characterised by the shape of the housing

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CPC
H01L23/3675

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3675characterised by the shape of the housing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Adaptive structure for thermal regulation and optimization
- Patent number 12,224,223
- Issue date Feb 11, 2025
- Raytheon Company
- Edward L. Hieb
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Systems and methods for low inductance phase switch for inverter fo...
- Patent number 12,225,696
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for adaptive gate driver for inverter for elect...
- Patent number 12,220,992
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Venturi-effect heat-transfer device
- Patent number 12,218,028
- Issue date Feb 4, 2025
- SAFRAN
- Toni Youssef
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic device
- Patent number 12,218,025
- Issue date Feb 4, 2025
- Denso Corporation
- Syuhei Miyachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for heat dissipation
- Patent number 12,218,026
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,214,677
- Issue date Feb 4, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Integration of power and optics through cold plates for delivery to...
- Patent number 12,210,199
- Issue date Jan 28, 2025
- Cisco Technology, Inc.
- Joel Richard Goergen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including monolithic silicon struct...
- Patent number 12,205,865
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with solder array thermal interface materia...
- Patent number 12,205,915
- Issue date Jan 21, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package structures including redistribution layers
- Patent number 12,199,065
- Issue date Jan 14, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for non-overlap enforcement for inverter for el...
- Patent number 12,194,870
- Issue date Jan 14, 2025
- Borg Warner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Packaging stacked substrates and an integrated circuit die using a...
- Patent number 12,199,003
- Issue date Jan 14, 2025
- MARVELL ASIA PTE. LTD.
- Luke England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer structure containing embedded silicon-less link chiplet
- Patent number 12,199,025
- Issue date Jan 14, 2025
- Chengdu ECHINT Technology Co., Ltd.
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages with integral heat spreaders
- Patent number 12,199,004
- Issue date Jan 14, 2025
- NAVITAS SEMICONDUCTOR LIMITED
- Charles Bailley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,191,224
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,191,279
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crystal, semiconductor element and semiconductor device
- Patent number 12,191,372
- Issue date Jan 7, 2025
- FLOSFIA INC.
- Ryohei Kanno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board module
- Patent number 12,193,143
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Tatsuya Hosotani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package with dummy MIM capacitor die
- Patent number 12,183,723
- Issue date Dec 31, 2024
- Mediatek Inc.
- Yao-Chun Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,651
- Issue date Dec 31, 2024
- Amkor Technology Japan, Inc.
- Masao Hirobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with enhanced thermal dissipation and method f...
- Patent number 12,183,655
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for single channel fault encoding for inverter...
- Patent number 12,179,610
- Issue date Dec 31, 2024
- Borg Warner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Heat extraction path from a laser die using a highly conductive the...
- Patent number 12,183,650
- Issue date Dec 31, 2024
- Intel Corporation
- Aditi Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive sheet and method of manufacturing semiconducto...
- Patent number 12,183,656
- Issue date Dec 31, 2024
- Resonac Corporation
- Mika Kobune
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, method for manufacturing same, and semiconduc...
- Patent number 12,183,713
- Issue date Dec 31, 2024
- ULTRAMEMORY, INC.
- Fumitake Okutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating substrate and power module using the same
- Patent number 12,183,654
- Issue date Dec 31, 2024
- Hyundai Motor Company
- Hyeon Uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive thermal-control system of an electronic speaker device and...
- Patent number 12,176,260
- Issue date Dec 24, 2024
- Google LLC
- Ihab A. Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package structure
- Patent number 12,176,261
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,176,262
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Cho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE HAVING DAM STRUCTURE
- Publication number 20250054824
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PHASE SWITCH TIMING CONTROLLER FOR INVERTER...
- Publication number 20250056773
- Publication date Feb 13, 2025
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRONIC PACKAGE AND HEAT DISSIPATION STRUCTURE THEREOF
- Publication number 20250046670
- Publication date Feb 6, 2025
- Siliconware Precision Industries Co., Ltd.
- Wei-Jhen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS
- Publication number 20250046745
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Young Lyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20250046671
- Publication date Feb 6, 2025
- Fuji Electric Co., Ltd.
- Koji OSAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250046672
- Publication date Feb 6, 2025
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE, SEMICONDUCTOR STRUCTURE, AND FABRICATING...
- Publication number 20250038063
- Publication date Jan 30, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xin Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR INTEGRATED UNIT AND POWER CONVERTER CIRCUIT STR...
- Publication number 20250038099
- Publication date Jan 30, 2025
- CAMBRIDGE INTEGRATION LTD
- Ameer Hussein Abd JANABI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY MODULE
- Publication number 20250038157
- Publication date Jan 30, 2025
- Murata Manufacturing Co., Ltd.
- Takami MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liquid Metal Packaging Structure For Chip Heat Dissipation
- Publication number 20250038065
- Publication date Jan 30, 2025
- YUNNAN ZHONGXUAN LIQUID METAL TECHNOLOGY CO.,LTD
- Changli CAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK
- Publication number 20250040028
- Publication date Jan 30, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Patrick LENHARDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT APPARATUS AND CIRCUIT-INTEGRATED MOTOR
- Publication number 20250029889
- Publication date Jan 23, 2025
- Mikuni Corporation
- Yuki KONNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE AND METHOD OF MAKING
- Publication number 20250029929
- Publication date Jan 23, 2025
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE STRUCTURE
- Publication number 20250022767
- Publication date Jan 16, 2025
- SDP Global (China) Co., Ltd.
- TIAN-XUN LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250014963
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION AND PROTECTION OF COMPUTING COMPONENTS FROM LIQUID IMMERS...
- Publication number 20250008637
- Publication date Jan 2, 2025
- Casey Jamesen Carte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH DIRECTIONAL LOCKING STRUCTURE
- Publication number 20250006602
- Publication date Jan 2, 2025
- Tesla, Inc.
- William Thomas Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVING CONDUCTIVE MATERIAL FROM A PEDESTAL OF A SEMICONDUCTOR LID...
- Publication number 20250006496
- Publication date Jan 2, 2025
- ADVANCED MICRO DEVICES, INC.
- CHIA CHUN MIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS L...
- Publication number 20250006569
- Publication date Jan 2, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTER HAVING SEAL MEMBER BETWEEN POWER SEMI-CONDUCTOR AND INVERT...
- Publication number 20250007363
- Publication date Jan 2, 2025
- American Axle & Manufacturing, Inc.
- Christopher D. Pump
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIP MODULE
- Publication number 20250006715
- Publication date Jan 2, 2025
- LG Innotek Co., Ltd.
- Byung Hyun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A R...
- Publication number 20240429177
- Publication date Dec 26, 2024
- INFINEON TECHNOLOGIES AG
- Simon KORNPROBST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240429116
- Publication date Dec 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Seoung Joon HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module and Method for Assembling a Power Module
- Publication number 20240429121
- Publication date Dec 26, 2024
- ZF Friedrichshafen AG
- Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE COMPRISING AT LEAST ONE POWER SEMICONDUCTOR, AND...
- Publication number 20240429124
- Publication date Dec 26, 2024
- ROBERT BOSCH GmbH
- Arne Stephen Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED I/O SEMICONDUCTOR CHIP PACKAGE AND COOLING ASSEMBLY HAVING...
- Publication number 20240421025
- Publication date Dec 19, 2024
- Intel Corporation
- Lianchang DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING
- Publication number 20240421027
- Publication date Dec 19, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLER AND SEMICONDUCTOR MODULE
- Publication number 20240421028
- Publication date Dec 19, 2024
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Converter, Package Structure, and Heat Dissipation Structure
- Publication number 20240421100
- Publication date Dec 19, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Xingzhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240421026
- Publication date Dec 19, 2024
- Siliconware Precision Industries Co., Ltd.
- Chiu-Ling CHEN
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the shape of the housing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Adaptive structure for thermal regulation and optimization

Systems and methods for low inductance phase switch for inverter fo...

Systems and methods for adaptive gate driver for inverter for elect...

Venturi-effect heat-transfer device

Electronic device

Package structure for heat dissipation

Systems and methods for integrated gate driver for inverter for ele...

Integration of power and optics through cold plates for delivery to...

Semiconductor device assemblies including monolithic silicon struct...

Microelectronic package with solder array thermal interface materia...

Multi-die package structures including redistribution layers

Systems and methods for non-overlap enforcement for inverter for el...

Packaging stacked substrates and an integrated circuit die using a...

Interposer structure containing embedded silicon-less link chiplet

Electronic packages with integral heat spreaders

Semiconductor package and manufacturing method thereof

Integrated circuit packages and methods of forming the same

Crystal, semiconductor element and semiconductor device

Circuit board module

Semiconductor package with dummy MIM capacitor die

Semiconductor device

Semiconductor device with enhanced thermal dissipation and method f...

Systems and methods for single channel fault encoding for inverter...

Heat extraction path from a laser die using a highly conductive the...

Thermally conductive sheet and method of manufacturing semiconducto...

Semiconductor module, method for manufacturing same, and semiconduc...

Insulating substrate and power module using the same

Passive thermal-control system of an electronic speaker device and...

Method of fabricating package structure

Semiconductor package

Patents Applicationslast 30 patents

PACKAGE STRUCTURE HAVING DAM STRUCTURE

SYSTEMS AND METHODS FOR PHASE SWITCH TIMING CONTROLLER FOR INVERTER...

ELECTRONIC PACKAGE AND HEAT DISSIPATION STRUCTURE THEREOF

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

SEMICONDUCTOR MODULE

CHIP PACKAGING STRUCTURE, SEMICONDUCTOR STRUCTURE, AND FABRICATING...

POWER SEMICONDUCTOR INTEGRATED UNIT AND POWER CONVERTER CIRCUIT STR...

POWER SUPPLY MODULE

Liquid Metal Packaging Structure For Chip Heat Dissipation

RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK

ELECTRONIC CIRCUIT APPARATUS AND CIRCUIT-INTEGRATED MOTOR

MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE AND METHOD OF MAKING

CHIP-ON-FILM PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

ISOLATION AND PROTECTION OF COMPUTING COMPONENTS FROM LIQUID IMMERS...

SEMICONDUCTOR PACKAGE WITH DIRECTIONAL LOCKING STRUCTURE

REMOVING CONDUCTIVE MATERIAL FROM A PEDESTAL OF A SEMICONDUCTOR LID...

METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS L...

INVERTER HAVING SEAL MEMBER BETWEEN POWER SEMI-CONDUCTOR AND INVERT...

SIP MODULE

RADIO FREQUENCY SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A R...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

Power Module and Method for Assembling a Power Module

ELECTRONIC MODULE COMPRISING AT LEAST ONE POWER SEMICONDUCTOR, AND...

ENHANCED I/O SEMICONDUCTOR CHIP PACKAGE AND COOLING ASSEMBLY HAVING...

SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING

COOLER AND SEMICONDUCTOR MODULE

Power Converter, Package Structure, and Heat Dissipation Structure

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF