AND CONCENTRIC MOVEMENT DESIGNED FOR CMP LOCATION SPECIFIC P...

SUPPORTING GLASS SUBSTRATE, LAMINATE, SEMICONDUCTOR PACKAGE, ELECTR...

POLISHING APPARATUS AND PRESSING PAD FOR PRESSING POLISHING TOOL

GRINDER FOR GRINDING END FACE OF FIBER

ULTRASONIC POLISHING SYSTEMS AND METHODS OF POLISHING BRITTLE COMPO...

POLISHING APPARATUS AND POLISHING METHOD