characterised by the shape of the housing

Industry

CPC
H01L23/3675

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3675characterised by the shape of the housing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Heat dissipation plate and semiconductor device
- Patent number 11,973,000
- Issue date Apr 30, 2024
- Shinko Electric Industries Co., Ltd.
- Takuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coplanar control for film-type thermal interface
- Patent number 11,973,005
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,973,001
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 11,972,995
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Dahee Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures having underfills
- Patent number 11,967,581
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous packaging integration of photonic and electronic elem...
- Patent number 11,966,090
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Stefan Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional IC package with thermal enhancement
- Patent number 11,967,538
- Issue date Apr 23, 2024
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,961,779
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with nanotube particles for enhanced performance and met...
- Patent number 11,961,781
- Issue date Apr 16, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat distribution device with flow channels
- Patent number 11,955,400
- Issue date Apr 9, 2024
- Google LLC
- Xu Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,955,401
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) package with cantilever multi-chip module (...
- Patent number 11,948,855
- Issue date Apr 2, 2024
- Rockwell Collins, Inc.
- Bret W. Simon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-power die heat sink
- Patent number 11,948,853
- Issue date Apr 2, 2024
- QUALCOMM Technologies Incorporated
- Jose Moreira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,942,439
- Issue date Mar 26, 2024
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Progressive heatsink
- Patent number 11,937,403
- Issue date Mar 19, 2024
- Lumentum Operations LLC
- Roozbeh Ahmadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-power die heat sink with vertical heat path
- Patent number 11,929,299
- Issue date Mar 12, 2024
- QUALCOMM Incorporated
- Jose Moreira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and electronic device
- Patent number 11,929,301
- Issue date Mar 12, 2024
- NGK Electronics Devices, Inc.
- Naoya Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,929,318
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed heat spreader structures and methods of providing same
- Patent number 11,923,268
- Issue date Mar 5, 2024
- Intel Corporation
- Jesus Gerardo Reyes Schuldes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co-packaged optical module
- Patent number 11,923,269
- Issue date Mar 5, 2024
- International Business Machines Corporation
- Mark D. Schultz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF device without silicon handle substrate for enhanced thermal and...
- Patent number 11,923,313
- Issue date Mar 5, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,923,259
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure with lid
- Patent number 11,915,992
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having first heat spreader and second heat spr...
- Patent number 11,915,991
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material having different thicknesses in packages
- Patent number 11,916,023
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of power and optics through cold plates for delivery to...
- Patent number 11,906,799
- Issue date Feb 20, 2024
- Cisco Technology, Inc.
- Joel Richard Goergen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, metal sheet for use in a semiconductor packa...
- Patent number 11,901,257
- Issue date Feb 13, 2024
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated heat distribution and manufact...
- Patent number 11,901,343
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips (SoIC) and semiconductor structures with...
- Patent number 11,894,309
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic module with enhanced thermal and electrical perfor...
- Patent number 11,894,352
- Issue date Feb 6, 2024
- RENESAS ELECTRONICS AMERICA INC.
- Sri Ganesh A Tharumalingam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL MODULE AND METHOD OF MANUFACTURING AN ELECTRICAL MODULE
- Publication number 20240145323
- Publication date May 2, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH METALLIC HEAT SPREADER
- Publication number 20240145334
- Publication date May 2, 2024
- Monolithic Power Systems, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH A THERMALLY-CONDUCTIVE CHANNEL
- Publication number 20240145337
- Publication date May 2, 2024
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD F...
- Publication number 20240136245
- Publication date Apr 25, 2024
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER
- Publication number 20240136247
- Publication date Apr 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Liangbiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS MODULE
- Publication number 20240136248
- Publication date Apr 25, 2024
- SAFRAN ELECTRICAL & POWER
- Benoit Michaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240136246
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE
- Publication number 20240138052
- Publication date Apr 25, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240128173
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Ji-Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128174
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128147
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sey-Ping SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING
- Publication number 20240128150
- Publication date Apr 18, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING INTERFACE REGION FOR A SEMICONDUCTOR DIE PACKAGE
- Publication number 20240128149
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240128148
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH LID
- Publication number 20240120294
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240120252
- Publication date Apr 11, 2024
- RENESAS ELECTRONICS CORPORATION
- Nobuhiro KINOSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240113003
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- Yun Seok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER LEADFRAME PACKAGE WITH REDUCED SOLDER VOIDS
- Publication number 20240113064
- Publication date Apr 4, 2024
- STMICROELECTRONICS, INC.
- Jefferson Sismundo TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR AN INTERLOCKING FEATURE ON A POWER MODULE
- Publication number 20240107718
- Publication date Mar 28, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Edward Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Water Cooling System for Semiconductor Package
- Publication number 20240105550
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Graphene-Coated Core Emb...
- Publication number 20240096736
- Publication date Mar 21, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME SPACER FOR DOUBLE-SIDED POWER MODULE
- Publication number 20240096734
- Publication date Mar 21, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tzu-Hsuan CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING
- Publication number 20240096732
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20240098930
- Publication date Mar 21, 2024
- KIOXIA Corporation
- Keishi SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240096733
- Publication date Mar 21, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF POWER AND OPTICS THROUGH COLD PLATES FOR DELIVERY TO...
- Publication number 20240085646
- Publication date Mar 14, 2024
- Cisco Technology, Inc.
- Joel Richard Goergen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240087903
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240079393
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Youngdeuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE WITH HYBRID CORE STRUCTURE AND METH...
- Publication number 20240079303
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...
- Publication number 20240071974
- Publication date Feb 29, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the shape of the housing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heat dissipation plate and semiconductor device

Coplanar control for film-type thermal interface

Semiconductor device and method of manufacture

Semiconductor package and method of manufacturing semiconductor pac...

Package structures having underfills

Heterogeneous packaging integration of photonic and electronic elem...

Three dimensional IC package with thermal enhancement

3DIC packaging with hot spot thermal management features

RF devices with nanotube particles for enhanced performance and met...

Heat distribution device with flow channels

Package structure

Integrated circuit (IC) package with cantilever multi-chip module (...

High-power die heat sink

Semiconductor package structure

Progressive heatsink

High-power die heat sink with vertical heat path

Package and electronic device

Package structure and method of forming the same

Printed heat spreader structures and methods of providing same

Co-packaged optical module

RF device without silicon handle substrate for enhanced thermal and...

Package structure and method of manufacturing the same

Method for forming package structure with lid

Semiconductor device having first heat spreader and second heat spr...

Thermal interface material having different thicknesses in packages

Integration of power and optics through cold plates for delivery to...

Semiconductor package, metal sheet for use in a semiconductor packa...

Semiconductor device with integrated heat distribution and manufact...

System on integrated chips (SoIC) and semiconductor structures with...

Power electronic module with enhanced thermal and electrical perfor...

Patents Applicationslast 30 patents

ELECTRICAL MODULE AND METHOD OF MANUFACTURING AN ELECTRICAL MODULE

POWER MODULE WITH METALLIC HEAT SPREADER

SEMICONDUCTOR DEVICE ASSEMBLY WITH A THERMALLY-CONDUCTIVE CHANNEL

THERMALLY CONDUCTIVE SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD F...

STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER

POWER ELECTRONICS MODULE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CIRCUIT MODULE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING

COOLING INTERFACE REGION FOR A SEMICONDUCTOR DIE PACKAGE

Integrated Circuit Packages and Methods of Forming the Same

CHIP PACKAGE WITH LID

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

POWER LEADFRAME PACKAGE WITH REDUCED SOLDER VOIDS

SYSTEMS AND METHODS FOR AN INTERLOCKING FEATURE ON A POWER MODULE

Water Cooling System for Semiconductor Package

Semiconductor Device and Method of Forming Graphene-Coated Core Emb...

LEADFRAME SPACER FOR DOUBLE-SIDED POWER MODULE

SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING

SEMICONDUCTOR STORAGE DEVICE

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

INTEGRATION OF POWER AND OPTICS THROUGH COLD PLATES FOR DELIVERY TO...

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE SUBSTRATE WITH HYBRID CORE STRUCTURE AND METH...

SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...