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H01L23/3675

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/3675characterised by the shape of the housing

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packages with solder thermal interface materials...
- Patent number 12,272,614
- Issue date Apr 8, 2025
- Intel Corporation
- Amitesh Saha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal structure for semiconductor device and method of forming th...
- Patent number 12,272,613
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced base die heat path using through-silicon vias
- Patent number 12,266,589
- Issue date Apr 1, 2025
- Intel Corporation
- Weston Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for advanced thermal dissipation
- Patent number 12,266,587
- Issue date Apr 1, 2025
- STATS ChipPAC Pte. Ltd.
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,261,558
- Issue date Mar 25, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Module
- Patent number 12,255,151
- Issue date Mar 18, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,255,118
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooler and semiconductor apparatus
- Patent number 12,249,556
- Issue date Mar 11, 2025
- Fuji Electric Co., Ltd.
- Kensuke Matsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, assembly structure and method for manufacturing...
- Patent number 12,249,583
- Issue date Mar 11, 2025
- Advanced Semiconductor Engineering, Inc.
- Syu-Tang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal contacts at periphery of integrated circuit packages
- Patent number 12,249,553
- Issue date Mar 11, 2025
- Intel Corporation
- Sonja Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic device assemblies having an electrically insulatin...
- Patent number 12,249,554
- Issue date Mar 11, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages with integral heat spreaders
- Patent number 12,243,799
- Issue date Mar 4, 2025
- NAVITAS SEMICONDUCTOR LIMITED
- Charles Bailley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with lid and method for forming the same
- Patent number 12,243,800
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure to control the solder thickness for double sid...
- Patent number 12,243,845
- Issue date Mar 4, 2025
- Hyundai Motor Company
- Tae Hwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Motor controller heat dissipating systems and methods
- Patent number 12,245,408
- Issue date Mar 4, 2025
- Lyft, Inc.
- Adam Christopher Bender
- B60 - VEHICLES IN GENERAL
Information Patent Grant
3D stack of split graphics processing logic dies
- Patent number 12,243,797
- Issue date Mar 4, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,243,798
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Jae-Min Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having topside power delivery structures
- Patent number 12,243,828
- Issue date Mar 4, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including wiring substrate having multiple sig...
- Patent number 12,237,254
- Issue date Feb 25, 2025
- Renesas Electronics Corporation
- Keita Tsuchiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and methods of manufacturing the same
- Patent number 12,237,277
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adaptive structure for thermal regulation and optimization
- Patent number 12,224,223
- Issue date Feb 11, 2025
- Raytheon Company
- Edward L. Hieb
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Systems and methods for low inductance phase switch for inverter fo...
- Patent number 12,225,696
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for adaptive gate driver for inverter for elect...
- Patent number 12,220,992
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Venturi-effect heat-transfer device
- Patent number 12,218,028
- Issue date Feb 4, 2025
- SAFRAN
- Toni Youssef
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic device
- Patent number 12,218,025
- Issue date Feb 4, 2025
- Denso Corporation
- Syuhei Miyachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for heat dissipation
- Patent number 12,218,026
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,214,677
- Issue date Feb 4, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Integration of power and optics through cold plates for delivery to...
- Patent number 12,210,199
- Issue date Jan 28, 2025
- Cisco Technology, Inc.
- Joel Richard Goergen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including monolithic silicon struct...
- Patent number 12,205,865
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with solder array thermal interface materia...
- Patent number 12,205,915
- Issue date Jan 21, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Packaging electronic device with liquid thermal interface material
- Publication number 20250118618
- Publication date Apr 10, 2025
- Marvell Asia Pte Ltd.
- Janak Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR IMPROVING EMBEDDED SUBSTRATE THERMALS
- Publication number 20250112113
- Publication date Apr 3, 2025
- ADVANCED MICRO DEVICES, INC.
- Sriram Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PANEL LEVEL PACKAGING STRUCTURE AND MANUFACTURING METHOD
- Publication number 20250112111
- Publication date Apr 3, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR THERMAL TESTING WITHIN ELECTRONIC COMPONE...
- Publication number 20250110174
- Publication date Apr 3, 2025
- QUALCOMM Incorporated
- Palkesh JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR THERMAL PLUGS IN A PHOTONIC INTEGRATED CIRCUIT DIE
- Publication number 20250110301
- Publication date Apr 3, 2025
- Intel Corporation
- Saeed Fathololoumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED FLIP CHIP BALL GRID ARRAY PACKAGE WITH IMPROVED...
- Publication number 20250112110
- Publication date Apr 3, 2025
- STMicroelectronics International N.V.
- Florian PERMINJAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A CIRCUIT ARRANGEMENT FOR AN ELECTRIC MACHINE,...
- Publication number 20250112214
- Publication date Apr 3, 2025
- Audi AG
- Daniel RUPPERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE HAVING HEAT DISSIPATION STRUCTURE AND MANUFACTURING ME...
- Publication number 20250105087
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Chunyan RUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH INTEGRAL SEAL
- Publication number 20250105112
- Publication date Mar 27, 2025
- Navitas Semiconductor Limited
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20250105086
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yen Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY MODULE WITH HIGH HEAT DISSIPATION CAPABILITY AND HIGH...
- Publication number 20250096212
- Publication date Mar 20, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Qingdong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...
- Publication number 20250096178
- Publication date Mar 20, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, WIRELESS COMMUNICATION DEVICE, AND METHOD FOR...
- Publication number 20250096180
- Publication date Mar 20, 2025
- Fujitsu Limited
- Shirou OZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A COOLING ARRANGEMENT AND COOLING ARRANGEME...
- Publication number 20250096065
- Publication date Mar 20, 2025
- MIBA SINTER AUSTRIA GMBH
- Manuel Pohn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND SEMICONDUCTOR STORAGE UNIT
- Publication number 20250098068
- Publication date Mar 20, 2025
- KIOXIA Corporation
- Kiyohito NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250096196
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR NON-OVERLAP ENFORCEMENT FOR INVERTER FOR EL...
- Publication number 20250089224
- Publication date Mar 13, 2025
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Application
MECHANICAL MITIGATION OF NEUTRON SEE
- Publication number 20250087595
- Publication date Mar 13, 2025
- Rockwell Collins, Inc.
- Eric N. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087637
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250087549
- Publication date Mar 13, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Yu Jin JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250087550
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...
- Publication number 20250087553
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079254
- Publication date Mar 6, 2025
- Siliconware Precision Industries Co., Ltd.
- Po-Yuan SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250079387
- Publication date Mar 6, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Hui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND HEAT DISSIPATION STRUCTURE THEREOF
- Publication number 20250079255
- Publication date Mar 6, 2025
- Siliconware Precision Industries Co., Ltd.
- Wei-Jhen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SPREADER
- Publication number 20250069978
- Publication date Feb 27, 2025
- SK Hynix NAND Product Solutions Corp. (dba Solidigm)
- Hardeep Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250069979
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Eunseok CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250069980
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER
- Publication number 20250070032
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Jong-youn Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062282
- Publication date Feb 20, 2025
- DENSO CORPORATION
- SHINGO TSUCHIMOCHI
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the shape of the housing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit packages with solder thermal interface materials...

Thermal structure for semiconductor device and method of forming th...

Enhanced base die heat path using through-silicon vias

Semiconductor device and method for advanced thermal dissipation

Systems and methods for cooling system and power module for inverte...

Module

Package structure and method of fabricating the same

Cooler and semiconductor apparatus

Package structure, assembly structure and method for manufacturing...

Thermal contacts at periphery of integrated circuit packages

Power electronic device assemblies having an electrically insulatin...

Electronic packages with integral heat spreaders

Package structure with lid and method for forming the same

Method and structure to control the solder thickness for double sid...

Motor controller heat dissipating systems and methods

3D stack of split graphics processing logic dies

Semiconductor device and method of fabricating the same

Microelectronic assemblies having topside power delivery structures

Semiconductor device including wiring substrate having multiple sig...

Package structure and methods of manufacturing the same

Adaptive structure for thermal regulation and optimization

Systems and methods for low inductance phase switch for inverter fo...

Systems and methods for adaptive gate driver for inverter for elect...

Venturi-effect heat-transfer device

Electronic device

Package structure for heat dissipation

Systems and methods for integrated gate driver for inverter for ele...

Integration of power and optics through cold plates for delivery to...

Semiconductor device assemblies including monolithic silicon struct...

Microelectronic package with solder array thermal interface materia...

Patents Applicationslast 30 patents

Packaging electronic device with liquid thermal interface material

SYSTEMS AND METHODS FOR IMPROVING EMBEDDED SUBSTRATE THERMALS

FAN-OUT PANEL LEVEL PACKAGING STRUCTURE AND MANUFACTURING METHOD

APPARATUS AND METHODS FOR THERMAL TESTING WITHIN ELECTRONIC COMPONE...

TECHNOLOGIES FOR THERMAL PLUGS IN A PHOTONIC INTEGRATED CIRCUIT DIE

THERMALLY ENHANCED FLIP CHIP BALL GRID ARRAY PACKAGE WITH IMPROVED...

METHOD FOR PRODUCING A CIRCUIT ARRANGEMENT FOR AN ELECTRIC MACHINE,...

CHIP PACKAGE HAVING HEAT DISSIPATION STRUCTURE AND MANUFACTURING ME...

ELECTRONIC PACKAGE WITH INTEGRAL SEAL

Integrated Circuit Packages and Methods of Forming the Same

POWER SUPPLY MODULE WITH HIGH HEAT DISSIPATION CAPABILITY AND HIGH...

MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...

SEMICONDUCTOR DEVICE, WIRELESS COMMUNICATION DEVICE, AND METHOD FOR...

METHOD OF MANUFACTURING A COOLING ARRANGEMENT AND COOLING ARRANGEME...

SEMICONDUCTOR STORAGE DEVICE AND SEMICONDUCTOR STORAGE UNIT

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

SYSTEMS AND METHODS FOR NON-OVERLAP ENFORCEMENT FOR INVERTER FOR EL...

MECHANICAL MITIGATION OF NEUTRON SEE

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

POWER MODULE AND POWER CONVERSION APPARATUS

ELECTRONIC PACKAGE AND HEAT DISSIPATION STRUCTURE THEREOF

THERMAL SPREADER

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER

SEMICONDUCTOR DEVICE